JPS6182584U - - Google Patents
Info
- Publication number
- JPS6182584U JPS6182584U JP16760784U JP16760784U JPS6182584U JP S6182584 U JPS6182584 U JP S6182584U JP 16760784 U JP16760784 U JP 16760784U JP 16760784 U JP16760784 U JP 16760784U JP S6182584 U JPS6182584 U JP S6182584U
- Authority
- JP
- Japan
- Prior art keywords
- drum
- holes
- rotating
- air
- carried out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005406 washing Methods 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims 1
- 238000006297 dehydration reaction Methods 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16760784U JPS6182584U (da) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16760784U JPS6182584U (da) | 1984-11-05 | 1984-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6182584U true JPS6182584U (da) | 1986-05-31 |
Family
ID=30725396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16760784U Pending JPS6182584U (da) | 1984-11-05 | 1984-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182584U (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11770904B2 (en) | 2019-02-04 | 2023-09-26 | Panasonic Intellectual Property Management Co., Ltd. | Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same |
-
1984
- 1984-11-05 JP JP16760784U patent/JPS6182584U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11770904B2 (en) | 2019-02-04 | 2023-09-26 | Panasonic Intellectual Property Management Co., Ltd. | Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same |