JPS6161306A - Contact mechanism - Google Patents

Contact mechanism

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Publication number
JPS6161306A
JPS6161306A JP18328084A JP18328084A JPS6161306A JP S6161306 A JPS6161306 A JP S6161306A JP 18328084 A JP18328084 A JP 18328084A JP 18328084 A JP18328084 A JP 18328084A JP S6161306 A JPS6161306 A JP S6161306A
Authority
JP
Japan
Prior art keywords
contact
hardness
noble metal
present
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18328084A
Other languages
Japanese (ja)
Inventor
富夫 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP18328084A priority Critical patent/JPS6161306A/en
Publication of JPS6161306A publication Critical patent/JPS6161306A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は接点機((眠待に、接点母材の表面に貴金属層
を形成した接点は構に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a contact machine (in other words, a contact structure in which a noble metal layer is formed on the surface of a contact base material).

(ロ)従来技術とその問題点 従来、接点の導電性、耐腐食性を得るため、接点母材の
表面に貴金属をクラッドあるいはメッキすることが広く
行なわれている。特に、低接点荷重の接点機構において
は、接触安定性を維持するため、例えば、純金メッキや
純金クラッドを施した接点が使用されている。
(B) Prior art and its problems Conventionally, in order to obtain electrical conductivity and corrosion resistance of the contact, it has been widely practiced to clad or plate the surface of the contact base material with a noble metal. In particular, in contact mechanisms with low contact loads, contacts coated with, for example, pure gold plating or pure gold cladding are used in order to maintain contact stability.

しかしながら、純金は硬度が低いので、粘着や移転を生
じやすく、接点寿命が短かいという欠点がある。
However, since pure gold has low hardness, it is prone to sticking and transfer, and has short contact life.

そのため、前述の欠点である接点寿命を伸ばすため、例
えば、接点母材の表面に硬度の高い金銀合金クラッドあ
るいは金コバルト合金メッキを行ない、接触抵抗の安定
性を維持しつつ、粘着や移転を防止している。
Therefore, in order to extend the contact life, which is the drawback mentioned above, for example, the surface of the contact base material is coated with a highly hard gold-silver alloy cladding or gold-cobalt alloy plating to prevent sticking and transfer while maintaining the stability of contact resistance. are doing.

しかしなが呟低接点荷重の接点機構においては、貴金属
の硬度が高いと接触面の塑性変形が起こりにくいので、
接触面積が小さく、接触抵抗か不安定になるという欠点
がある。
However, in contact mechanisms with low contact loads, the high hardness of precious metals makes it difficult for plastic deformation of the contact surfaces to occur.
The disadvantage is that the contact area is small and the contact resistance is unstable.

(ハ)発明の目的 本発明の目的は、前記欠点に鑑みてなされたもので、接
点寿命が長く接触安定性に優れた接点機(11jを提供
することにある。
(c) Purpose of the Invention The purpose of the present invention was made in view of the above-mentioned drawbacks, and is to provide a contact machine (11j) having a long contact life and excellent contact stability.

(ニ)発明の構成 本発明にかかる接点機構は、前記目的を達成するため、
接点相互の接離によって開閉する接点機構において、一
方の接点母材の表面に形成した貴金属層の硬度と、池方
の接点母材の表面に形成した貴金属層の硬度との間に硬
度差を設けた構成としである。
(d) Structure of the Invention In order to achieve the above object, the contact mechanism according to the present invention has the following features:
In a contact mechanism that opens and closes by touching and separating the contacts, there is a hardness difference between the hardness of the precious metal layer formed on the surface of one contact base material and the hardness of the precious metal layer formed on the surface of Ikegata's contact base material. This is the configuration provided.

(ホ)実施例の説明 以下、本発明にかかる実施例を添付図面に従って説明す
る。
(E) Description of Embodiments Embodiments according to the present invention will be described below with reference to the accompanying drawings.

第1図は本発明の第1実施例を示し、一方の接触片1に
設けた接点母材2の表面に金コバルト合金の硬質メッキ
層3を形成し、池方の接触片4に設けた接点母材5の表
面に純金の軟質メッキWJ6を形成した場合である。
FIG. 1 shows a first embodiment of the present invention, in which a hard plating layer 3 of gold-cobalt alloy is formed on the surface of a contact base material 2 provided on one contact piece 1, and This is a case where pure gold soft plating WJ6 is formed on the surface of the contact base material 5.

