JPS6159514A - Specific gravity controller of etching liquid - Google Patents

Abstract

PURPOSE:To attain stable control with respect to specific gravity of an etching liquid with high accuracy by providing plural dilute liquid supply paths, specific gravity measuring devices and solenoid valves to attain automatic control of application of a dilute liquid. CONSTITUTION:The specific gravity measuring device 31 has a specific gravity measuring tank 32, a dilute liquid tank 42 is arranged at the upper part and a dilute liquid B is supplied from a dilute liquid supply source 43 of the upper part. Further, two pipes 45, 46 are connected between the lower part of the tank 42 and a flowing-out pipe 41 as the dilute liquid supply path, flow regula tion valves 47, 48 and flowmeters 49, 50 are provided respectively and a solenoid valve 52 is provided to the pipe 46. In case of the supply of the dilute liquid, 80-90% of the quantity of the dilute liquid B given to the etching liquid A is supplied always from the pipe 45 and the remaining quantity 10-20% is supplied from the other pipe 46 by switching the solenoid valve 52. Thus, the quantity of the dilute liquid is controlled automatically and the specific gravity of the etching liquid is controlled stably with high accuracy.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an etching solution ratio control device; related to things.

[Technical application of invention]

For example, a mask (generally, 2) for a cathode ray tube is carried out in a horizontal or upward direction while pulling out a band-shaped iron plate, a photosensitive liquid coating process, an exposure process, a developing process, and It is manufactured through a sequential etching process.

In the etching process, a plurality of manifolds arranged to face both sides of the steel plate to be etched are oscillated, and an etching solution such as ferric chloride is applied from a spray nozzle installed in each manifold. A pattern previously printed on the iron plate is etched into a flat mask with a large number of regularly arranged holes.

In this flat mask, it is important to accurately form a large number of holes through which the electron beam passes, and for this purpose, it is necessary to accurately control the ratio of the etching liquid used for etching.

By the way, normally, when a material to be etched is continuously etched, the components of the material to be etched melt and the specific gravity inevitably changes. Therefore, it is necessary to adjust the specific gravity by adding a diluent such as water. For example, in the case of a flat mask, the hanging rod should be J, the thickness of the material (0.1 to 0.4 mtn),
Since the pore diameter (90 to 200μ) changes, the ω of molten iron
(User is not necessarily constant.

Therefore, in order to keep the specific gravity constant, it is necessary to control the suspension of the 1F diluent.

For this reason, conventionally, the etching solution was taken out and the ratio L was measured in batches, or a float type ratio mt was placed in the etching solution reservoir.
] is floated, and the amount of diluent such as water is controlled by a manual valve while adjusting the specific gravity scale.

(Problems with the background technology) As mentioned above, specific gravity! It is inefficient to measure the specific gravity of the etching solution by looking at the . In addition, with the method of adding diluting liquid using a manual valve to achieve the desired specific gravity, it is difficult to set the specific gravity as desired, and even if the specific gravity is repeated, the desired specific gravity is always stable. It is worth setting it to a value.

[Purpose of the invention]

The present invention aims to solve the above-mentioned problems by automatically controlling the input amount of the diluent and stably controlling the specific gravity of the etching solution. [This is the first objective.

[Summary of the invention]

The etching liquid ratio m control device of the present invention is an etching liquid specific gravity control device that controls the etching liquid to a desired specific gravity while adding a diluted liquid to the etching liquid that continuously etches a material to be etched. - a specific gravity measurement mode 11° 4 for measuring the specific gravity of the etching solution, two diluent supply paths for supplying the diluent from the diluent tank to the etching solution, and one diluent supply path;
[Equipped with a solenoid valve that is opened in conjunction with the measurement specific gravity input by the specific gravity measurement mechanism, and a diluent is continuously inputted from one of the diluent supply channels, and has a solenoid valve.] Inject the diluent from the other diluent supply path by opening and closing the solenoid valve.
It is characterized by controlling the input amount of the diluent so that the specific gravity of the etching solution becomes a set specific gravity. The electromagnetic valve in the supply path is opened and closed to inject the diluent in the amount needed, and the specific gravity of the etching solution is adjusted to a set level.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a band-shaped iron plate as a material to be etched, for example, for forming a flat mask for a color cathode ray tube.
After passing through an exposure process and a development process, it is run horizontally.

