JPS61766A - Wiring testing method and apparatus for circuit substrate - Google Patents

Abstract

PURPOSE:To perform a highly reliable wiring test eliminating the manufacture of mask plates for individual substrates, by selecting information position on an array lattice of a measuring probe from N/C boring information for a circuit board to turn ON a switch corresponding thereto. CONSTITUTION:A circuit board 20 to be inspected is positioned and mounted on a support 10 having a measuring probe 11 arrayed in a lattice through a pilot pin 12. Coordinates 6 of boring information with Z1 as origin are inputted into a calculating section 3 through an information reading mechanism 4 to determine coordinates of those for boring with respect to a probe array lattice by coordinate conversion from origin movements DELTAX and DELTAY between the origins Z2 and Z1 of the array lattice of the measuring probe 11 inputted from a keyboard section 5 and additionally, the results are converted into address for a switch group 1. The switch alone corresponding to the specified address from the switch group 1 is turned ON through a control section 2 to perform a wiring test with a measuring section 40. This eliminates the manufacture of mask plates for individual substrates thereby enabling a highly reliable wiring test.

Description

[Detailed description of the invention] (Technical field) The present invention relates to circuit disconnection in a circuit board pattern.

The present invention relates to a wiring test method and apparatus for electrically testing inter-circuit bridges.

(Prior art) Conventionally, this type of wiring test has used a wiring test device that has a group of measurement probes arranged in a grid pattern at a constant pitch on a measurement probe support plate. During the wiring test, an insulating plate having a hole through which the measurement probe passes is interposed only at the part of the circuit board to be tested that needs to be inspected, and the necessary measurement probe is selected.

Figure 1 shows an example of the conventional method, published in Japanese Unexamined Patent Publication No. 53-6879.
This was disclosed in the No. The measurement probes 11 are arranged in a grid pattern at a constant pitch on an insulating measurement probe support plate lO, and the pitch is usually 2.54 mm, 12 mm, according to the design standard of the circuit board to be inspected.
A pitch such as 7 mm is adopted. Between the circuit board to be tested (hereinafter referred to as the board) 20 and the measurement probe support plate (hereinafter referred to as the support plate) 1°, there are through holes 21 that serve as inspection points in the plate trap board 20 made of an insulating material such as glass epoxy resin. Interpose a mask plate 3 (l) with trap holes at corresponding positions.In order to perform a wiring test on the board 2o in this state, the board 2o
and a mask plate 3o respectively facing the plate surface of the support plate 10, and a grating and a substrate 2o on which the measurement probe 11 is arranged.
Design grid of through holes 21 and mask plate) 30
Both guide holes 20a, 30a of the substrate 2o and mask plate 30 are installed on the pilot bottle 12, which is set up on the support plate lo, so that the design grids of the relief holes 31 are horizontal to each other and the lattices are equally spaced. Fit, position and install. Next, when the substrate 2o and the support plate 1o are pressed by a known pressure means and brought close to each other, the measurement probe 11 penetrates through the relief hole 31 of the mask plate 30, and protrudes from the substrate 2o.
It comes into contact with the through hole 21 at the location where inspection is required. Therefore, the measurement probe 1 becomes electrically testable.
A wiring test is performed only on the portions that require inspection using a measuring section 40 of a wiring testing machine connected to the lower end of the wiring board 1 via wiring (not shown). In such a conventional wiring test method, (a) it is necessary to manufacture a mask plate with holes drilled to match the putter 7 for each different pattern of the board;

Therefore, the production cost was high and preparation time was also required.

(b) Since the mask plate is usually manufactured using the N/C hole drilling information of the board, holes may be drilled in locations that are outside the array grid of the measurement probes, which is likely to cause false detection. .

(c) Also, since the mask plate is usually made of a thin insulating plate, it has poor durability, and if used for a long time, the positioning accuracy will deteriorate and the measurement probe will not be able to correctly penetrate the hole in the mask blend. Poor contact occurred between the probe and the through-hole of the board, reducing the reliability of wiring tests.

(Objective) An object of the present invention is to provide a wiring testing method for a board and an apparatus therefor which solves the conventional drawbacks.

