JPS6154572B2 - - Google Patents
Info
- Publication number
- JPS6154572B2 JPS6154572B2 JP1166583A JP1166583A JPS6154572B2 JP S6154572 B2 JPS6154572 B2 JP S6154572B2 JP 1166583 A JP1166583 A JP 1166583A JP 1166583 A JP1166583 A JP 1166583A JP S6154572 B2 JPS6154572 B2 JP S6154572B2
- Authority
- JP
- Japan
- Prior art keywords
- core
- thermosetting resin
- molding
- melting
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 description 4
- 229910017835 Sb—Sn Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910016338 Bi—Sn Inorganic materials 0.000 description 1
- 229910002975 Cd Pb Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
- B29C33/52—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles soluble or fusible
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は、中空の熱硬化性樹脂成形品の製造法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a hollow thermosetting resin molded article.
従来、低溶融合金、例えばBi−Cd−Pb,Bi−
Pb−Sb,Bi−Pb,Bi−Sn,Bi−Cd,Ca−Pb−
Sn等の三元共晶合金、Pb−Sb−Sn活字用合金か
らなる中子を用い熱硬化性樹脂を成形し、成形後
加熱することにより中子を溶融流出せしめること
により中空成形品を得ることが行なわれている。
この中空成形品に薬液等を収容する場合、成形品
内面は熱硬化性樹脂が露出しているので耐薬品性
が十分でなく、また高温のものを収容する場合耐
熱性に問題がある。そして、前記中子を用いる成
形品はアンダーカツトの成形品であることが多
く、内表面に保護膜を形成することは極めて困難
であつた。 Conventionally, low melting alloys such as Bi-Cd-Pb, Bi-
Pb−Sb, Bi−Pb, Bi−Sn, Bi−Cd, Ca−Pb−
A thermosetting resin is molded using a core made of a ternary eutectic alloy such as Sn, or a Pb-Sb-Sn type alloy, and the core is melted and flowed out by heating after molding to obtain a hollow molded product. things are being done.
When a chemical solution or the like is stored in this hollow molded product, the thermosetting resin is exposed on the inner surface of the molded product, so the chemical resistance is insufficient, and when a high temperature product is stored, there is a problem with heat resistance. Molded products using the core are often undercut molded products, and it is extremely difficult to form a protective film on the inner surface.
本発明は、内面に良好に保護膜を形成でき、耐
熱性、耐薬品性に優れた中空の熱硬化性樹脂成形
品を得られる製造法を提供するものである。 The present invention provides a manufacturing method capable of forming a protective film on the inner surface and obtaining a hollow thermosetting resin molded article having excellent heat resistance and chemical resistance.
本発明は、低溶融合金からなる中子の表面に金
属メツキを施しておき、この中子を用いて熱硬化
性樹脂を成形することを特徴とする。成形後、加
熱により中子を溶融除去すると、前記メツキ層が
成形品内面に転写された中空の熱硬化性樹脂成形
品が得られるわけである。金属メツキの種類は、
使用目的に応じて適宜選定できるが、その融点は
中子を形成する低溶融合金の融点より高いことが
必要である。 The present invention is characterized in that the surface of a core made of a low-melting alloy is plated with metal, and the core is used to mold a thermosetting resin. After molding, when the core is melted and removed by heating, a hollow thermosetting resin molded product with the plating layer transferred to the inner surface of the molded product is obtained. The types of metal plating are
It can be selected as appropriate depending on the purpose of use, but it is necessary that its melting point is higher than the melting point of the low-melting alloy forming the core.
次に、本発明の一実施例を説明する。 Next, one embodiment of the present invention will be described.
融点258℃のPb−Sb−Sn合金からなる中子の表
面にクロムメツキを施したものを用意し、これを
中子としてトランスフアー成形により口細のびん
状フエノール樹脂成形品を得た。成形条件は、金
型温度180℃、注入ポツト圧力500Kg/cm2、成形時
間5分である。成形後265℃のエアオーブン中で
20分間加熱し中子を溶融除去したところ、成形品
の内面に良好にクロムメツキが形成された。 A core made of a Pb-Sb-Sn alloy with a melting point of 258° C. whose surface was chromed was prepared, and this core was used as a core to obtain a narrow-mouthed bottle-shaped phenolic resin molded product by transfer molding. The molding conditions were a mold temperature of 180°C, an injection pot pressure of 500 kg/cm 2 , and a molding time of 5 minutes. After molding, in an air oven at 265℃
When heated for 20 minutes to melt and remove the core, good chrome plating was formed on the inner surface of the molded product.
尚、中子は、成形品の開口に相当する部分にメ
ツキを施さずにおけば、溶融除去の操作を円滑に
行なうことができる。また、中子の金属メツキ表
面には成形品内面との密着性が良好となる適当な
処理を施しておくとよい。 Incidentally, if the portion of the core corresponding to the opening of the molded product is not plated, the melting and removal operation can be carried out smoothly. Further, it is preferable that the metal-plated surface of the core is subjected to a suitable treatment to improve its adhesion to the inner surface of the molded product.
上述のように本発明は、中空の熱硬化性樹脂成
形品の内面に簡単にかつ良好に金属メツキの層を
形成することができ、その耐熱性、耐薬品性を向
上させて用途の拡大を図れる点その工業的価値は
極めて大なるものである。 As described above, the present invention allows a metal plating layer to be easily and effectively formed on the inner surface of a hollow thermosetting resin molded product, improves its heat resistance and chemical resistance, and expands its uses. Its industrial value is extremely large.
Claims (1)
脂を成形し成形後加熱することにより中子を溶融
流出せしめる中空成形品の製造において、中子表
面に該中子の融点より高い融点の金属メツキを施
しておき成形後に中子を溶融流出せしめて成形品
内面に該メツキ層を転写することを特徴とする熱
硬化性樹脂成形品の製造法。1. In the manufacture of hollow molded products in which a thermosetting resin is molded using a core made of a low-melting alloy and the core is melted and flowed out by heating after molding, the surface of the core is coated with a material with a melting point higher than that of the core. A method for producing a thermosetting resin molded article, which comprises applying metal plating and melting the core after molding to transfer the plating layer to the inner surface of the molded article.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1166583A JPS59136215A (en) | 1983-01-27 | 1983-01-27 | Preparation of thermosetting resin molded piece |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1166583A JPS59136215A (en) | 1983-01-27 | 1983-01-27 | Preparation of thermosetting resin molded piece |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59136215A JPS59136215A (en) | 1984-08-04 |
JPS6154572B2 true JPS6154572B2 (en) | 1986-11-22 |
Family
ID=11784275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1166583A Granted JPS59136215A (en) | 1983-01-27 | 1983-01-27 | Preparation of thermosetting resin molded piece |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59136215A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962003A (en) * | 1988-04-27 | 1990-10-09 | Lhymn Yoon O | Development of fusible alloy composites |
JPH09323365A (en) * | 1996-06-06 | 1997-12-16 | Toyota Autom Loom Works Ltd | Gas fuel tank and its molding method |
-
1983
- 1983-01-27 JP JP1166583A patent/JPS59136215A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59136215A (en) | 1984-08-04 |
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