硬質メッキ層の硬度はヌープ硬度で100〜1508に
、軟質メッキ層の硬度はヌープ硬度で50〜90Hkが
適当である。硬質メッキ層のヌープ硬度が150以上に
なると接触抵抗が不安定になるとともに、軟質メッキ層
の摩耗が大きくなるという不具合がある一方、軟質メッ
キ層のヌープ硬度が508に以下になると粘着や移転が
発生しやすくなるという不具合があるからである。
The hardness of the hard plating layer is suitably 100 to 1508 on the Knoop hardness, and the hardness of the soft plating layer is suitably 50 to 90Hk on the Knoop hardness. If the Knoop hardness of the hard plating layer is 150 or more, the contact resistance becomes unstable and the soft plating layer suffers from increased wear. On the other hand, if the Knoop hardness of the soft plating layer is 508 or less, adhesion and transfer may occur. This is because there is a problem in that it is more likely to occur.

次に、前述の実施例にかかる接点機構の実験例について
説明する。
Next, an experimental example of the contact mechanism according to the above embodiment will be explained.

実験例1 本実験例は本発明にかかる接点機構の接触安定性に関す
るものである。
Experimental Example 1 This experimental example relates to the contact stability of the contact mechanism according to the present invention.

本発明にかかる接点機構は、可動接点の母材表面に硬度
の高い金コバルト合金をメッキして硬質メッキ層を形成
する一方、固定接点の母材表面に硬度の低い純金をメッ
キして軟質メッキ層を形成して構成したものである。
In the contact mechanism according to the present invention, the surface of the base material of the movable contact is plated with a gold-cobalt alloy of high hardness to form a hard plating layer, while the surface of the base material of the fixed contact is plated with pure gold of low hardness to form a soft plating layer. It is constructed by forming layers.

なお、参考に供するため、本発明品の他に、金コバルト
合金を固定接点、可動接点の母材表面にメッキした比較
品の実験結果をも示す。本発明品および比較品の貴金属
層のヌープ硬度は表−1に示す通りである。また、金コ
バルト合金による貴金属メッキ層の硬度調整は、メッキ
浴のPHおよびコバルト塩の含有量の調整によって行な
った。
For reference, in addition to the products of the present invention, experimental results of comparative products in which gold-cobalt alloy was plated on the base material surfaces of fixed contacts and movable contacts are also shown. The Knoop hardness of the noble metal layer of the present invention product and the comparative product is as shown in Table-1. Further, the hardness of the noble metal plating layer made of gold-cobalt alloy was adjusted by adjusting the pH of the plating bath and the content of cobalt salt.

そして、表−1の()内の数値はコバルトの共析率(%
)を示すもので、コバルトの共析率が(0%)の場合は
純金メッキを示す。
The numbers in parentheses in Table 1 are the cobalt eutectoid rate (%
), and when the cobalt eutectoid rate is (0%), it indicates pure gold plating.

前記条件下における接点機構の接点荷重(g)と接触抵
抗(IIIΩ)との相関関係の測定結果を第2図ないし
第5図に示す。
The measurement results of the correlation between the contact load (g) and the contact resistance (IIIΩ) of the contact mechanism under the above conditions are shown in FIGS. 2 to 5.

比較品1(第3図)、比較品2(第4図)は共に固定接
点と可動接点との貴金属メッキ層の硬度が1808に以
上の場合で、全体の接触抵抗が高いうえに、低接点荷重
域(約4g付近)における接触抵抗のバラツキが大きい
ので、接触状態が不安定であることかわかる。
Comparison product 1 (Fig. 3) and comparison product 2 (Fig. 4) both have hardness of the precious metal plating layer on the fixed contact and the movable contact of 1808 or more, and have a high overall contact resistance and a low contact resistance. Since there is a large variation in contact resistance in the load range (approximately 4 g), it can be seen that the contact state is unstable.

比較品3(第5図)は、前述の比較品1,2に比べて、
比較的安定した状態を示しているが、全体的に高い接触
抵抗を示している。
Comparative product 3 (Fig. 5) has the following characteristics compared to comparative products 1 and 2 described above.
Although it shows a relatively stable state, it shows high contact resistance overall.

しかし、本発明品(第2図)は、池の比較品の場合に比
べて接触抵抗のバラツキが非常に小さい。
However, the product of the present invention (FIG. 2) has much smaller variation in contact resistance than the comparative product.

