JPS6182288U - - Google Patents
Info
- Publication number
- JPS6182288U JPS6182288U JP16894584U JP16894584U JPS6182288U JP S6182288 U JPS6182288 U JP S6182288U JP 16894584 U JP16894584 U JP 16894584U JP 16894584 U JP16894584 U JP 16894584U JP S6182288 U JPS6182288 U JP S6182288U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- chamber
- low
- baths
- sample containers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第1図はこの考案による温度サイクル試験装置
の一実施例を示す構成図、第2図及び第3図は従
来の温度サイクル試験装置の各例を示す構成図で
ある。
11…試料容器、12…低温槽、13…高温槽
、14…自動戸、15…搬送装置。なお、図中同
一符号は同一又は相当部分を示す。
FIG. 1 is a block diagram showing an embodiment of a temperature cycle test apparatus according to this invention, and FIGS. 2 and 3 are block diagrams showing each example of a conventional temperature cycle test apparatus. 11...Sample container, 12...Low temperature chamber, 13...High temperature bath, 14...Automatic door, 15...Transfer device. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
所要の温度環境で試験をする低温槽と高温槽、及
びこれらの各槽の下方に配設されてあり、被試験
の試料を入れた試料容器を順次載せて所定時間ご
とに間欠送りし、各試料容器を上記各低温槽内と
各高温槽内に交互に入れて行き、所定の温度サイ
クルを経て搬出する搬出装置を備えた温度サイク
ル試験装置。 Both have multiple addresses and are arranged alternately,
A low-temperature chamber and a high-temperature chamber are installed to conduct tests in the required temperature environment, and sample containers containing the sample to be tested are sequentially placed on the chamber and transported intermittently at predetermined intervals. A temperature cycle test device comprising a carry-out device that alternately places sample containers into each of the low-temperature baths and high-temperature baths and carries them out after undergoing a predetermined temperature cycle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16894584U JPS6182288U (en) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16894584U JPS6182288U (en) | 1984-11-05 | 1984-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6182288U true JPS6182288U (en) | 1986-05-31 |
Family
ID=30726704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16894584U Pending JPS6182288U (en) | 1984-11-05 | 1984-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6182288U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007120986A (en) * | 2005-10-25 | 2007-05-17 | Daishinku Corp | Temperature testing device of piezoelectric oscillation device |
JP2014139586A (en) * | 2014-04-23 | 2014-07-31 | Risoh Kesoku Kk Ltd | Thermal shock test device |
-
1984
- 1984-11-05 JP JP16894584U patent/JPS6182288U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007120986A (en) * | 2005-10-25 | 2007-05-17 | Daishinku Corp | Temperature testing device of piezoelectric oscillation device |
JP2014139586A (en) * | 2014-04-23 | 2014-07-31 | Risoh Kesoku Kk Ltd | Thermal shock test device |
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