JPS6163849U - - Google Patents

Info

Publication number
JPS6163849U
JPS6163849U JP14804784U JP14804784U JPS6163849U JP S6163849 U JPS6163849 U JP S6163849U JP 14804784 U JP14804784 U JP 14804784U JP 14804784 U JP14804784 U JP 14804784U JP S6163849 U JPS6163849 U JP S6163849U
Authority
JP
Japan
Prior art keywords
heat radiator
support portion
resin material
sealed
jig support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14804784U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14804784U priority Critical patent/JPS6163849U/ja
Publication of JPS6163849U publication Critical patent/JPS6163849U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP14804784U 1984-09-29 1984-09-29 Pending JPS6163849U (US06168776-20010102-C00028.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14804784U JPS6163849U (US06168776-20010102-C00028.png) 1984-09-29 1984-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14804784U JPS6163849U (US06168776-20010102-C00028.png) 1984-09-29 1984-09-29

Publications (1)

Publication Number Publication Date
JPS6163849U true JPS6163849U (US06168776-20010102-C00028.png) 1986-04-30

Family

ID=30706267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14804784U Pending JPS6163849U (US06168776-20010102-C00028.png) 1984-09-29 1984-09-29

Country Status (1)

Country Link
JP (1) JPS6163849U (US06168776-20010102-C00028.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6474746A (en) * 1987-09-17 1989-03-20 Toshiba Corp Resin-insulated semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6474746A (en) * 1987-09-17 1989-03-20 Toshiba Corp Resin-insulated semiconductor device

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