JPS6142830U - Lead attachment device - Google Patents

Lead attachment device

Info

Publication number
JPS6142830U
JPS6142830U JP1984127117U JP12711784U JPS6142830U JP S6142830 U JPS6142830 U JP S6142830U JP 1984127117 U JP1984127117 U JP 1984127117U JP 12711784 U JP12711784 U JP 12711784U JP S6142830 U JPS6142830 U JP S6142830U
Authority
JP
Japan
Prior art keywords
attachment device
lead attachment
lead frame
lead
sliding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984127117U
Other languages
Japanese (ja)
Other versions
JPS6242526Y2 (en
Inventor
直人 若生
Original Assignee
東北金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東北金属工業株式会社 filed Critical 東北金属工業株式会社
Priority to JP1984127117U priority Critical patent/JPS6142830U/en
Publication of JPS6142830U publication Critical patent/JPS6142830U/en
Application granted granted Critical
Publication of JPS6242526Y2 publication Critical patent/JPS6242526Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】 第1図は本考案の一例を示す一部破断した斜視図、第2
図及び第3図は同じく一部破断した平面図及び断面図、
第4図及び第5図は本考案の動作の説明に供する一部破
断した平面図及び断面図である。 10・・・器具本体、14,42・・・円孔、18・・
・電子部品、,20.30・・・各リードフレーム、2
3,33・・・各リード、40・・・摺動板。
[Brief Description of the Drawings] Fig. 1 is a partially cutaway perspective view showing an example of the present invention;
The figure and FIG. 3 are a partially broken plan view and a sectional view,
4 and 5 are a partially broken plan view and a sectional view for explaining the operation of the present invention. 10... Instrument body, 14, 42... Circular hole, 18...
・Electronic components, 20.30...Each lead frame, 2
3, 33...each lead, 40...sliding plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 器具本体に、リードフレームを移動するためのピンを有
した摺動板を摺動自在に設け、前記リードフレームを横
方向に摺動させることにより、電子部品をリードフレー
ムに挾み込むように構成したことを特徴とするリード取
り付け装置。
A sliding plate having a pin for moving the lead frame is slidably provided on the device body, and the electronic component is inserted into the lead frame by sliding the lead frame laterally. A lead attachment device characterized by:
JP1984127117U 1984-08-22 1984-08-22 Lead attachment device Granted JPS6142830U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984127117U JPS6142830U (en) 1984-08-22 1984-08-22 Lead attachment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984127117U JPS6142830U (en) 1984-08-22 1984-08-22 Lead attachment device

Publications (2)

Publication Number Publication Date
JPS6142830U true JPS6142830U (en) 1986-03-19
JPS6242526Y2 JPS6242526Y2 (en) 1987-10-31

Family

ID=30685767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984127117U Granted JPS6142830U (en) 1984-08-22 1984-08-22 Lead attachment device

Country Status (1)

Country Link
JP (1) JPS6142830U (en)

Also Published As

Publication number Publication date
JPS6242526Y2 (en) 1987-10-31

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