(Structure) According to the present invention, there is a step of inputting N/C drilling information of a circuit board, moving the information by a predetermined amount of movement, and using the moved information as a layout grid for measuring probes of a wiring tester. A step of selecting only the information located above and converting it into the address of the switch corresponding to the measurement float placed between the measurement probe and the wiring tester, and turning ON only the switch corresponding to the above address. an information reading mechanism for reading N/C drilling information on a circuit board; a calculating section connected to the information reading mechanism and having a keyboard input section; and a circuit board to be tested. The controller is installed between the measurement probe that contacts the measurement section of the wiring tester and the measurement section of the wiring tester, and is connected to the calculation section.
There is obtained a circuit board wiring testing device characterized in that it has a switch group corresponding to the measurement probe that is turned on and off.

(Example) Examples of the present invention are shown in FIGS. 2 and 3(a) below.

(bl　,　(Explained with reference to C1.

In FIG. 2, similarly to the conventional example, the measurement probe 11 is placed on an insulating support plate 10 with a distance of 2.54 mm and 1.2 mm.
The substrate 20 is arranged in a grid pattern with a constant bit size of 7 mm, etc., and the substrate 20 is arranged on the support plate 1o so that the design grid of the through holes 21 and the yellow grid of the measurement probe 11 are in a horizontal state and coincide with each other at equal intervals. Pilot Pino 1 planted on one side
2 to the substrate 20. Both guide holes 2oa of mask plate 30
, 3oat fit and are positioned and mounted on the support plate 10. Next, the switch group 1 is usually composed of semiconductor switches, and is connected to the measuring section 40 of the wiring tester and one end of the measuring probe 11. A switch corresponding to the number of measurement probes 11 is connected to the middle of the wiring (not shown) to be connected, corresponding to each measurement probe 11, and has an address designated by an instruction from the control unit 2, which is constituted by a logic circuit such as an address decoder. O
By turning N/OFF, the connection between the measuring probe 11 at the designated position and the measuring circuit (usually composed of a semiconductor switch) of the corresponding measuring section 40 can be controlled.

The calculation unit 3 composed of a micro core computer etc. receives information from the board 20 in XX coordinate format input through the information reading mechanism 4t.
It has a function of calculating the N/C drilling information 6 from the parameters inputted in advance from the keyboard section 5, converting it into an address of the switch group 1, and sending it to the control section 2.

Next, the operating steps of the wiring test according to the present invention will be explained with reference to FIGS. 3(a) and 3(c).

FIG. 3 (bl is an explanatory diagram showing the relationship between the outline A of the substrate 20 in FIG. 2 and the arrangement grid B of the measurement probe 11, and coordinate points P1 to P are reference points provided outside the substrate 20. N/ of the XX coordinate value format (mm unit) of the board 20 with z1 as the origin
This is the C drilling information, which shows part 7 of the N/C drilling information 6 in FIG.

ΔX and ΔY are the distances in the X and Y directions, respectively, between the origin Z1 of the N/C drilling information described above and the origin Z2 of the arrangement grid B of the measurement probe 11, and are used to position the substrate 20 on the support plate 10. It is a value that is uniquely determined.

According to the flowchart of FIG. 3(a), first, the above-mentioned origin movement amount ΔX ΔYt--the N/C drilling information 6 of the board 20 read by the information reading mechanism 4 from the keyboard section 5
For example, when the calculation unit 3 moves the origin to the X coordinate and the
The coordinate points P1 to P5 of the drilling information are the origin Z2 of the arrangement grid B
is converted into information with the origin as the origin. Next, the calculation unit 3 converts the above-mentioned origin-shifted information into the X and Y coordinates and the arrangement grid pitch of the measurement probe 11 (usually Z54 mm, etc.).
If we select only those that are divisible by dividing by
l, Yo) is transformed into a grid coordinate system like PI(2,2). Furthermore, since each grid point of the layout grid B has a one-to-one correspondence with the address of the switch group 1, the drilling information converted to the grid coordinate system is sent to the calculation unit 3 by the calculation unit 3 of the switch group 1.
Convert to address. For example, this conversion is performed by switch group l
If the addresses are consecutive, they can be calculated and converted using a calculation formula, and if they are intermittent, a correspondence table can be stored in advance in the storage unit (not shown) of the calculation unit 3, and the conversion can be performed by referring to the correspondence table. . The following FIG. 3(C) is an explanatory diagram showing that the coordinate points P□ to P5 of the N/C drilling information in FIG. 3(b) have been converted to addresses a□ to a5 of switch group 1. . The information converted into the address of the switch group 1 is sent from the calculation section 3 to the control section 2, and only the specified address in the switch group 1 is turned on. Note that for the terminal section 22 of the board 20, the address of the switch corresponding to the measurement probe llK at the position where it contacts the terminal section 22 is set in advance in switch group 1 (because the terminal section usually does not have N/C hole drilling information). All you have to do is select one from among them, input it directly from the keyboard section 5, and turn on the above switch.

