JPS6139555B2 - - Google Patents

Info

Publication number
JPS6139555B2
JPS6139555B2 JP16685281A JP16685281A JPS6139555B2 JP S6139555 B2 JPS6139555 B2 JP S6139555B2 JP 16685281 A JP16685281 A JP 16685281A JP 16685281 A JP16685281 A JP 16685281A JP S6139555 B2 JPS6139555 B2 JP S6139555B2
Authority
JP
Japan
Prior art keywords
valve body
fastening pin
valve
proportional control
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16685281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5868570A (ja
Inventor
Takashi Tanahashi
Hideo Uematsu
Masaji Yamauchi
Tomohide Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16685281A priority Critical patent/JPS5868570A/ja
Publication of JPS5868570A publication Critical patent/JPS5868570A/ja
Publication of JPS6139555B2 publication Critical patent/JPS6139555B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/06—Actuating devices; Operating means; Releasing devices electric; magnetic using a magnet, e.g. diaphragm valves, cutting off by means of a liquid
    • F16K31/0644—One-way valve
    • F16K31/0655—Lift valves

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Magnetically Actuated Valves (AREA)
JP16685281A 1981-10-19 1981-10-19 比例制御弁 Granted JPS5868570A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16685281A JPS5868570A (ja) 1981-10-19 1981-10-19 比例制御弁

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16685281A JPS5868570A (ja) 1981-10-19 1981-10-19 比例制御弁

Publications (2)

Publication Number Publication Date
JPS5868570A JPS5868570A (ja) 1983-04-23
JPS6139555B2 true JPS6139555B2 (enrdf_load_stackoverflow) 1986-09-04

Family

ID=15838837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16685281A Granted JPS5868570A (ja) 1981-10-19 1981-10-19 比例制御弁

Country Status (1)

Country Link
JP (1) JPS5868570A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9587759B2 (en) 2013-09-20 2017-03-07 Itt Manufacturing Enterprises Llc Quick release valve compressor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US9054117B1 (en) 2002-11-08 2015-06-09 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7420272B1 (en) 2002-11-08 2008-09-02 Amkor Technology, Inc. Two-sided wafer escape package
US7192807B1 (en) 2002-11-08 2007-03-20 Amkor Technology, Inc. Wafer level package and fabrication method
US7247523B1 (en) 2002-11-08 2007-07-24 Amkor Technology, Inc. Two-sided wafer escape package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US10811341B2 (en) 2009-01-05 2020-10-20 Amkor Technology Singapore Holding Pte Ltd. Semiconductor device with through-mold via
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9082833B1 (en) 2011-01-06 2015-07-14 Amkor Technology, Inc. Through via recessed reveal structure and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method

Also Published As

Publication number Publication date
JPS5868570A (ja) 1983-04-23

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