JPS6147700A - Electronic circuit package assembling structure - Google Patents

Electronic circuit package assembling structure

Info

Publication number
JPS6147700A
JPS6147700A JP16893584A JP16893584A JPS6147700A JP S6147700 A JPS6147700 A JP S6147700A JP 16893584 A JP16893584 A JP 16893584A JP 16893584 A JP16893584 A JP 16893584A JP S6147700 A JPS6147700 A JP S6147700A
Authority
JP
Japan
Prior art keywords
cooling body
circuit board
printed circuit
electronic circuit
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16893584A
Other languages
Japanese (ja)
Inventor
高本 光男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16893584A priority Critical patent/JPS6147700A/en
Publication of JPS6147700A publication Critical patent/JPS6147700A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子回路パッケージの組立構造に関するもので
、特にプリント基板上に搭載された集積回路素子(以下
LSIという)などの回路素子からの熱を放熱する効果
が優れた電子回路パッケージの組立構造に関するもので
ある。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an assembly structure of an electronic circuit package, and in particular to a method for dissipating heat from circuit elements such as integrated circuit elements (hereinafter referred to as LSI) mounted on a printed circuit board. The present invention relates to an assembly structure for an electronic circuit package that has excellent effects.

従来の技術 従来、この種の電子機器に使用される電子回路パッケー
ジは、プリント基板上に複数個のLSI等の回路素子を
搭載して構成されている。回路素子の中には、多くの場
合、幾つかの高電力回路素子も含まれているので、送風
機によシ強制空冷される構造が一般的であるが、使用環
境が著しく悪く電子回路部品を外気から遮断しなければ
ならないプロセス制御機器や、また近年の回路素子技術
の発展に伴う高密度に実装された電子計算機等において
は1回路素子からの熱を直接伝導によシ冷媒に移送する
熱伝導冷却構造がとられている。
2. Description of the Related Art Conventionally, electronic circuit packages used in electronic devices of this type are constructed by mounting a plurality of circuit elements such as LSIs on a printed circuit board. Since the circuit elements often include several high-power circuit elements, a structure in which forced air cooling is generally performed using a blower is common, but the operating environment is extremely poor and the electronic circuit components cannot be used. In process control equipment that must be isolated from the outside air, and electronic computers that are densely packed due to the recent development of circuit element technology, heat from one circuit element is transferred to the refrigerant by direct conduction. A conduction cooling structure is used.

第5図は従来のこの種の熱伝導の放熱構造をとる電子回
路パッケージの一例を示した側面図であって、プリント
基板1に直接取り付けられた複数個のLSI等の回路素
子2の上面に、冷却板3を取付具4とねじ5にて圧着す
る構造がとられている。この構造によると、回路素子2
からの熱は冷却板3に伝えられ、この冷却板3の内部に
流す水等の冷媒6に放出される。しかしながら、上記従
来構造では、回路素子2と冷却板3の接触部が伝熱上問
題になる。すなわち各回路素子2に対して良好な放熱特
性を保たせるためにi−t、複数個の回路素子2の表面
の高さを揃える必要があシ、寸た各回路素子2に対して
均一な力が加わるようにしなければならないが、回路素
子2の外形のばらつき、プリント基板10反シやねじれ
、プリント基板側に対する回路素子2の浮きや傾き等が
発生し、冷却板3との接触を均一に保たせることは困離
であった。第5図には、これを極端にあられしである。
FIG. 5 is a side view showing an example of a conventional electronic circuit package having this type of heat conduction heat dissipation structure, in which the upper surface of a plurality of circuit elements 2 such as LSIs directly attached to a printed circuit board 1 is shown. , a structure is adopted in which the cooling plate 3 is crimped to a fixture 4 and screws 5. According to this structure, the circuit element 2
The heat from the cooling plate 3 is transmitted to the cooling plate 3 and released to a coolant 6 such as water flowing inside the cooling plate 3. However, in the conventional structure described above, the contact portion between the circuit element 2 and the cooling plate 3 poses a problem in terms of heat transfer. That is, in order to maintain good heat dissipation characteristics for each circuit element 2, it is necessary to make the surface heights of a plurality of circuit elements 2 the same, and to maintain a uniform height for each circuit element 2. However, it is necessary to ensure that the contact with the cooling plate 3 is uniform due to variations in the external shape of the circuit element 2, warping or twisting of the printed circuit board 10, lifting or tilting of the circuit element 2 with respect to the printed circuit board side, etc. It was difficult to keep it that way. Figure 5 shows this in extreme detail.

