JPS6155358U - - Google Patents
Info
- Publication number
- JPS6155358U JPS6155358U JP1985128599U JP12859985U JPS6155358U JP S6155358 U JPS6155358 U JP S6155358U JP 1985128599 U JP1985128599 U JP 1985128599U JP 12859985 U JP12859985 U JP 12859985U JP S6155358 U JPS6155358 U JP S6155358U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- diode element
- light emitting
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128599U JPS6155358U (enFirst) | 1985-08-22 | 1985-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128599U JPS6155358U (enFirst) | 1985-08-22 | 1985-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6155358U true JPS6155358U (enFirst) | 1986-04-14 |
Family
ID=30687227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128599U Pending JPS6155358U (enFirst) | 1985-08-22 | 1985-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6155358U (enFirst) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS503588A (enFirst) * | 1973-05-14 | 1975-01-14 | ||
| JPS5113374B1 (enFirst) * | 1970-08-13 | 1976-04-28 |
-
1985
- 1985-08-22 JP JP1985128599U patent/JPS6155358U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113374B1 (enFirst) * | 1970-08-13 | 1976-04-28 | ||
| JPS503588A (enFirst) * | 1973-05-14 | 1975-01-14 |