JPS6175130U - - Google Patents
Info
- Publication number
- JPS6175130U JPS6175130U JP15958084U JP15958084U JPS6175130U JP S6175130 U JPS6175130 U JP S6175130U JP 15958084 U JP15958084 U JP 15958084U JP 15958084 U JP15958084 U JP 15958084U JP S6175130 U JPS6175130 U JP S6175130U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- metal wire
- thin metal
- semiconductor pellet
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15958084U JPS6175130U (US06818201-20041116-C00086.png) | 1984-10-22 | 1984-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15958084U JPS6175130U (US06818201-20041116-C00086.png) | 1984-10-22 | 1984-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6175130U true JPS6175130U (US06818201-20041116-C00086.png) | 1986-05-21 |
Family
ID=30717532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15958084U Pending JPS6175130U (US06818201-20041116-C00086.png) | 1984-10-22 | 1984-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6175130U (US06818201-20041116-C00086.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599754A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Lead frame |
-
1984
- 1984-10-22 JP JP15958084U patent/JPS6175130U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5599754A (en) * | 1979-01-26 | 1980-07-30 | Hitachi Ltd | Lead frame |
