JPS6176655A - Stainless steel wire body for forming - Google Patents

Abstract

PURPOSE:To obtain the titled stainless steel wire body for forming having excellent formability and lubricity by coating the surface with a solder-plated layer having a smooth surface formed by drawing. CONSTITUTION:A stainless steel wire 2 supplied from a stand 1 is activated in a pretreating vessel 3, and immediately sent to a molten solder furnace 4. In the furnace 4, the steel wire 2 is inserted into throttle dice 80 and 90 on the inlet and outlet sides of a molten solder vessel 71, and dipped in molten solder 10 whose liq. surface is kept higher than the dice 80 and 90. The steel wire 2 thus introduced into the vessel 71 is moved almost horizontally, passed through the inside of the solder 10, extruded through the die 90, and cooled with water in a water cooler 5 to control the oxidation of the surface. A plated layer 22 having excellent surface conditions can be obtained in this way. By wiredrawing the steel wire 2 whose surface is already coated directly with solder in this way, the desired steel wire body can be obtained.

Description

[Detailed Description of the Invention] (Industrial Application) The present invention relates to a long steel bar made of J1 steel for forming process with excellent formability J3 and a'8 lubricity. Guaru.

(Prior art) In general, stainless steel has better corrosion resistance than electric wire or copper wire, but its workability and semi-IJJ properties are inferior. The chlorine in the ingredients creates a strong passive film on the surface.
It may seem silly, but this immovable attitude n9 is the best
] This is a major obstacle when trying to attach the item.

This passive film can be removed using JM M''5, but it is only temporary, and the passive film is immediately regenerated when the surface comes into contact with air. Conventionally, it was extremely difficult to apply solder plating directly to the surface of stainless steel.To apply solder plating to stainless steel, gold, palladium, nickel,
For soldering copper or the like, a method has been proposed in which a metal with good properties is first plated by electroplating, but this method has the disadvantage that the plating process is time-consuming. - Also, regarding the workability of stainless steel, for example, in the case of wire drawing, it is customary to use resin coating to act as a lubricating film, while for spring forming, etc., nickel plating is used. Generally, these processes are avoided by applying a resin coating. Even with these resin-coated or nickel-plated products, they were still insufficient for JSV smooth skin n-crossing during tertiary processing. Stainless steel wire is also in demand for various electronic parts, but its half-length JJ wire is not fully utilized due to its poor quality. No. This half EJJ
IN] Stainless steel with some of the goldstone components changed and a thin layer of negative metal plating applied to improve its corrosion resistance! tl
t) Although it has been proposed, these 6 have drawbacks such as requiring a part of the 1IrJ corrosion resistance to be increased by +1611 or increasing the cost.

(1/1 object of the invention) This invention was made to eliminate such conventional drawbacks, and the durability of stainless steel is 1! I! Sex is a sacrifice! The present invention provides a stainless steel bar body for molding which has good moldability and solderability.

(1. IIS construction of the invention) In the present invention, the surface of a stainless steel bar body is coated with a semi-111 thick layer having a smooth surface formed by drawing process.

(Example) At a3 in FIG. 1, the stainless steel wire 2 supplied from the reply stand 1 is subjected to activation treatment in the pretreatment tank 3. The activated stainless steel IH wire 2 is immediately sent to a melting solder furnace 4.

The molten solder furnace 4 includes a molten plating tank 71, an inlet drawing die 80 provided on the side wall thereof, an outlet drawing die 90, and a water cooling device 5 arranged on the exit side via a heat insulating layer 15.
I am doing a. , surface treatment 11 sent from 3 [
The stainless steel wire 2 is inserted into dies 80 on both sides of the hot-dip plating bath 71.
．． 90 and then lowering the liquid level adjustment block 72 into the molten solder 10, the melt amount ITJ is adjusted.
The liquid level of 10 was raised to a level higher than the die 80 + '90, and the stainless steel wire 2 was melted in the melted amount Ill 10.
1δ. An antioxidant layer 20 is formed on the surface of the melted amount 1'110. In this state, as shown by the arrow in FIG. 2, the stainless steel wire 2 introduced into the hot-dip plating bath 71 from the right side through one die ε30 is moved in an almost horizontal direction and passed through the molten solder 10. revenge,
(through the other die 90). In other words, stainless steel T5A2 is an antioxidant! i? It is introduced into the molten solder 10 without passing through the i20.

When the stainless steel wire 2 is derived from RγFA41 plating (n71), the plating layer 22 on the stainless steel FJ2 is hardened.In this case, the plating E:j 22 is hardened by natural cooling etc. However, in particular, if water cooling is applied directly to the plating using the water cooling system 115, oxidation of the surface of the plating layer 22 at J3 will be suppressed, and the surface condition will be -
h? Improved by 1.

The structure of the soldering furnace for d3 and melting 8 is limited to the above.
For example, it is possible to create a structure as shown in Figure 3 or Figure 4.
I Il'l die E30 is attached to the bottom part,
This is done so that the stainless steel wire 2 is pulled upward. Also, in Figure 4, +;LS
One end of a guide member 75 is inserted into the melt r+D semi-Ill 10 from above, and an inlet throttle gas ε30 is installed in this guide member 75. A feed inlet for 76 is formed to draw the stainless steel ``fA 2'' into the molten volume Il+ 10 by means of a thin roller flow 7. - In any of the above cases, the stainless copper wire 2 directly enters the molten solder 10 without passing through the antioxidant layer 20 on the bath surface.