Reference numeral 11 denotes one edging and one shim bar, and this edging chamber 11 has an opening 12.13 formed in the center of the front and rear surfaces through the iron plate 1, and a plurality of openings 12 and 13 are formed in the upper and lower parts of the edging chamber II imper 11. book manifold 1
4 are arranged in parallel, and each of the upper and lower manifolds 14 has a large number of spray nozzles 15 facing each other at predetermined intervals.

16 is an etching liquid tank, and the supply side piping 11 is connected to the lower part of this etching liquid tank 16.
111 and a no-pump H1 is installed (a header pipe 19 is connected to the piping 17 in the header 6, and one end of each manifold 14 is connected to the header pipe 19 through each piping 21 having a valve 20. is continued 1a.

Further, the lower bottom of the etching chamber 11 and the upper part of the etching liquid tank 16 are connected via a return pipe 22, and a circulation path is formed between the etching liquid tank 16 and the etching chamber 11. There is.

Then, by driving the spray pump 18, the etching liquid A in the etching liquid tank 16 is supplied to the header pipe 19 via the supply side piping 17, and this header pipe 1'
It is supplied to the upper and lower manifolds 14 in the etching chamber 11 through each piping 21, and is continuously transferred horizontally from each spray nozzle 15 to both sides of the iron plate 1 as a material to be etched. The iron plate 1 is etched. Then, the etching solution Δ is collected at the bottom of the etching chamber 11,
The etching liquid is returned from the return pipe 22 into the etching liquid tank 16, and the etching flitΔ4. L circulation 1-; i 'Jru.

1 In this way, as shown in FIG. 3, flat masks 2 having a large number of holes formed in the iron plate 1 are formed in a continuous manner. .

Next, the stop position of the etching solution A will be explained with reference to FIG.

31 is a pawl measuring mechanism (14, this pawl measuring mechanism 31 is
A specific gravity measuring tank 32 is provided, and a partition wall 33 is provided in this specific gravity measuring tank 32 to form a partition with an inflow chamber 34 and an outflow chamber 35 communicating with each other at the upper part.
To measure the specific gravity, use sensor 36 and temperature sensor 37.
is installed.

The lower part of the inflow chamber 34 and one end of the header pipe are connected via an inflow-side pipe 40 having a branching solenoid valve 38 and a flow rate control valve 39, and the lower part of the outflow chamber 35 is connected to one end of the header pipe. The etching liquid tank 16 is connected via a return pipe 41.

A diluent tank 42 is disposed 8 above the F recording ratio measuring tank 32, and a diluent supply source 43 is connected to the upper part of the diluent tank 42 via an automatic valve 44 to supply the diluent. A diluent B such as water is supplied to the tank 42 from a diluent supply source 43/Jsl by an automatic valve 44 so that the liquid level is always constant.

Further, two pipes 4 as two diluent supply paths are provided between the lower part of the diluent tank 42 and the outflow pipe 41.
5.4G is connected, each of the pipes 45.4G is provided with a flow control valve 47.48 and a flow meter 49.50, and one of the pipes 46 is further provided with a solenoid valve 52. Then, the specific gravity measurement sensor 36 and temperature measurement sensor 1 no 37 of the specific gravity measurement 81 hM31 go to/D change 15! The electromagnetic valve 52 is connected to a controller via a controller, and the opening/closing of the electromagnetic valve 52 is controlled by this controller.

Then, the diluent B is transferred to the diluent tank;
Piping 4 as two diluent supply paths from the diluent tank 42 while sequentially replenishing the diluent tank 42 via the diluent tank 42.
Etching liquid tank 1 via piping 41 due to 5.4G
Supply 1° to G. In this case, 80 to 90% of the diluent B that should be added to the etching solution A should be poured into the HJ pipe 45 on one side.
The remaining input 910 to 20% is supplied through the inflow 1i50J3 and the flow rate control valve 48 by opening and closing the solenoid valve 52 using the other pipe 4G. , control the etching solution △ so that it has the desired specific gravity.

However, when etching the iron plate 1 as the material to be etched by circulating the etching Δ as described above, the iron on the iron plate 1 cures and its specific gravity to the etching solution gradually increases. , the diluent B is added to the etching solution A to lower the specific gravity.
First, the control operation of the diluent 8 will be explained.

J5G is connected to the pipe 4o branched from the header pipe 19 by the order of the external control 1 cola (G in the figure) No. 7 and others.
When I hear the pull branch solenoid valve 38, the etching liquid
Δ enters the inflow chamber 34 of the indenter measurement link 32 from the header pipe 19 through the piping 40, passes from the upper part of the partition wall 33 through the outflow chamber 35, and enters the outflow piping 41. returned inside.