第6図は上記の問題を一部解決するようにした従来の他
の例の構造を示す図であって、回路素子2と冷却板3間
に金属はね、熱伝導性ゴム等可撓性を有する良熱伝導物
質7f:介在させる手段がとられているが、伝熱径路が
長くなることによバ放熱特性が悪化し、また熱伝導性ゴ
ム等を使用する場合は、厚さ方向の可撓性が少ないため
、各回路素子の高さのばらつきをかなシ厳密に揃えなけ
ればならカいといった欠点を有していた。第6図はこれ
を極端に示している。
FIG. 6 is a diagram showing the structure of another conventional example that partially solves the above-mentioned problem. A good heat conductive material 7f having Since it has little flexibility, it has the disadvantage that variations in the height of each circuit element must be precisely aligned. Figure 6 shows this to an extreme.

発明が解決しようとする問題点 本発明の目的は、上記の欠点すなわち、良熱伝導物質の
厚さ方向の可撓性の不足による不十分な熱接触や、伝導
物質の介在による伝熱径路が長くなるという問題点を解
決する。電子回路パッケージ組立構造を提供することに
ある。
Problems to be Solved by the Invention The purpose of the present invention is to solve the above-mentioned drawbacks, namely, insufficient thermal contact due to lack of flexibility in the thickness direction of the good heat conductive material, and heat transfer paths due to the interposition of the conductive material. Solve the problem of length. An object of the present invention is to provide an electronic circuit package assembly structure.

問題点を解決するための手段 本発明は上述の問題点を解決するために、プリント基板
上に、上面中央部に中心部が突出した弾性体が収容され
周囲にコンタクトが配設された複数のソケットを搭載し
、これら複数のツク、トのおのおのに収容された前記弾
性体に対向して回路素子を実装し、更にこれら複数個の
回路素子上に共通の放熱用冷却体をプリント基板に対面
して配置し、これら冷却体とプリント基板とを締め付け
て組立てることにより、前記ソケット内の弾性体の中心
突出部が回路素子により押圧され、その反発弾性力によ
シ複数の回路素子のおのおのと冷却体との間に熱伝導に
十分有効な接触圧力が得られるようにしたものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a printed circuit board with a plurality of elastic bodies each having a protruding central portion housed in the center of the upper surface and contacts arranged around the printed circuit board. A socket is mounted, a circuit element is mounted facing the elastic body accommodated in each of the plurality of sockets, and a common heat dissipation cooling body is mounted on the plurality of circuit elements facing the printed circuit board. By tightening and assembling these cooling bodies and the printed circuit board, the central protrusion of the elastic body in the socket is pressed by the circuit elements, and the repulsive elastic force causes each of the plurality of circuit elements to It is designed to provide sufficient contact pressure for heat conduction between the cooling body and the cooling body.

作用 本発明は上述のように構成したので、複数の回路素子の
おのおのが弾性体の圧縮による反発弾性力によυ放熱用
冷却体に密着するようになυ、これによシ回路素子から
発生する熱を十分に冷却体を通して放散させることがで
きる。
Operation Since the present invention is configured as described above, each of the plurality of circuit elements comes into close contact with the heat dissipation cooling body due to the repulsion elastic force caused by the compression of the elastic body, thereby reducing the heat generated from the circuit elements. This heat can be sufficiently dissipated through the cooling body.

実施例 次に、本発明の実施例について図面を参照して説明する
Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

本発明の一実施例を斜視図で示す第1図を参照すると、
本発明の電子回路パッケージの組立構造は、プリント基
板10と、これに搭載され次複数のソケット20と、こ
れらのソケットの各々に実装された複数の回路素子30
と、冷媒注入管51゜流路52.冷媒排出管53’t−
有する冷却体50と、この冷却体50を保持固定するス
ペーサ60と、ねじ70とから構成される。
Referring to FIG. 1, which shows a perspective view of an embodiment of the present invention,
The electronic circuit package assembly structure of the present invention includes a printed circuit board 10, a plurality of sockets 20 mounted on the printed circuit board 10, and a plurality of circuit elements 30 mounted on each of these sockets.
and a refrigerant injection pipe 51° flow path 52. Refrigerant discharge pipe 53't-
The cooling body 50 has a cooling body 50, a spacer 60 for holding and fixing the cooling body 50, and a screw 70.

第2図は上記回路素子30の下面から見た斜視図であっ
て、ケース3Lの下面にチップ32を搭載し、このテッ
プ32を保護するキャップ33が取シ付けられ、四辺に
は複数の入出カビ/34が設けられている。
FIG. 2 is a perspective view of the circuit element 30 as seen from the bottom surface, in which a chip 32 is mounted on the bottom surface of the case 3L, a cap 33 is attached to protect the chip 32, and there are multiple entrances and exits on the four sides. Mold/34 is provided.

第3図は冷却体50を取シ付ける以前、第4図は冷却体
50を取シ付けた後の第1図のA−A断面図であシ、ソ
ケット20には複数のコンタクト21がハウジング23
の周囲に配置されておシ、これら複数のコンタクト21
はプリント基板LOに半田付けして取シ付けられる。ま
た笠状でかつ周辺に切込みをもつ板ばね22がハウジン
グ23の中央部に収容されておシ、この板ばね22を上
から押し友時の変位を横に逃がす機能を持たすため、ハ
ウジング23に固定せず、ハウジング内の8部内をスラ
イドするようになっている。第3図に示す冷却体50を
取シ付ける以前は、板ばね22がキャップ33に接した
状態となっておシ、この時入出力ビン34はコンタク)
21に摺動可能に接触した状態で嵌合している。次に第
4図に示すように、冷却体501cプリント基板10上
のスペーサ60にねじ70を使用して取シ付けると、板
はね22には変位量tに相当したばね力が発生し、回路
素子30を冷却体50に密着させる。
FIG. 3 is a sectional view taken along the line A-A in FIG. 1 before the cooling body 50 is installed, and FIG. 4 is a sectional view taken along the line A-A in FIG. 1 after the cooling body 50 is installed. 23
These multiple contacts 21 are arranged around the
is attached to the printed circuit board LO by soldering. In addition, a leaf spring 22 that is shaped like a cap and has a notch around the periphery is housed in the center of the housing 23. It is not fixed, but slides within the 8 parts inside the housing. Before installing the cooling body 50 shown in FIG. 3, the leaf spring 22 was in contact with the cap 33, and at this time the input/output bin 34 was in contact.)
21 in a slidably contacting state. Next, as shown in FIG. 4, when the cooling body 501c is attached to the spacer 60 on the printed circuit board 10 using the screws 70, a spring force corresponding to the displacement amount t is generated in the plate spring 22. The circuit element 30 is brought into close contact with the cooling body 50.

なお、板はね22はコンタクト2Lと入出カビ/34間
の保持力よシも大きな力が発生するように、ばねのスチ
フネスとスペーサ60の高さ+11’i5設計で考慮し
、前記保持力で回路素子30の自由な動きが制限され、
回路素子30と冷却体50との密着に不具合がないよう
になっている。
In addition, the stiffness of the spring and the height of the spacer 60 + 11'i5 are taken into account in the design so that the plate spring 22 generates a force larger than the holding force between the contact 2L and the mold/output mold/34, and the above holding force is taken into account. Free movement of circuit element 30 is restricted;
There is no problem in the close contact between the circuit element 30 and the cooling body 50.

以上のような構成にすることによシ、回路素子30の外
形のばらつき、プリント基板の反シやねじれ、プリント
基板に対する回路素子30の浮きや傾き等は板はね22
によシ吸収でき、冷却体50の接触を均一にしかも安定
に実現できる。また、チップ32にて発生した熱はケー
ス31に伝わシ、前述した密着接触面を介して冷却体5
0まで伝導され、第1図において注入管51よシ流入し
つづら折シ状の流路52中を流れる水等の冷媒に吸収さ
れて、排出管53から流出する。
With the above configuration, variations in the external shape of the circuit element 30, warping or twisting of the printed circuit board, floating or tilting of the circuit element 30 with respect to the printed circuit board, etc. can be prevented by the board spring 22.
This allows for uniform and stable contact with the cooling body 50. Further, the heat generated in the chip 32 is transmitted to the case 31, and the heat generated by the chip 32 is transferred to the cooling body 5 through the above-mentioned close contact surface.
In FIG.

なお1本実施例では、冷却体内部に冷媒を循環している
が、ヒートパイプとか銅やアルミiで遠くまで移送後放
熱しても良い。また冷却体自身多数枚のフィンで形成さ
れるヒートシンクでも良い。
In this embodiment, the refrigerant is circulated inside the cooling body, but heat pipes, copper or aluminum may be used to transport the refrigerant to a long distance and then dissipate the heat. Alternatively, the cooling body itself may be a heat sink formed of a large number of fins.

板ばねの代わシにベローズ、コイルはね等を用いてもよ
く、またゴム等の弾性材料などの弾性体も用いることが
できる。
Bellows, coil springs, etc. may be used instead of leaf springs, and elastic bodies such as elastic materials such as rubber may also be used.

発明の効果 以上に説明したように、本発明によれば、ソケット内の
弾性体で被冷却回路素子を冷却体に押し付けるように構
成したので、回路素子の高さのばらつきを吸収し、冷却
体と回路素子との間に熱伝導物質を介在させることなく
、均一でかつ安定な密着接触が得られ、伝熱径路が最短
に形成されることになシ、効率のよい放熱が可能になる
という効果がある。
Effects of the Invention As explained above, according to the present invention, since the circuit element to be cooled is pressed against the cooling body by the elastic body in the socket, variations in the height of the circuit elements are absorbed and the cooling body It is said that uniform and stable close contact can be obtained without interposing a thermally conductive material between the circuit element and the circuit element, and that the heat transfer path is formed in the shortest possible length, enabling efficient heat dissipation. effective.

