JPS6166104U - - Google Patents
Info
- Publication number
- JPS6166104U JPS6166104U JP15000984U JP15000984U JPS6166104U JP S6166104 U JPS6166104 U JP S6166104U JP 15000984 U JP15000984 U JP 15000984U JP 15000984 U JP15000984 U JP 15000984U JP S6166104 U JPS6166104 U JP S6166104U
- Authority
- JP
- Japan
- Prior art keywords
- rotating shaft
- tip
- tape
- machine
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packaging Of Special Articles (AREA)
- Basic Packing Technique (AREA)
- Auxiliary Apparatuses For Manual Packaging Operations (AREA)
- Package Closures (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15000984U JPS6313133Y2 (en, 2012) | 1984-10-03 | 1984-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15000984U JPS6313133Y2 (en, 2012) | 1984-10-03 | 1984-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6166104U true JPS6166104U (en, 2012) | 1986-05-07 |
| JPS6313133Y2 JPS6313133Y2 (en, 2012) | 1988-04-14 |
Family
ID=30708166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15000984U Expired JPS6313133Y2 (en, 2012) | 1984-10-03 | 1984-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6313133Y2 (en, 2012) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US6999836B2 (en) | 2002-08-01 | 2006-02-14 | Applied Materials, Inc. | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US10717555B2 (en) | 2016-06-15 | 2020-07-21 | Max Co., Ltd. | Binding machine for gardening |
-
1984
- 1984-10-03 JP JP15000984U patent/JPS6313133Y2/ja not_active Expired
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7174230B2 (en) | 1999-07-29 | 2007-02-06 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US8694145B2 (en) | 2001-06-19 | 2014-04-08 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6999836B2 (en) | 2002-08-01 | 2006-02-14 | Applied Materials, Inc. | Method, system, and medium for handling misrepresentative metrology data within an advanced process control system |
| US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US7221990B2 (en) | 2004-05-28 | 2007-05-22 | Applied Materials, Inc. | Process control by distinguishing a white noise component of a process variance |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US7349753B2 (en) | 2004-05-28 | 2008-03-25 | Applied Materials, Inc. | Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US10717555B2 (en) | 2016-06-15 | 2020-07-21 | Max Co., Ltd. | Binding machine for gardening |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6313133Y2 (en, 2012) | 1988-04-14 |