JPS6153056A - Serial type thermal head - Google Patents

Abstract

PURPOSE:To prevent deterioration of picture quality under avoiding contact between a flat type platen and an IC for drive, and making a pressing force uniform by bending the substrate of a chip mounting section providing the IC for the drive, and the substrate of heat genrating section having a heat generation resistance body. CONSTITUTION:A section having a heat generation section 17 and a section (chip mounting section) having the IC19 for drive are provided to a solid state substrate 15, and it is bended at a boundary line of them, and the IC19 for the drive is located at a place lower than that of the heat generation section 17. The heat is generated from the heat generation resistance body of the heat generation section 17 through a driving circuit of the IC19 for the drive when a print instruction is outputted, a print is begun on a recording paper passing through between a flat type platen 14 and a thermal head 1. A carriage 21 is displaced in a scanning direction in a printing operation and a recording is carried out with an unused ink ribbon is supplied while an ink ribbon used in printing is winded up.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a serial type thermal head, and particularly to a thermal printer that uses a flat platen by bending the substrate so that the heat generating part is higher than the chip mounting part. This invention relates to a serial type thermal head that guarantees high image quality.

[Conventional technology]

As shown in FIG. 4, the conventional serial type thermal head 1 has a heat generating section 4 on the top surface of a flat solid state substrate 2, which has a heat generating resistor (not shown) that generates heat in response to a pulse signal based on image information. And a drive IC that has a drive circuit (not shown) that controls the printing operation of the heating resistor? (
(higher than the heat generating part). A connector 8 is provided at the end of the serial type thermal head 1. FIG. 5 shows an example in which the above-described serial type thermal head 1 is combined with a round platen 9 to configure a thermal printer.

Serial type thermal head 1 has ink ribbon cassette 1
It is also provided on the carriage 10.

(An ink ribbon cassette is not required for thermal recording paper.)

In the above configuration, the operation will be explained. When a print command is output, the heating element of the heating resistor section 4 generates heat via the drive circuit of the drive IC 7, and the recording is wound around the round platen and moved intermittently. Printing on paper 12 is started. In the printing operation, the carriage 10 moves in the scanning direction, winds up the ink ribbon 13 used for printing, and supplies unused ink ribbon to perform recording.

[Problem that the invention seeks to solve]

However, in conventional serial-type thermal heads, when using a solid-state board as a reference, the drive IC mounted next to the heat-generating resistor protrudes toward the platen side. When using a round platen, there is a problem that the drive IC comes into contact with the platen itself, which hinders smooth printing operations.Also, even when a round platen is used, the print surface of the recording paper 12 Because the surface is not smooth, there is a difference in the pressing force (point A
.

B and C), the image quality may deteriorate.

[Means and effects for solving the problems] The present invention has been made in view of the above, and is designed to be applicable to a thermal printer using a flat platen in which image quality does not deteriorate because the pressing force is uniform. To achieve this, a serial type thermal head is provided in which contact between the flat platen and the drive IC is avoided by bending a base substrate of a chip mounting part on which a drive IC is provided and a base substrate of a heat generating part having a heat generating resistor. It is something.

Hereinafter, a serial type thermal head according to the present invention will be described in detail with reference to the accompanying drawings.

〔Example〕

FIG. 1 shows an embodiment of the present invention, in which a heat generating resistor (not shown) is provided on the upper surface of a solid state substrate 15 made of, for example, alumina, which generates heat in response to a pulse signal based on image information. 17 and a drive IC 19 having a drive circuit (not shown) that controls the printing operation of the heating resistor.
are provided to constitute the serial type thermal head 1. A connector 20 is provided at the end of the serial type thermal head 1. The solid state board 15 has a part having the heat generating part 17 and a part having the drive IC 19 (chip mounting part), and is bent at the boundary between the parts, and the drive IC 19 is located at a lower position than the heat generating part 17. FIG. 2 shows an example of a thermal printer constructed by combining the serial type thermal head 1 and the flat platen 14 according to the present invention. The serial type thermal head 1 is provided on a carriage 21 together with an ink ribbon cassette 22.

In the above configuration, the operation will be explained. When a print command is output, the heating resistor of the heating unit 170 generates heat via the drive circuit of the drive IC 19, and the heating element passes between the flat platen 14 and the thermal head 1. Printing on the recording paper 23 is started. In the printing operation, the carriage 21 moves in the scanning direction, winds up the ink ribbon 24 used for printing, and supplies unused ink ribbon to perform recording. FIG. 3 shows the manufacturing process of a serial type thermal head according to the present invention. solid state board 15
The part having the heat generating part 17 and the drive IC 1
A space necessary for bending by a predetermined angle is provided at the boundary with the portion having a portion 9 (chip mounting portion), and the solid state board 15 is bent and fixed along the space. By manufacturing through the above steps, it is possible to employ process technology that is currently in practical use (current process technology cannot create a heating element or pattern on the bent portion). On the other hand, a heating element or a pattern may be created on a flexible film and then attached to a bent substrate.

〔Effect of the invention〕

As explained above, according to the serial type thermal head according to the present invention, by bending the base substrate of the chip mounting section where the drive IC is provided and the base substrate of the heat generating section having the heat generating resistor, the flat platen and the drive Since contact with the IC is avoided, the pressing force is uniform, so it can be applied to a thermal printer using a flat platen in which image quality does not deteriorate.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the structure of a serial type thermal head according to the present invention, FIG. 2 is an explanatory diagram of a thermal printer that combines the serial type thermal head according to the present invention and a flat platen, and FIG. 3 is an explanatory diagram of the present invention. Figure 4 is an explanatory diagram of the structure of a conventional serial type thermal head, and Figure 5 is an explanatory diagram of a thermal printer that combines a conventional serial type thermal head with a round platen. be. Explanation of symbols 1...Serial type thermal head 14...Flat type platen 15...Solid state board 16...Flexible board 17...Heating part 19
...rc for drive

Claims (1)

[Scope of Claims] A serial type thermal head that prints on recording paper on a flat platen by moving the thermal head in the scanning direction, which includes a bent substrate, a heat generating part provided on the substrate, and a drive IC. A serial type thermal head, characterized in that the heat generating section is provided at a higher position than the drive IC due to the shape of the substrate.