JPS6174392A - Method of inserting electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a printed circuit board (hereinafter referred to as "printed circuit board") constituting an electronic circuit.
This invention relates to a method for inserting leaded electronic components such as resistors and capacitors into an electronic circuit board (referred to as an "electronic circuit board") by guiding them between lead wire holders arranged on the bottom surface of an electronic circuit board.

The structure of the conventional example and its problems 1U The conventional insertion method of this type is shown in Figs. 1 (a to d) and Fig. 2.
The insertion work was performed in the following order.

This insertion device has a lead wire of an electronic component 1, a lead wire guide pin 4 having a concave hole at its tip to receive the lead wire, and a semi-conical concave surface on the opposing surface, and can be opened and closed in two. It is composed of a guide chirek 2゜2' (details are shown in Fig. 2), an electronic circuit board 3, and a lead wire guide pin 4. In order to match the lead wire of the electronic component 1 with the concave hole of the lead wire guide pin 4, these are first arranged as shown in FIG. 1a.

Subsequently, the electronic component 1 descends, and its lead wire enters the guide hole between the guide chucks 2 and 2', and the lead wire guide pin 4 rises and passes through the lead wire insertion hole 6 of the electronic circuit board 3. It enters the guide hole of the guide chuck 2 and is aligned with the lead wire of the electronic component 1 (FIG. 1b).

The guide chuck 2 moves from the state shown in Fig. 1, the electronic component 1 is held down by the pusher 5, and the lead wire is guided by the guide pin 4 and inserted into the lead wire insertion hole 6 (Fig. 1 G). ).

At 51 m, the guide pin 4 descends and comes out of the lead wire (Fig. 1d).

In the method consisting of the above configuration and steps, the lead wire of the electronic component 1 and the lead wire guide pin 4 are butted against each other, so that the pusher 5 from above is required when inserting the lead wire.

On the other hand, in recent electronic circuit boards, due to the high functionality and high integration of electronic circuits, there is a demand for increasingly smaller parts and high-density multi-insertion.

Therefore, in such a configuration, as shown in FIG. 3, depending on the size and shape of the electronic component, "hitting" may occur with adjacent electronic components, depending on the size of the button 5. It is necessary to arrange the electronic components while maintaining a distance P that will not be affected, and there is still a problem in terms of high-density actual insertion.

OBJECTS OF THE INVENTION An object of the present invention is to eliminate the above-mentioned conventional drawbacks and to provide a method for inserting electronic components into an electronic circuit board with high density.

Structure of the Invention The present invention provides a lead wire holder having a pair of guide pins and recesses into which the lead wires can be inserted on opposite sides of the tip of the guide pins, which is disposed below an electronic circuit board. , the lead wire holder is raised to pass the guide pin through the lead wire insertion hole, and the lead wire of the electronic component, which is supplied on the electronic circuit board and has elasticity and has been spread outward in advance, is inserted into the recess. Since the holder is lowered while being inserted and held, reliable insertion work is possible.Moreover, there is no need for a pusher from above, so it can be inserted anywhere there is a gap between the inserted parts, making it suitable for high-density actual insertion. This is extremely advantageous.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 to 5.

In FIG. 4, an electronic component 8 transferred from an electronic component supply section (not shown) by an openable/closeable transfer chuck 7, 7' is transferred to a lead wire 9 at a station (not shown) on the way. , 9' are pressed outward and molded to come to the A position.

Below the electronic circuit board 10, a pair of guide pins 11,
11', and recesses 12, 12 into which lead wires can be inserted on opposite sides of the tip of the guide pin 11.11'.
A lead wire holder 13 with a ' is on standby. Raise the lead wire holder 13 and attach the guide pin 11. -11' is passed through the lead insertion hole 17.17', and the guide 14.
It fits into the lower groove 15.15' and is aligned.

The tip of the guide pin 11.11' is tapered 18.18
' to improve penetration into the insertion hole.

