JPS6142476A - Method and jig for soldering - Google Patents

Abstract

PURPOSE:To improve reliability of bonding by pressure-contacting an object to be bonded to the body of a part through solder foil and soldering by high-frequency induction heating under this condition. CONSTITUTION:Flux is coated on the upper end face of the body 1, inserted into an insertion hole 16, and solder foil is put on the upper face. Then, flux is coated on the lower face of of an object to be bonded, and inserted to a guide groove. A clamping plate 17 is put on a part holder plate and fixed with screws 19. That is, the solder foil 3 is held by the body 1 of the part and elastic force of the compression coil spring 11 of the object 2 to be bonded and pressure- welded. Then, positioned body 1 of the part and the object 2 to be bonded are heated in high-frequency induction way under pressure welded state. By this method, the solder foil 3 is melted in a short time, soldering is made surely without evaporation of the flux. Accordingly, the reliability of bonding is improved, and at the same time, its work efficiency is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering method and a soldering jig for electronic equipment components that require high adhesion position accuracy.

Many electronic device parts require good electrical conductivity and high precision bonding positions.

For example, as shown in the perspective view before fixing in (a) of FIG. 4 and the side view after fixing in FIG. When bonding two pieces of objects 2 (for example, porcelain plates) in parallel, it is required that the contact end surfaces of the pair of objects 2 be located at the center of the component body 1.

In such a case, a positioning jig is used to position the component body 1 and the object to be bonded 2, and flux is applied to the upper end surface of the component body 1 and the lower surface of the object to be bonded 2, respectively. Insert the solder foil 3 in between and heat and melt the solder layer 3.
It is common to use A and solder.

[Conventional technology]

Conventionally, a jig as shown in the perspective view of Fig. 5 is used, and after the relative position between the component body 1 and the object to be bonded 2 is determined, the jig is sent into a heating furnace to perform soldering. are doing.

In FIG. 5, the positioning jig made of metal is composed of a rectangular jig main body 4 into which the component main body 1 is inserted, and a pair of guide plates 6 that sandwich the adherend 2 in a parallel state.

The upper surface of the jig body 4 is provided with a recess 8 into which the pair of guide plates 6 are inserted with the end surfaces of the guide grooves 7 in contact with each other, and the component main body 1 is vertically loosely inserted into the bottom of the recess 8. The component insertion holes 5 are arranged in parallel.

In the rectangular guide plate 6, guide grooves 7 into which the objects 2 to be bonded are inserted in parallel are provided on the abutting longitudinal side surface, corresponding to the component insertion holes 5.

The component body 1 is inserted into the component insertion hole 5 of such a jig, and the solder foil 3 is placed on each of its upper end surfaces. Thereafter, the guide plate 6 is inserted into the recess 8, and the objects 2 to be adhered are inserted in parallel into the guide portions formed in the rectangular shape by the guide grooves 7, respectively.

As a result, the contact end surface of the adhered object 2 can be
corresponds to the center of

In this manner, with the relationship and position between the component body 1 and the bonded object 2 fixed, the jig is sent into the heating furnace to melt the solder foil 3 and perform soldering.

[Problem that the invention seeks to solve]

However, in the conventional soldering method described above, it takes a long time (several minutes) for the solder foil to rise to the melting temperature.

For this reason, there are problems in that the flux evaporates and the reliability of soldering decreases, and that the work time is long and work efficiency is poor.

[Means for solving problems]

The problem with the above conventional method is that the vertical component insertion holes into which the component bodies are inserted are arranged side by side in a row, and the upper end of each component insertion hole is provided with a guide groove for positioning the adhered object. A square component holder plate, a clamp plate made of a magnetic material that presses the upper surface of the adhered object inserted into the guide groove, and a pin guide hole arranged in parallel corresponding to the component insertion hole. The lower end surface of the component body is moved by the elasticity of the spring seated on the pin guide plate made of a magnetic material fixed to the lower surface of the component holder plate and the spring holder plate made of magnetic material fixed to the lower part of the pin guide plate. According to the present invention, a jig is used for soldering, and the soldering is carried out by a high-frequency induction heating means. This problem is solved by the means of the present invention, in which the object to be adhered is soldered to the main body of the component.

[Effect]

According to the above-mentioned means of the present invention, since the jig is a magnetic material for soldering in which the component body and the adhered object are pressed and positioned via solder foil, the induction coil is attached to the outside of the jig, and the high-frequency When a high-frequency magnetic field is generated by applying , the jig and solder foil heat up in a short time due to eddy current loss.

Therefore, the flux does not evaporate and highly reliable soldering can be performed.

〔Example〕

The gist of the present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

Fig. 1 is a perspective view showing an embodiment of the jig according to the present invention in separated form, Fig. 2 is a sectional view of a main part, and Fig. 3 is a perspective view of an induction coil.

1 and 2, a plate-shaped spring holder plate 10 made of a heat-resistant metal magnetic material (for example, magnetic stainless steel)
Spring insertion holes 10a are arranged in parallel on the upper surface of the spring insertion hole 10a, and screw holes 10b are provided at both ends of the parallel spring insertion holes 10a, through which fixing screws 18 pass loosely from below.

