JPS6151750U - - Google Patents
Info
- Publication number
- JPS6151750U JPS6151750U JP13527184U JP13527184U JPS6151750U JP S6151750 U JPS6151750 U JP S6151750U JP 13527184 U JP13527184 U JP 13527184U JP 13527184 U JP13527184 U JP 13527184U JP S6151750 U JPS6151750 U JP S6151750U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- integrated circuit
- semiconductor element
- circuit device
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13527184U JPS6151750U (cs) | 1984-09-06 | 1984-09-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13527184U JPS6151750U (cs) | 1984-09-06 | 1984-09-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6151750U true JPS6151750U (cs) | 1986-04-07 |
Family
ID=30693764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13527184U Pending JPS6151750U (cs) | 1984-09-06 | 1984-09-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6151750U (cs) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04144159A (ja) * | 1990-10-04 | 1992-05-18 | Nec Corp | リードフレーム |
US12028987B2 (en) | 2021-04-26 | 2024-07-02 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
-
1984
- 1984-09-06 JP JP13527184U patent/JPS6151750U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04144159A (ja) * | 1990-10-04 | 1992-05-18 | Nec Corp | リードフレーム |
US12028987B2 (en) | 2021-04-26 | 2024-07-02 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |