JPS6159466B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a module for an electronic watch that has a three-layer structure, that is, a module frame, a substrate, and a module back cover. Regarding modules.

Generally, an electronic watch consists of a module frame on which a display device is installed, a substrate to which a large-scale integrated circuit (LSI) on which an electronic circuit is formed is fixed, and a module back cover for fixing the substrate to the module frame. It is configured. When assembling a module for such an electronic watch, the switch contact for time adjustment or display switching, or the power terminal that comes into contact with the battery electrode terminal, is fixed to the module frame by screws or soldered to the board, and then fixed to the module frame by screws or soldered to the board. The back cover of the module was fixed to the module frame with screws. Therefore, electronic timepiece modules have the disadvantage of having a large number of parts, making assembly complicated, and requiring time to assemble, resulting in poor productivity.

An object of the present invention is to eliminate the above-mentioned conventional drawbacks, and to provide an electronic timepiece module that reduces the number of parts, eliminates the need for soldering, and is easy to assemble and has high productivity. The present invention will be described in detail below with reference to the drawings.

FIG. 1 is an exploded view of a module of an electronic timepiece showing an embodiment of the present invention, and is composed of a module frame 1, a substrate 2, and a module back cover 3 .

The module frame 1 has a hollow disc shape made of synthetic resin, and a liquid crystal display panel 4 is fixed to the upper surface of the module frame 1 by metal fittings 5. In addition, a recess 6 and a trapezoidal protrusion 7 are provided on the side surface of the module frame 1.
There are multiple locations. An LSI 8 on which a clock circuit is formed, a crystal oscillator 9, a trimmer 10, etc. are fixed to the substrate 2, and conductive paths for wiring these are formed on the top and back surfaces. Furthermore, LSI8 is installed on board 2.
A switch electrode 11 derived from an internal switch circuit and an electrode 12 to which a power supply voltage is applied are provided on the surface in contact with the module back cover 3 .
The module back cover 3 has a donut-shaped synthetic resin layer 13
A metal fixing fitting 14 and a switch contact piece 15 bent at a substantially right angle are integrally molded on the outer periphery. The fixing fitting 14 has a rectangular hole 16 in the center thereof, and by hooking the protrusion 7 of the module frame 1 into this hole 16, the module back cover 3 is fixed by pressing the board 2. It is. At this time, since the protrusion 7 has an inclined surface, the fixing fitting 14 is automatically opened and fixed by simply pressing the module back cover 3 . On the other hand, the switch contact piece 15 has a tongue piece 17 formed by punching out a part of a metal plate and bending it in the direction of the board 2.
When the module back cover 3 is fixed, the tongue piece 17 is attached to the board 2.
It comes into contact with the switch electrode 11 provided on the switch. Further, the switch contact piece 15 is inserted into the recess 6 of the module frame 1 so as not to come into undesired contact with a case (not shown).

Furthermore, the module back cover 3 will be explained in detail. Second
The figure is a bottom view of the module back cover 3 , and Figure 3a
is a cross-sectional view taken along A-A' of the bottom view shown in Fig. 3.
Figure b is a sectional view taken along line B-B'.

In FIG. 2, the module back cover 3 has fixing fittings 14, 14' and a switch contact piece 15 integrally molded around the outer periphery of a doughnut-shaped synthetic resin layer 13, as described above.

Four fixing fittings 14, 14' are provided at each location, and one of the fixing fittings 14' has a tongue piece 18 similar to the switch contact piece 15. This fixing fitting 14' will become clear later, but
This is for supplying voltage from one side of the battery to the board 2, and the other fixture 14 is not provided with a tongue piece. Three switch contact pieces 15 are provided, each having a tongue piece 17 that contacts the electrode 11 of the substrate 2. These fixing fittings 14, 14' and the switch contact piece 15 consist of a part that projects horizontally from a recess provided on the outer periphery of the module back cover 3 , and a part that is bent at right angles.
8 is provided in the horizontal portion.

In addition, a trimmer adjustment hole 19 is provided in the synthetic resin layer 13 of the module back cover 3 so that the oscillation frequency can be adjusted even after the module back cover 3 is fixed to the module frame 1. It is.

Furthermore, power terminals 20 and 21 are molded on the module back cover 3 to make contact with the voltage terminals of the battery. The power terminal 20 extends from the inner periphery of the synthetic resin layer 13 to the vicinity of the center, and has a tongue piece 2 bent toward the board in order to apply a power voltage to the board 2.
2, and the power supply terminal 21 protrudes from the inner periphery on the opposite side and is bent into a U-shape. This will become more specific with reference to FIG. Power terminal 2
0 is bent at the part indicated by 23, and the module back cover
3 , the tongue piece 22 is bent toward the substrate, and near the center is bent in the opposite direction to the tongue piece 22. The power terminal 21 is bent into a U-shape at the inner periphery of the synthetic resin layer 13, and is electrically connected to a fixture 14' having a tongue piece 18 inside the synthetic resin layer 13.

The space in the center of the doughnut-shaped synthetic resin layer 13 is a battery storage part 24 for inserting a thin battery, and when the battery is inserted, the power terminals 20, 2
1 is in contact with the voltage terminal of the battery, and one is in contact with the tongue piece 2.
Voltage is supplied to the substrate 2 through the terminal 2 and the tongue 18 of the fixture 14' on the other hand. Further, referring to FIG. 3b, in the center of the donut shape, except for the part where the power terminals 20 and 21 are provided, a semicircular synthetic resin film 25 is formed on the synthetic resin layer 13.
It is extended from. This synthetic resin film 25 is for preventing short circuit between the conductive path provided on the substrate 2 and the voltage terminal of the battery when the battery is stored.

The structure of the module has been described above, and now the method for manufacturing the module back cover 3 will be described.

As mentioned above, the module back cover 3 has the fixing metal fitting 1.
4, 14', switch contact piece 15, and power supply terminals 20, 21 are integrated using synthetic resin, and it is best to use a metal frame to manufacture this.

FIG. 4 shows a partial pattern of the frame. Fourth
In the figure, 26 is a connecting band, 27 is a connecting holding strip, and the connecting holding strip 27 is the fixing metal fittings 14, 1.
4', switch contact piece 15, power terminal 20,
21 are connected and held in a ring shape. A plurality of sets connected by the connection holding strips 27 are connected by the connection band 26, and these are obtained by punching a single metal plate into a predetermined pattern using a press or the like. . The holes 28 provided in the connecting band 26 are used as guide holes during resin molding or when cutting out the connecting band 26 and the connecting holding strips 27. In addition, the fixing metal fittings 14, 14', the switch contact piece 15, and the power terminal 20 have holes 29.
is provided, and when resin molding is performed, the resin passes through the hole 29 to prevent it from falling off from the synthetic resin layer 13. Furthermore, the stepped portions 30 provided on each side have the same effect.

In the above pattern, power terminal 20,
Reference numeral 21 is a single band-shaped metal plate that is integral, but is cut by a press or the like after resin molding. In addition, the power terminals 20 and 21 have fixing fittings 14',
14" is also integrated, and power terminal 2
Even after the wires 0 and 21 are cut off, the power terminal 21 and the fixing fittings 14' and 14'' remain integrated, supplying battery voltage to the board 2. It is clear that the hole 31 is a hole for adjusting the trimmer.

The above frame is placed in a predetermined mold, and molten synthetic resin is injected to form a mold.

FIG. 5 shows the frame after resin molding, in which the synthetic resin layer 13 is donut-shaped as described above, the outer periphery is resin-fixed at the inner periphery of the connecting and holding strips 27, and the tongue pieces 17 and 18 are provided. The part that is is not modeled. The connection holding strips 27 are cut by a press or the like at the contact portions of the fixing fittings 14, 14' and the switch contact piece 15, respectively, and the module back cover 3 is separated from the connection band 26. Furthermore, the fixing metal fittings 14,1
4 and the switch contact piece 15 are bent at approximately right angles, and at the same time, the power terminals 20 and 21 are also cut approximately at the center, one power terminal 20 is bent to the surface position of the board contact surface, and the tongue piece 22 is bent in the direction of the board. The other power terminal 21 is bent into a U-shape. The modular back cover 3 is manufactured in this manner, and by using a frame, it can be easily mass-produced.

As described above, according to the present invention, by integrating the fixing metal fittings, the switch contact piece, and the power terminal with synthetic resin on the module back cover, it is possible to solder the switch contact piece and the power terminal, and to attach the board and the module back cover. No need for screws. In addition, since the module is composed of three parts: the module frame, the board, and the module back cover, the number of parts is reduced, making it easier to assemble the module and improving productivity, which also reduces costs. It will become.

[Brief explanation of the drawing]

Fig. 1 is an exploded view of a module of an electronic watch showing an embodiment of the present invention, Fig. 2 is a bottom view of the back cover of the module shown in Fig. 1, and Figs. 3 a and b are the modules shown in Fig. 2. Enlarged cross-sectional views taken along A-A' and B-B' of the back cover, FIG. 4 shows a metal frame when manufacturing a modular back cover, and FIG. 5 shows a case where the metal frame is molded with resin. 1...module frame, 2...board, 3 ...
...Module back cover, 7...Protrusion, 8...LSI,
11, 12...electrode, 13...synthetic resin layer, 1
4, 14', 14''...Fixing metal fittings, 15...Switch contact piece, 16...Hole to be locked, 17...Tang piece of switch contact piece, 18...Tang piece, 20, 21...Power source Terminal, 22...tongue piece, 26...connection band,
27...Connection retention clause.

Claims (1)

[Claims] 1. A module frame with a protrusion on a side surface, a substrate to which an LSI etc. is fixed and a plurality of electrodes and conductive paths formed, and an opposite side surface that fixes the substrate to the module frame and is in contact with the substrate. and a donut-shaped module back cover provided with a battery storage section, the module back cover having a fixing fitting having a hole that is latched to a protrusion of the module frame, and a fixing fitting that connects the board to the module frame. a switch contact piece provided with a tongue piece that comes into contact with the electrode of the board when held between the module back cover; and a notch part provided in a thin resin layer extending at the bottom of the battery storage part. 1. A module for an electronic timepiece, characterized in that one protruding electrode of the battery and a power terminal having a contact tongue provided on an electrode of the substrate are integrated with an insulating resin.