The pin guide plate 13, which is closely attached to the upper surface of the spring holder plate 10, is a plate made of a heat-resistant metal magnetic material (for example, magnetic stainless steel), and has pin guides arranged in correspondence with the spring insertion holes 10a. Holes 13a are arranged in parallel, and screw holes 1
A screw hole 13b is provided corresponding to the hole 0b.

The support pin 12 is configured such that a flange portion formed at the bottom is inserted into the spring insertion hole 10a, and a pin portion at the top passes through the pin guide hole 13a. Support pin 1
2, the lower end surface of the flange is pressed by the compression coil spring 11 inserted into the spring insertion hole 10a, and the upper end surface of the pin portion presses the component main body l inserted into the component holder plate 14 upward. .

The component holder plate 14 attached to the upper part of the pin guide plate 13 via the spacer tube 21 shown in FIG. Component insertion holes 16 into which the components are loosely inserted are arranged vertically in parallel. Further, on the upper surface of the component holder plate 14, a guide groove 15 into which a pair of adherends 2 are inserted in parallel is provided in the second part of each component insertion hole 16.

This component holder plate 14 has screw holes 1 provided at both ends.
A fixing screw 18 is screwed onto 4b from below and is fixed integrally with the spring holder plate 10 and pin guide plate 13.

To attach the component body 1 and the adhered object 2 to this jig, first, flux is applied to the two end surfaces of the component body 1, and the jig is inserted into the component insertion hole 16. Solder foil 3 is placed on the upper surface of component body 1. Next, flux is applied to the lower surface of the object 2 to be adhered, and the object 2 is inserted into the guide groove 15. After that, the clamp plate 17 made of a magnetic plate is placed on the two sides of the component holder plate 14, the fixing screw 19 is inserted into the screw hole 17b, and the fixing screw 19 is screwed into the screw hole 14b of the component holder plate 14. do.

As a result, the lower end surface of the object to be adhered 2 and the upper end surface of the component body 1 are brought into pressure contact with each other by sandwiching the solder foil 3 by the elasticity of the compression coil spring 11.

After positioning the component body 1 and the object 2 for bonding in this way, the jig is placed inside the induction coil 25 provided with a pair of coil element bars 252 parallel to each other in the longitudinal direction, as shown in FIG. , and a high-frequency current is applied to the induction coil 25.

Since the jig is made of a magnetic material, a high-frequency magnetic field is generated, and the jig and the solder foil 3 are heated in a short time (for example, 2 minutes) due to eddy current loss, and the solder foil 3 is melted. Therefore, the object 2 to be bonded can be soldered to a predetermined position on the upper end surface of the component body 1 with high precision and reliability.

Furthermore, since the main part of the jig is made of heat-resistant metal, the positioning dimensions of the component body and the adhered object will not be distorted, and the jig will have a long life.

[Effects of the Invention] As explained above, the present invention has practical advantages such as no flux evaporation, reliable soldering, high adhesion reliability, and high work efficiency. It has a positive effect.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing an embodiment of the jig according to the present invention in separated form, Fig. 2 is a sectional view of the main part, Fig. 3 is a perspective view of an induction coil, and Fig. 4 is a soldering part. (a) is a perspective view before fixing, (b) is a side view after fixing, and FIG. 5 is a perspective view of a conventional soldering jig. In the figure, 1 is the component body, 2 is the object to be bonded, 3 is the solder foil,
10 is a spring holder, 10a is a screw hole,
11 is a compression coil spring, 12 is a support pin,
13 is a pin guide plate, 14 is a component holder plate, 15 is a guide groove, 16 is a component insertion hole, 17 is a clamp plate, 18 and 19 are fixed screws, and 25 is an induction coil. Rod ≠ 2 inches/Ta 2 English 3 Figure 21;

Claims (2)

[Claims] (1) Insert the component body into the component insertion hole of the component holder plate made of magnetic material, position the object to be bonded on the desired end face of the component body, and attach the object to the component body via solder foil. A soldering method characterized in that the object to be adhered is soldered to the main body of the component by high-frequency induction heating means in a press-contact state. (2) It is inserted into the high frequency induction coil and is used when soldering the component body and the part to be bonded, and the vertical component insertion holes into which the component body is inserted are arranged in a row, and each A square component holder plate made of a magnetic material and provided with a guide groove for positioning the object to be adhered at the upper end of the component insertion hole, and a magnetic material that presses the top surface of the object to be adhered inserted into the guide groove. a clamp plate made of a magnetic material, a pin guide plate having pin guide holes arranged in parallel with each other corresponding to the component insertion holes, and a pin guide plate made of a magnetic material fixed to the lower surface of the component holder plate; a support pin that pushes up the lower end surface of the component body by the elasticity of a spring seated on a spring holder plate made of a magnetic material and presses the upper end surface of the component body against the lower surface of the object to be adhered via solder foil; A soldering jig characterized by: