JPS617735B2 - - Google Patents

Info

Publication number
JPS617735B2
JPS617735B2 JP495180A JP495180A JPS617735B2 JP S617735 B2 JPS617735 B2 JP S617735B2 JP 495180 A JP495180 A JP 495180A JP 495180 A JP495180 A JP 495180A JP S617735 B2 JPS617735 B2 JP S617735B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP495180A
Other languages
Japanese (ja)
Other versions
JPS56101752A (en
Inventor
Kazuo Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP495180A priority Critical patent/JPS56101752A/en
Publication of JPS56101752A publication Critical patent/JPS56101752A/en
Publication of JPS617735B2 publication Critical patent/JPS617735B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP495180A 1980-01-18 1980-01-18 Semiconductor device Granted JPS56101752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP495180A JPS56101752A (en) 1980-01-18 1980-01-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP495180A JPS56101752A (en) 1980-01-18 1980-01-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56101752A JPS56101752A (en) 1981-08-14
JPS617735B2 true JPS617735B2 (en) 1986-03-08

Family

ID=11597874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP495180A Granted JPS56101752A (en) 1980-01-18 1980-01-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56101752A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011115887A1 (en) 2011-10-15 2013-04-18 Danfoss Silicon Power Gmbh Power semiconductor chip with top potential surfaces
DE102011115886B4 (en) 2011-10-15 2020-06-18 Danfoss Silicon Power Gmbh Method for creating a connection of a power semiconductor chip with top potential surfaces to form thick wires
DE102015113421B4 (en) 2015-08-14 2019-02-21 Danfoss Silicon Power Gmbh Method for producing semiconductor chips

Also Published As

Publication number Publication date
JPS56101752A (en) 1981-08-14

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