しかも、接点荷重が約4gの低接点荷重域においては、
接触抵抗が50mΩ以下を示しているので、高接点荷重
域から低接点荷重域にわたって安定した接触抵抗を有し
ていることがわかる。
Moreover, in the low contact load region where the contact load is approximately 4g,
Since the contact resistance is 50 mΩ or less, it can be seen that the contact resistance is stable from the high contact load region to the low contact load region.

以上の実験結果より、本発明品にががる接点(幾構は優
れた接触安定性を有していることが判明した。
From the above experimental results, it was found that the contact points (some structures) of the product of the present invention had excellent contact stability.

実験例2 本実験例は本発明にかかる接点眼構の接点寿命に関する
ものである。
Experimental Example 2 This experimental example concerns the contact life of the contact optic according to the present invention.

本実験例は、前述の実験例1と同様な構造を有する接点
機構を連続して開閉動作させることにより、接点寿命を
調べたもので・、その実験条件および実験結果を表−2
に示す。
In this experiment, the contact life was investigated by continuously opening and closing a contact mechanism with a structure similar to that of Experiment 1. The experimental conditions and results are shown in Table 2.
Shown below.

表−2 以上の実験結果より、本発明品にかかる接点機構は耐粘
着性、耐移転性に優れているので、接点寿命が長いこと
がわかる。また、実験前後における接触抵抗に大きな変
化が見受けられないので、長期間、優れた接触安定性を
維持できることが判明した。
Table 2 From the above experimental results, it can be seen that the contact mechanism according to the present invention has excellent adhesion resistance and transfer resistance, and therefore has a long contact life. Furthermore, since no significant change was observed in the contact resistance before and after the experiment, it was found that excellent contact stability could be maintained for a long period of time.

第6図は本発明の第2実施例を示し、前述の第1実施例
が接触片に設けた接点母材の表面に貴金属メッキ層を形
成する場合であるのに対し、接触片1,4に設けた接点
母材2,5の当接表面に貴金属クラッド層3,6を形成
する場合である。
FIG. 6 shows a second embodiment of the present invention, in which a noble metal plating layer is formed on the surface of the contact base material provided on the contact pieces in the first embodiment, whereas the contact pieces 1 and 4 are This is a case where noble metal cladding layers 3 and 6 are formed on the contact surfaces of contact base materials 2 and 5 provided on the contact base materials 2 and 5.

なお、本発明にかかる貴金属は、金コバルト合金の他、
金銀合金、金ニツケル合金、金パラジウム合金などであ
ってもよく、また、硬質メッキ、軟質メッキは固定接点
あるいは可動接点のいずれであってもよい。更に、貴金
属メッキ層と貴金属クラッド層とを、適宜、組合わせて
もよいことは勿論である。
In addition, the noble metal according to the present invention includes gold-cobalt alloy,
It may be a gold-silver alloy, a gold-nickel alloy, a gold-palladium alloy, etc., and the hard plating or soft plating may be either a fixed contact or a movable contact. Furthermore, it goes without saying that the noble metal plating layer and the noble metal cladding layer may be combined as appropriate.

(へ)発明の効果 以上の説明から明らかなように、本発明にかかる接点機
構によれば、一方の接点母材の表面に形成した貴金属層
の硬度が他方の接点母材の表面に形成したそれよりも高
いため、貴金属層の硬度か両方とも低い接点機構の場合
よりも、貴金属層の粘着や移転が生じにくくなり、接点
寿命が伸びる。
(F) Effects of the Invention As is clear from the above explanation, according to the contact mechanism according to the present invention, the hardness of the noble metal layer formed on the surface of one contact base material is the same as the hardness of the noble metal layer formed on the surface of the other contact base material. Since the hardness of the noble metal layer is higher than that, sticking and transfer of the noble metal layer is less likely to occur than in the case of a contact mechanism in which either the hardness of the noble metal layer or both are low, and the contact life is extended.

