JPS6156496A - Board for hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a board for a hybrid integrated circuit device, and relates to a highly integrated and highly accurate multilayer wiring board.

[Prior art]

In recent years, as electronic devices have become larger and more sophisticated, the hybrid integrated circuit devices used in these devices have increasingly become
There is a growing demand for smaller size and higher integration. In order to reduce the size and increase the degree of integration, the substrate for hybrid integrated circuit devices is
Generally, a ceramic multilayer wiring board is used. These wiring boards are usually manufactured by printing a thick layer and a thick insulating layer on an alumina green sheet, baking it, and then plating the monument surface layer. There was a drawback.

b) Pattern accuracy cannot be obtained due to shrinkage error of the substrate during firing.

(b) Since thick film conductors are printed, the conductor width is narrow and it is difficult to obtain a flat pattern.

(c) Many plating films have a two-layer structure of nickel, gold, etc., making the process complicated and expensive.

[Purpose of the invention]

The purpose of the present invention is to eliminate the above-mentioned drawbacks, to provide a flat, high-density,
K provides a substrate for a hybrid integrated circuit device having a highly accurate pattern at a low price.

[Structure of the invention]

The substrate for a hybrid integrated circuit device of the present invention is produced by alternately printing thick film conductor layers and thick film insulating layers on an alumina green sheet and baking them, and then attaching thin film conductors, thin film resistors, etc. to form a circuit. Configure.

[Explanation of Examples]

Next, embodiments according to the present invention will be described with reference to the drawings. 1st
The figure is a cross-sectional view of a substrate for a hybrid integrated circuit device according to the present invention and a diagram showing a method of manufacturing the same.

Alumina green sea) IK tungsten shell layer 2.3
and 4 and alumina insulating layers 5, 6 and 7 alternately by screen printing. At this time, through holes 8 are opened in the insulating layers 5, 6, 7 for electrically connecting the respective conductor layers. Next, in order to prevent oxidation of the conductor, it is fired in a reducing atmosphere to form a thick film multilayer wiring board (FIG. 1A).

Thereafter, a thin nichrome and gold film 9 is deposited on this substrate by sputtering or vapor deposition (FIG. 1B). Next K.

1. Etch the thin film conductor 9 to form a desired pattern using a photo-etching method.
), manufactured a substrate for a hybrid integrated circuit device.

[Effects of the invention] A hybrid output circuit formed by the method! ! The device substrate is made by printing a thick film on an alumina green sheet.
After firing, a thin film conductor layer is formed on the top layer, so
Since there is no shrinkage error of the substrate, a highly accurate, flat, and high-density pattern can be obtained, and since a complicated plating process is not necessary, it is inexpensive and highly reliable.

[Brief explanation of drawings]

FIG. 1 (5) to (q are cross-sectional views explaining the manufacturing process of an embodiment of the present invention. In the figures, 1...Alumina green sea), 2, 3.4, ... Thick film conductor layer, 5, 6.7
. . . thick film insulating layer, 8 . . . through hole, 9 . . . thin film conductor layer.

Claims (1)

[Claims] A hybrid circuit characterized in that a circuit is formed by depositing a thin film conductor, a thin film resistor, etc. on a multilayer wiring board formed by alternately printing thick film conductor layers and thick film insulating layers on an alumina green sheet and baking them. Substrate for integrated circuit devices.