Then, after a certain period of time has elapsed, the solenoid valve 38 is closed, and after a certain period of time has elapsed and the etching liquid A in the inflow 34 of the specific gravity measurement tank 32 has stopped J3,
Load the measurement data. In this reading, the specific gravity data J3 from the specific gravity measuring sensor +J-36 and the warm melon data from the temperature measuring sensor 31 are read 5 to 10 times, and the average value thereof is taken as the measured value.

In this case, the temperature is measured because the specific gravity of the etching solution Δ is a function of temperature, which is approximately 1°C for 1°C.
Since a specific gravity of /1000 would be unreasonable, the purpose is to obtain a specific gravity based on a constant temperature standard, for example, a 65°C standard. If the temperature is 65°C and the specific gravity is 1.465, if the temperature drops by 1°C to 64°C, the specific gravity will be 1.4G6, which is 1.465 based on the 65°C standard.

To calculate the amount of diluent B to be added, calculate the difference between the set specific gravity and the measured specific gravity, obtain the total volume of the etching solution in advance, and check whether the set specific gravity will be reached if X (j) is added. .Next, the flow ffi setting of the flowmeter 50 is F (j!/m
1n) and determine the time T = X for listening to the solenoid valve 52.
/F (min) wot l\J, time 1; f +-1
? Ti Filzr52'a; Inlr: Diluent I3
Immerse yourself in the world.

These measurements can be carried out, for example, by increasing the numbering time for about 5 minutes, and adding the diluted solution B for each numbering time.
By adding ~71 n L/, the desired specific gravity is achieved. J: Control the sea urchin.

[Efficacy of invention]

According to the present invention, of the two supply channels, for example, 80 to 90% of the L114 diluent is input into one supply channel, and the remaining 10 to 20% is supplied through the other supply channel. Since it is controlled by opening and closing a solenoid valve, it is possible to control the specific gravity of the etching liquid.The viscosity can be improved, and the variation in specific gravity is reduced and stabilized, resulting in the production of high-quality products per liter. I can do it.

Furthermore, even if a malfunction should occur, the control ratio is within the range of 10 to 20%, so it is safe and will not suffer fatal damage.

Furthermore, since the specific gravity of the etching solution can be automatically controlled, manual adjustment work is no longer required, and productivity can be improved.

[Brief explanation of the drawing]

The figures do not show one embodiment of the present invention, and FIG. 1 is a partially cut-away side view of the etching device, FIG. 2 is a partially cut-away side view of the specific gravity control device, and FIG. Figure C is a plan view of the limb etching material. 1. Steel plate as material to be etched, 31. Specific gravity measurement IM H6, 32. Specific gravity measurement tank, 36. Specific gravity measurement sensor, 37. Temperature measurement tip-138. Solenoid valve for branching, 42. - Diluted liquid tank, 45.4G... Piping as diluted liquid supply path, 52... Solenoid valve, △... Etching liquid, B... Diluted liquid.

Claims (3)

[Claims] (1) Specific gravity measurement that measures the specific gravity of the etching solution in an etching solution specific gravity control device that controls the specific gravity of the etching solution to a desired level while adding a diluted solution to the etching solution that continuously etches the etched material. a mechanism, two diluent supply paths for supplying the diluent from the diluent tank to the etching solution, and an electromagnetic device provided in this one diluent supply path and opened and closed in relation to the specific gravity value measured by the specific gravity measuring mechanism. a valve, and continuously inputs the diluent from one of the diluent supply channels,
The etching solution is characterized in that the dilution solution is introduced from the other dilution solution supply path having a solenoid valve by opening and closing the solenoid valve, and the amount of the dilution solution introduced is controlled so that the etching solution has a set specific gravity. Specific gravity control device. (2) The specific gravity measuring mechanism includes a specific gravity measuring tank connected to a part of the etching solution circulation path via a branching solenoid valve. Specific gravity control device. (3) The specific gravity measurement mechanism has a specific gravity measurement sensor that measures the specific gravity of the etching solution and a temperature measurement sensor that measures the temperature of the etching solution, and based on these measured values, the solenoid valve of the diluent supply path is adjusted. An etching solution specific gravity control device according to claim 1 or 2, characterized in that the device opens and closes.