For example, addresses b1 to b6 shown in FIG. 3 (C1) indicate the addresses of the switches corresponding to the terminal section 22.

By the above operation, only the switches corresponding to the measurement probes 11 that should come into contact with the positions of the through holes 21 and the positions of the terminals 22 when the board 20 is positioned on the support plate 10 are turned on. This is equivalent to forming the support plate 10 corresponding only to the portions of the substrate 20 that require inspection when viewed from the measurement unit 40, and the same effect as in the case where the mask plate 30 is interposed as in the conventional example is brought about. Therefore, from now on, the board 20 is positioned and mounted on the support plate 10 in the same way as in the conventional example, and the measuring probe 11 and the part of the board 20 that need to be inspected are pressed and brought into contact with each other using a known pressure means, and the measurement part 40 is used to check only the part that needs to be inspected. Can perform wiring tests.

In this embodiment, the switch group 1 is installed independently of the measuring section 40, but normally the measuring section 40 is composed of semiconductor switches that apply voltage to the board, but depending on the switch model, it may be turned on or off. Some models allow you to specify whether /OFF control is enabled or disabled.

In this case, if the control section 2 and the measurement section 40 are connected so that the instruction signal from the control section 2 is used to designate whether these are enabled or disabled, it is possible to enable only the switch of the measurement section 40 corresponding to the location that requires inspection. , the switch group 1 can also be omitted.

(Effects) As described above, by using the wiring testing method and apparatus of the present invention, (a) there is no need to manufacture mask plates for each individual substrate as in the past. Therefore, the man-hours for manufacturing and replacing mask plates can be omitted.

(b) Since the selection of the parts of the board that require inspection is done entirely based on input information, there is no contact failure due to misalignment of the mask plate.

(c) Since only the input information on the probe array grid is selected through calculation processing by a computer or the like, this detection is also eliminated and a highly reliable wiring test can be performed.

There are other effects.

[Brief explanation of the drawing]

FIG. 1 is a perspective view illustrating a conventional wiring test method and its apparatus, FIG. 2 is a perspective view and block diagram illustrating the present invention's wiring test method and apparatus, and FIG. 3(a),
(bl, (C) is a flowchart diagram and an explanatory diagram illustrating the operation process of the wiring test method of the present invention. In the figure, 1... switch group, 2... control section, 3
...Calculation unit, 4...Information reading mechanism,
5...Keyboard part, 6...N/C drilling information, 10...(Measurement probe) support plate, 1
1...Measurement probe, 12...Pilot bin, 20...(Test circuit) board, 21
...Through hole, 22...Terminal part, 3
0...Mask plate, 31...Escape hole, 40...Wiring test machine measurement section. Agent: Susumu Uchihara, patent attorney

Claims (2)

[Claims] (1) In a circuit board wiring test method using a wiring tester having a structure in which a plurality of measurement probes are arranged on a grid at a predetermined pitch on an insulating support plate, the N/C of the circuit board is
A step of inputting drilling information and moving the drilling information by a predetermined movement amount, selecting only information located on the arrangement grid of the measurement probe from the drilling information, and performing a wiring test with the measurement probe. A wiring test method for a circuit board, comprising the steps of: converting the address of a switch corresponding to a measurement probe disposed between the device and the device; and turning ON only the switch corresponding to the address. . (2) An information reading mechanism that reads N/C drilling information on a circuit board, a calculation unit that has a keyboard input unit connected to the information reading mechanism, a measurement probe that comes into contact with the part to be inspected on the circuit board, and a wiring test. 1. A circuit board wiring testing device, comprising: a group of switches corresponding to the measurement probes, which are provided between the machine measurement section and are individually turned on/off by a control section connected to the calculation section.