JPS6149499U - - Google Patents

Info

Publication number
JPS6149499U
JPS6149499U JP13389384U JP13389384U JPS6149499U JP S6149499 U JPS6149499 U JP S6149499U JP 13389384 U JP13389384 U JP 13389384U JP 13389384 U JP13389384 U JP 13389384U JP S6149499 U JPS6149499 U JP S6149499U
Authority
JP
Japan
Prior art keywords
component
dip
roller
lead forming
dip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13389384U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13389384U priority Critical patent/JPS6149499U/ja
Publication of JPS6149499U publication Critical patent/JPS6149499U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第4図、第6図は従来のリード成形機の実施例
を示し、第5図、第7図はそれぞれの前から見た
図を示す。 1:DIP部品、2:シユート、3:リード成
形型、4:ガイドローラ、5,7:モータ、6:
成形ローラ。 第1図は本考案の一実施例を示す図であり、第
2図は前から見た図を示す。 8:成形ローラ、9:モータ、10:ガイドロ
ーラ、11:モータ。 第3図はガイドローラ形状の例を示す。
4 and 6 show examples of conventional lead forming machines, and FIGS. 5 and 7 show views from the front of each. 1: DIP parts, 2: Shute, 3: Lead mold, 4: Guide roller, 5, 7: Motor, 6:
forming roller. FIG. 1 shows an embodiment of the present invention, and FIG. 2 shows a view from the front. 8: Forming roller, 9: Motor, 10: Guide roller, 11: Motor. FIG. 3 shows an example of the shape of the guide roller.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] DIP(Dua1 In−1ine Paka
ge)部品のリードをプリント基板等の取付孔に
挿入しやすい形状に成形する装置において、DI
P部品収納ケース保持部、DIP部品をケースか
らリード成形ローラへ送り込むためのシユート部
、リード成形ローラ、リード成形時、リード成形
ローラとDIP部品パツケージとの相対位置決め
を行なうと共にDIP部品を移動させるガイドロ
ーラから構成され、ガイドローラ外周が凹状の溝
となつており、DlP部品に接続する機構部品が
全て金属のような導電性材料でできており、アー
スされていることを特徴とするDIP部品リード
成形機。
DIP (Dua1 In-1ine Paka
ge) In a device that molds the leads of a component into a shape that is easy to insert into the mounting hole of a printed circuit board, etc., the DI
P component storage case holding section, chute section for feeding the DIP component from the case to the lead forming roller, lead forming roller, guide for relative positioning between the lead forming roller and the DIP component package during lead forming and for moving the DIP component. A DIP component lead consisting of a roller, with a concave groove on the outer periphery of the guide roller, and all mechanical components connected to the DIP component are made of conductive material such as metal and are grounded. Molding machine.
JP13389384U 1984-09-05 1984-09-05 Pending JPS6149499U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13389384U JPS6149499U (en) 1984-09-05 1984-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13389384U JPS6149499U (en) 1984-09-05 1984-09-05

Publications (1)

Publication Number Publication Date
JPS6149499U true JPS6149499U (en) 1986-04-03

Family

ID=30692421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13389384U Pending JPS6149499U (en) 1984-09-05 1984-09-05

Country Status (1)

Country Link
JP (1) JPS6149499U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020177983A (en) * 2019-04-16 2020-10-29 パナソニックIpマネジメント株式会社 Component supply apparatus, component mounting apparatus, and component supply method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020177983A (en) * 2019-04-16 2020-10-29 パナソニックIpマネジメント株式会社 Component supply apparatus, component mounting apparatus, and component supply method

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