Next, the electronic component 8 in the A position is transferred to the transfer chuck 7.
．． It descends while being held by lead FA9.7'.
9' is the guide 14. The inclined surface 16°16' of 14'
along the guide pin 11.11' into the recess 12.12'. The inserted electronic component 8 is in the B state, and the elastic restoring force of the lead wires 9 and 9' sufficiently pushes the guide pin 1.
1.11'. Electronic component 8 is guide pin 1
1.11', lower the lead wire 9.
9' is the insertion hole 17 and 17' of the electronic circuit board 10 as it is.
inserted into. The insertion direction is the guides 13, 13',
Needless to say, the transfer can be carried out freely by rotating the transfer chuck 7, 7' and the lead wire holder 13.

FIG. 5 specifically shows each step of the embodiment shown in FIG. 4.

FIG. 5a shows the guide 14.14' and the electronic circuit board 10.
, showing the initial positional relationship of the guide pins 11.11'.

Figure 5 shows the electronic component 8 brought to the A position by the transfer chuck 7.7' and the guide pin 11.1.
1' rises to insert the insertion hole 17.17' of the electronic circuit board 1o.
The lower groove 15°15' of the guide 14.14' passes through the guide 14.14'.
This shows the mated state.

FIG. 5C shows that the chucked electronic component 8 is lowered from the state shown in FIG.
along the slope 16.16' of the guide pin ii,
1i' is shown inserted into the recess 12.12' at the tip.

FIG. 5d shows the chuck 7.7' and the guide 14.14' in the open and escaped state.

FIG. 5e shows that the lead wire 9.9' of the electronic component 8 is held by the guide pin 11.11' by the elasticity of the lead wire 9.9' and is lowered together with the guide pin 11.11'. ' is inserted into the insertion hole 17°11' of the electronic circuit board 1o.

Effects of the Invention As described above, the present invention utilizes the elasticity of the lead wires of electronic components by using a holder that has recesses into which lead wires can be inserted on opposite sides of a pair of guide pins on the bottom surface of an electronic circuit board. By holding the electronic component and inserting the lead wire of the electronic component into the insertion hole of the electronic circuit board, the electronic component can be reliably inserted anywhere as long as there is a "gap" for the inserted component, so this is an extremely advantageous insertion method.

[Brief explanation of the drawing]

Figures 1a to 1d are partial vertical sectional views showing the conventional lead wire guide pin insertion method step by step, and Figure 2 shows the lead wire guide part of the guide torch 17 in Figure 1. FIG. 3 is a plan view showing the insertion interval of electronic components due to the influence of bumps; FIG. 4 is a three-dimensional view of the main parts of an embodiment of the device used in the electronic component lead wire insertion method of the present invention; FIG.
Figures a to 5e are diagrams showing each step of the embodiment in Figure 4. 7.7'...Transfer chuck 8...Electronic components 10
...Electronic circuit board 11.11'...Guide pin
13...Holder 14.14'...-Guide Figure 1 (a) (b) (C) (
d) M2 Figure Figure 3 Figure 4 Figure 5 (e) Figure

Claims (2)

[Claims] (1) A method for automatically inserting an electronic component into an electronic circuit board having a lead wire insertion hole for inserting the lead wire of the electronic component, the method comprising: a pair of guide pins below the electronic circuit board; A lead wire holder having a recess into which a lead wire can be inserted is arranged on opposite sides of the tip of the guide pin, and the lead wire holder is raised to allow the guide pin to pass through the lead wire insertion hole. The elastic lead wire of the electronic component to be supplied on the electronic circuit board is inserted into the recess of the guide pin, and the lead wire holder is held while the lead wire is held by the guide pin. A method for inserting an electronic component, comprising lowering the electronic component and inserting the lead wire of the electronic component into a lead wire insertion hole of an electronic circuit board. (2) The electronic component insertion method according to claim 1, wherein the guide pin has a tapered tip.