JPS6149499U - - Google Patents
Info
- Publication number
- JPS6149499U JPS6149499U JP13389384U JP13389384U JPS6149499U JP S6149499 U JPS6149499 U JP S6149499U JP 13389384 U JP13389384 U JP 13389384U JP 13389384 U JP13389384 U JP 13389384U JP S6149499 U JPS6149499 U JP S6149499U
- Authority
- JP
- Japan
- Prior art keywords
- component
- dip
- roller
- lead forming
- dip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000015414 Urena lobata Nutrition 0.000 claims 1
- 240000006064 Urena lobata Species 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Description
第4図、第6図は従来のリード成形機の実施例
を示し、第5図、第7図はそれぞれの前から見た
図を示す。
1:DIP部品、2:シユート、3:リード成
形型、4:ガイドローラ、5,7:モータ、6:
成形ローラ。
第1図は本考案の一実施例を示す図であり、第
2図は前から見た図を示す。
8:成形ローラ、9:モータ、10:ガイドロ
ーラ、11:モータ。
第3図はガイドローラ形状の例を示す。
4 and 6 show examples of conventional lead forming machines, and FIGS. 5 and 7 show views from the front of each. 1: DIP parts, 2: Shute, 3: Lead mold, 4: Guide roller, 5, 7: Motor, 6:
forming roller. FIG. 1 shows an embodiment of the present invention, and FIG. 2 shows a view from the front. 8: Forming roller, 9: Motor, 10: Guide roller, 11: Motor. FIG. 3 shows an example of the shape of the guide roller.
Claims (1)
ge)部品のリードをプリント基板等の取付孔に
挿入しやすい形状に成形する装置において、DI
P部品収納ケース保持部、DIP部品をケースか
らリード成形ローラへ送り込むためのシユート部
、リード成形ローラ、リード成形時、リード成形
ローラとDIP部品パツケージとの相対位置決め
を行なうと共にDIP部品を移動させるガイドロ
ーラから構成され、ガイドローラ外周が凹状の溝
となつており、DlP部品に接続する機構部品が
全て金属のような導電性材料でできており、アー
スされていることを特徴とするDIP部品リード
成形機。 DIP (Dua1 In-1ine Paka
ge) In a device that molds the leads of a component into a shape that is easy to insert into the mounting hole of a printed circuit board, etc., the DI
P component storage case holding section, chute section for feeding the DIP component from the case to the lead forming roller, lead forming roller, guide for relative positioning between the lead forming roller and the DIP component package during lead forming and for moving the DIP component. A DIP component lead consisting of a roller, with a concave groove on the outer periphery of the guide roller, and all mechanical components connected to the DIP component are made of conductive material such as metal and are grounded. Molding machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13389384U JPS6149499U (en) | 1984-09-05 | 1984-09-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13389384U JPS6149499U (en) | 1984-09-05 | 1984-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6149499U true JPS6149499U (en) | 1986-04-03 |
Family
ID=30692421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13389384U Pending JPS6149499U (en) | 1984-09-05 | 1984-09-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6149499U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020177983A (en) * | 2019-04-16 | 2020-10-29 | パナソニックIpマネジメント株式会社 | Component supply apparatus, component mounting apparatus, and component supply method |
-
1984
- 1984-09-05 JP JP13389384U patent/JPS6149499U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020177983A (en) * | 2019-04-16 | 2020-10-29 | パナソニックIpマネジメント株式会社 | Component supply apparatus, component mounting apparatus, and component supply method |
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