The reason for using the above method is that solder plating cannot be performed using the conventional so-called dip method.

That is, in the conventional method, the wire enters the molten solder bath from above through a guide roller, passes through a sinker roller in the bath, and is pulled upward, but in this case, the wire is exposed to the oxide image 11' on the upper surface of the bath. Even if the surface of the wire is activated to pass through the oxidation-preventing oil layer and enter the molten solder bath, the activation state (iQ) will be inhibited and half-[■ plating will not be performed. There will be no.

On the other hand, according to the method of manufacturing this starting product, the wire rod with a viscous surface does not pass through the bath surface, but directly reaches the melting amount [fl], so that it can reach a good half-lt1. will be done.

Example stainless steel wire 2: 5US304, diameter 1°80n
37Pb-638n eutectic "1':II" at 280°C after activation treatment in pretreatment tank 3.
I to l, c8 melt, ifi 'VIII introduced into the bath. As shown in FIG. 5, the polished stainless steel gland 2 has a P7-sized l'-10 plating layer 22 with a diameter of approximately 15 μm on its outer surface.
It is evenly distributed in the circumferential direction, and is arranged in a uniform manner in each direction. In this way, the surfaces of the stainless steel wires 17 and 11 were made lubricant, and the wires had good workability.

Save this and use the dry auxiliary lubrication moon on the 11'1 2 continuous offshore line, and use the 8 dice with jij L! 2 speed 300m/
Minutes (diameter 0.80mm It is common to draw wire using 112, dry auxiliary ?A lubricant, and in this case, 20Q
If you operate at high speeds (m/separation), there is a risk of rough dice.
There was 1, but it was the one with half 1 ■ plating as described above.
．． 1. Such <r trouble does not occur. Furthermore, the stainless steel wire drawn in this way has a surface of 1D°1
Since it has good lubricity, it can be used as is as a stainless steel wire for tertiary processing such as spring forming.

Next, we will discuss the reason why solder-plated stainless steel wire has excellent formability during the spring forming process. For molding, the shape of the crotch should be constant and the variation should be small, and the shape of the crotch should be constant and the variation after processing should be high. 91-7 surface (n
It is required that there are no defects such as: In order to meet these requirements, it is necessary for the W-V surface to be smooth, but since this product is drawn after solder plating, it has sufficient smoothness and can meet these requirements. You can skip contentment. Another requirement is how the film on the surface of the soy X1 can have an anti-friction effect during high pressure loading during high-speed plastic working. In this respect as well, the solder plating layer of the present invention shows that the solder itself is superior in lubricity compared to conventionally used resin films and nickel plating films. The reason for this is that the low melting point alloy tQJ3 and tin play the role of microscopic fluid lubrication between the surfaces of the wire and the tool during forming.

The first person said that uniform processing is difficult during spring forming processing.
Regarding the D/d (spring diameter/spring @ wire diameter) which is said to be difficult to push, the half [fl plated stainless steel 10
An example is shown in which the line is 1 Higashikawa and the forming process is performed.

J3, comparison month i1 and C conventional product drawing process second half I
II plated stainless steel wire, nickel plated stainless steel J3 and Yu (grease coated stainless steel 1
N line was used. The molded spring has a D/d of 26.
5. Free length is 155 mnl, = number of turns per il is 22y2
Therefore, M was determined for 100 of these flies.

As is clear from Table 1, the free length of the spring after the spring forming process, J3, J: and the weight of the spring 1111.1 are all compared. ! The spring using 1 was found to be 11. The cause of these variations is the variation in the wire diameter on the surface of the wire A7 and the change in the coefficient of the wire A7 and the spring forming coefficient, ■1.1 Due to the abrasion of
In the product of the present invention, half)
Since the material itself has 9 + l IM variation, and the surface is smooth, J3 Yohihan 1 [1 Metsusa h' and ri itself is used as a lubricant during machining. It can be seen that this is highly effective in reducing these variations.

77, Stainless steel spring wire is widely used for electronic parts, and this spring wire is half 10) 4L.
-J To's one thing is that it is essential for tea soup. However, stainless steel is originally semi-[(1)
[4Vj material] Therefore, there was a problem that the corrosion resistance and bonding properties of 10 could not be fully utilized. In this invention, since the half plate 14 is plated in advance with good adhesion, it is clear that the soldering resistance is good, and from this point of view it can be said to be an excellent material.

(Effects of the Invention) As explained above, the present invention is capable of forming a solder plating layer with a smooth surface by directly coating the surface of a stainless fH bar body with solder and then applying curve processing. It has good formability and semi-solid bonding properties without sacrificing the corrosion resistance inherent in stainless steel.

[Brief explanation of the drawing]

Fig. 1 is a schematic explanatory diagram of an apparatus for manufacturing the product of the present invention, Fig. 2 is a sectional view of a melting semi-ID gas 1, and Figs. Figure 5 is a 1000x microscopic photograph of the cross-sectional metal structure of the product of the present invention. 2... Stainless steel wire, 4... Melting soldering furnace, 5...
・Water cooling device, 22... Plating layer, 71... Melting and joining tank, 80.90... Drawing die. Patent applicant: Shinko Wire Industry Co., Ltd. 1-・-4
・4.・ ′・,′-21゛Figure 3 to Figure 4 Figure 5 Procedural Amendment to Figure 5 (Voluntary) First day of January 1982

Claims (1)

[Claims] 1. A stainless steel bar body for forming processing, characterized in that the surface of the stainless steel bar body is coated with a solder plating layer having a smooth surface formed by drawing processing.