【図面の簡単な説明】[Brief explanation of the drawing]

第り図は本発明による電子回路パッケージの組立構造を
示す斜視図、第2図は本発明に用いられる回路素子の斜
視図、第3図は第1図のA−A一部分断面図で冷却体未
実装の状態図、第4図は第1図のA−A部分断面図で冷
却体が実装された状態図、第5図は従来の電子回路パッ
ケージの組立構造の一例を示す側断面図、第6図は同じ
く他の従来例を示す側断面図である。 1・・・・・・プリント基板、2・・・・・・回路素子
、3・・・・・・冷却体、4・・・・・・取付具、5・
・・・・・ねじ、6・・・・・・冷媒、7・・・・・・
良熱伝導物質、io・・・・・・プリント基板、20・
・・・・・ソケット、21・・・・・・コンタクト、2
2・・・・・・板ばね、23・・・・・・ハウジング、
30・・・・・・回路素子、31・・・・・・ケース、
32・・・・・・チップ、33・・団・キャップ、34
・・・・・・入出力ビン、5o・・・−・冷却体、51
・ ・・・・・・注入管、52・・・・・・流路、53
・・・・・・排出管、60・・・・・・スペーサ、70
・・・・・・ねじ、B・旧・・板ばねスライド部、1−
一・・変位量、m・・・・・・スペーサ60の高さ。 察 1 回 茶3 回 ネ4 図
Fig. 2 is a perspective view showing the assembly structure of an electronic circuit package according to the present invention, Fig. 2 is a perspective view of a circuit element used in the invention, and Fig. 3 is a partial cross-sectional view taken along A-A of Fig. 1, showing a cooling body. FIG. 4 is a partial sectional view taken along the line A-A in FIG. 1 with a cooling body mounted; FIG. 5 is a side sectional view showing an example of the assembly structure of a conventional electronic circuit package; FIG. 6 is a side sectional view showing another conventional example. 1...Printed circuit board, 2...Circuit element, 3...Cooling body, 4...Mounting tool, 5...
...Screw, 6...Refrigerant, 7...
Good thermal conductive material, io...Printed circuit board, 20.
...Socket, 21 ...Contact, 2
2... Leaf spring, 23... Housing,
30...Circuit element, 31...Case,
32... Chip, 33... Group/Cap, 34
...Input/output bin, 5o...Cooling body, 51
・・・・Injection pipe, 52・・・Flow path, 53
...Discharge pipe, 60...Spacer, 70
・・・・・・Screw, B・Old・Leaf spring slide part, 1-
1. Displacement amount, m... Height of the spacer 60. 1st time tea 3rd time 4th figure

Claims (1)

【特許請求の範囲】[Claims] プリント基板と、前記プリント基板に搭載され上面中央
部に中心部が突出した弾性体が収容され周囲にコンタク
トが配設された複数個のソケットと、前記複数個のソケ
ットのそれぞれに前記弾性体に対向して実装される複数
個の回路素子と、前記複数個の回路素子上に前記プリン
ト基板に対面して配置される共通の冷却体とからなり、
前記プリント基板と前記冷却体とを締め付けて組立てる
ことにより、前記ソケット内の弾性体の中心突出部が前
記回路素子により押圧され、その反発弾性力により前記
複数の回路素子のおのおのと前記冷却体との間に熱伝導
に十分有効な接触圧力が得られるように構成したことを
特徴とする電子回路パッケージ組立構造。
a printed circuit board; a plurality of sockets that are mounted on the printed circuit board and house an elastic body whose center portion protrudes from the center of the upper surface and are provided with contacts around the periphery; consisting of a plurality of circuit elements mounted facing each other, and a common cooling body disposed on the plurality of circuit elements facing the printed circuit board,
By tightening and assembling the printed circuit board and the cooling body, the central protrusion of the elastic body in the socket is pressed by the circuit element, and the repulsive elastic force causes each of the plurality of circuit elements to contact the cooling body. What is claimed is: 1. An electronic circuit package assembly structure characterized in that the electronic circuit package assembly structure is configured such that contact pressure sufficiently effective for heat conduction can be obtained between the steps.
JP16893584A 1984-08-13 1984-08-13 Electronic circuit package assembling structure Pending JPS6147700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16893584A JPS6147700A (en) 1984-08-13 1984-08-13 Electronic circuit package assembling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16893584A JPS6147700A (en) 1984-08-13 1984-08-13 Electronic circuit package assembling structure

Publications (1)

Publication Number Publication Date
JPS6147700A true JPS6147700A (en) 1986-03-08

Family

ID=15877268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16893584A Pending JPS6147700A (en) 1984-08-13 1984-08-13 Electronic circuit package assembling structure

Country Status (1)

Country Link
JP (1) JPS6147700A (en)

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