しかも、他方の貴金属層の硬度が一方のそれよりも低い
ので、接点の接離に際し、他方の貴金属層の接触面に塑
性変形を生じ、接触面積が大となって接触抵抗が安定し
、接触安定性が向上するという効果がある。
Moreover, since the hardness of the other precious metal layer is lower than that of the other, when the contacts are brought into contact and separated, plastic deformation occurs on the contact surface of the other precious metal layer, increasing the contact area and stabilizing the contact resistance. This has the effect of improving stability.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明にかかる第1実施例の断1lfD#If
視図、第2図ないし第5図は本発明にががる接点機構の
実験例1に関する測定結果を示すグラフ図で、第2図は
本発明品にかがるグラフ図、第3図ないし第5図は比較
品1ないし比較品3にかかるグラフ図、第6図は本発明
にかかる第2実施例の断面斜視図である。 特 許 出 願 人  立石電機株式会社代 理 人 
弁理士  青白 葆 ばか2名第1図 第6図 第2図 υ        1υ Sゑ鴇1(9) 第3図 tj54図 第5図 物N、属1(9)
FIG. 1 shows a cross section 1lfD#If of the first embodiment according to the present invention.
2 to 5 are graphs showing the measurement results for Experimental Example 1 of the contact mechanism according to the present invention, and FIG. 2 is a graph for the product according to the present invention, and FIGS. FIG. 5 is a graph diagram of comparative products 1 to 3, and FIG. 6 is a cross-sectional perspective view of a second embodiment of the present invention. Patent applicant: Tateishi Electric Co., Ltd. Agent
Patent attorney Blue and white 葆 Two idiots Figure 1 Figure 6 Figure 2 υ 1υ Sゑ鴇1 (9) Figure 3 tj54 Figure 5 Item N, Genus 1 (9)

Claims (3)

【特許請求の範囲】[Claims] (1)接点相互の接離によって開閉する接点機構におい
て、一方の接点母材の表面に形成した貴金属層の硬度と
、他方の接点母材の表面に形成した貴金属層の硬度との
間に硬度差を設けてあることを特徴とする接点機構。
(1) In a contact mechanism that opens and closes by connecting and separating contacts, there is a difference in hardness between the hardness of the noble metal layer formed on the surface of one contact base material and the hardness of the noble metal layer formed on the surface of the other contact base material. A contact mechanism characterized by having a difference.
(2)前記貴金属層が、貴金属メッキ層であることを特
徴とする特許請求の範囲第1項記載の接点機構。
(2) The contact mechanism according to claim 1, wherein the noble metal layer is a noble metal plating layer.
(3)前記貴金属層が、貴金属クラッド層であることを
特徴とする特許請求の範囲第1項記載の接点機構。
(3) The contact mechanism according to claim 1, wherein the noble metal layer is a noble metal cladding layer.
JP18328084A 1984-08-31 1984-08-31 Contact mechanism Pending JPS6161306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18328084A JPS6161306A (en) 1984-08-31 1984-08-31 Contact mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18328084A JPS6161306A (en) 1984-08-31 1984-08-31 Contact mechanism

Publications (1)

Publication Number Publication Date
JPS6161306A true JPS6161306A (en) 1986-03-29

Family

ID=16132889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18328084A Pending JPS6161306A (en) 1984-08-31 1984-08-31 Contact mechanism

Country Status (1)

Country Link
JP (1) JPS6161306A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63274034A (en) * 1987-05-02 1988-11-11 Omron Tateisi Electronics Co Electromagnetic relay
WO2015041359A1 (en) * 2013-09-21 2015-03-26 古河電気工業株式会社 Electrical contact structure comprising movable contact part and fixed contact part
CN106233409A (en) * 2014-04-16 2016-12-14 Abb瑞士股份有限公司 Electrical contact top and electric switchgear for switch application

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121220A (en) * 1979-03-09 1980-09-18 Matsushita Electric Works Ltd Electric contact

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55121220A (en) * 1979-03-09 1980-09-18 Matsushita Electric Works Ltd Electric contact

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63274034A (en) * 1987-05-02 1988-11-11 Omron Tateisi Electronics Co Electromagnetic relay
WO2015041359A1 (en) * 2013-09-21 2015-03-26 古河電気工業株式会社 Electrical contact structure comprising movable contact part and fixed contact part
CN105531780A (en) * 2013-09-21 2016-04-27 古河电气工业株式会社 Electrical contact structure comprising movable contact part and fixed contact part
CN106233409A (en) * 2014-04-16 2016-12-14 Abb瑞士股份有限公司 Electrical contact top and electric switchgear for switch application
CN106233409B (en) * 2014-04-16 2018-10-19 Abb瑞士股份有限公司 For the electrical contact top of switch application and electric switchgear

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