JPS6137670Y2 - - Google Patents
Info
- Publication number
- JPS6137670Y2 JPS6137670Y2 JP6753081U JP6753081U JPS6137670Y2 JP S6137670 Y2 JPS6137670 Y2 JP S6137670Y2 JP 6753081 U JP6753081 U JP 6753081U JP 6753081 U JP6753081 U JP 6753081U JP S6137670 Y2 JPS6137670 Y2 JP S6137670Y2
- Authority
- JP
- Japan
- Prior art keywords
- wall
- conductive
- plastic
- container
- containers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003023 plastic Polymers 0.000 claims description 38
- 239000004033 plastic Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 31
- 238000003860 storage Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 description 10
- -1 polyethylene Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は導電性性に優れ且つ軽量で緩衝性の優
れたプラスチツク容器に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a plastic container that is highly conductive, lightweight, and has excellent cushioning properties.
従来、MOS型IC等の半導体材料の保護、電子
機器のノイズ発生防止、精密部品の梱包、電波遮
敞等の用途に使用される容器としては、一般的に
導電性が優れている金属製の容器、あるいは、導
電性材料とプラスチツク材料との混合材料で構成
された容器が知られている。
Traditionally, containers made of metal, which has excellent conductivity, have been used for purposes such as protecting semiconductor materials such as MOS ICs, preventing noise generation in electronic equipment, packaging precision parts, and shielding radio waves. BACKGROUND OF THE INVENTION Containers or containers made of a mixed material of an electrically conductive material and a plastic material are known.
従来の金属製容器にあつては容器自体の重量が
重く運搬等に不便であつた。また、従来の導電性
プラスチツク製容器にあつては、金属製容器に比
べて軽量ではあるが、半導体材料等を適確に保護
すべく適宜の凹凸形状を形成した収納リセスを設
ける場合、その凹凸形状により導電性プラスチツ
ク壁の厚さが異なることから、射出成形等の成形
時、混合材料中に含まれる導電物質がプラスチツ
ク材料中に均一分散せず、よつて収納リセス等を
構成する表面の導電率が一定せず、所望の導電率
を有する容器が得られない欠点を有する。
Conventional metal containers are heavy and inconvenient to transport. In addition, conventional conductive plastic containers are lighter than metal containers, but when providing a storage recess with an appropriate uneven shape to properly protect semiconductor materials, etc., the unevenness Because the thickness of the conductive plastic wall varies depending on the shape, the conductive substance contained in the mixed material is not uniformly dispersed in the plastic material during injection molding, etc., and the conductive material on the surface forming the storage recess etc. This has the disadvantage that the conductivity is not constant and a container having the desired conductivity cannot be obtained.
本考案は上記の欠点に鑑み創案されたものであ
り、容器自体軽量で且つ均一な導電性を得ること
のできるプラスチツク容器を提供するものであ
る。 The present invention was devised in view of the above-mentioned drawbacks, and the object is to provide a plastic container that is lightweight and can provide uniform conductivity.
本考案は内部に収納リセスを形成した中空2重
壁構造からなり、内壁及び外壁を導電性の付与さ
れたプラスチツク材料にて構成したプラスチツク
容器に関する。
The present invention relates to a plastic container which has a hollow double wall structure with a storage recess formed therein, and whose inner and outer walls are made of a conductive plastic material.
本考案において、プラスチツク容器とは導電性
の必要な用途や静電気障害(静電吸引、静電反
発、静電誘導、放電、感電)を防ぐ必要のある用
途に使用されるコンテナー、ケース、タンク、ハ
ウジング類を含むものである。また本考案に係る
プラスチツク容器の導電性は表面抵抗率で10-1〜
1012Ω・cm、好ましくは102〜108Ω・cmの値であ
り、用途、大きさ等により任意に設定される。ま
た内壁及び外壁はポリエチレン、ポリプロピレ
ン、ポリアミド、ポリ塩化ビニル、エチレン−酢
酸ビニル共重合体、ポリスチレン等の熱可塑性プ
ラスチツク材料にカーボン等の導電物質を混合し
てなる導電性プラスチツク材料にて構成される。 In this invention, plastic containers are containers, cases, tanks, etc. used for applications that require conductivity or that require prevention of static electricity hazards (electrostatic attraction, electrostatic repulsion, electrostatic induction, discharge, electric shock). This includes housings. Furthermore, the conductivity of the plastic container according to the present invention is 10 -1 to 10 -1 in terms of surface resistivity.
The value is 10 12 Ω·cm, preferably 10 2 to 10 8 Ω·cm, and can be arbitrarily set depending on the purpose, size, etc. The inner and outer walls are made of a conductive plastic material made by mixing a thermoplastic material such as polyethylene, polypropylene, polyamide, polyvinyl chloride, ethylene-vinyl acetate copolymer, or polystyrene with a conductive substance such as carbon. .
一般にプラスチツク材料中に導電物質を混合し
てなる導電性プラスチツク材料を射出成形などに
て一体成形した容器などにあつては、断面積の変
化にともなつて材料の流れが変化し、比較的厚い
部分と薄い部分、また射出ゲート部分に近い部分
と遠い部分とでは導電性プラスチツク材料に含ま
れる導電物質の濃度あるいは配列方向に変化が生
じ易く、それによつて容器を構成する壁において
導電性の不均一が発生する。とくに半導体材料等
を適確に保護すべく適宜の凹凸形状を構成する容
器にあつては上記欠点が顕著となるものであつ
た。それに対し、本考案にあつては、内部に収納
リセスを形成した容器であつても、収納リセスを
構成する内壁は外面形状を構成する外壁と中空部
にてほぼ区画されており、内壁また外壁はそれぞ
れほぼ均一な肉厚で構成されている。すなわち、
プラスチツク材料中に導電物質を混合してなる導
電性プラスチツク材料は、ほぼ均一な肉厚の内壁
及び外壁において導電性にバラツキがなく、半導
体材料等を収納するプラスチツク容器として好適
である。
In general, for containers etc. that are integrally molded by injection molding or the like using a conductive plastic material made by mixing a conductive substance into the plastic material, the flow of the material changes as the cross-sectional area changes, and the material is relatively thick. The concentration or arrangement direction of the conductive substance contained in the conductive plastic material tends to change between different parts and thinner parts, and between parts near and far from the injection gate. Uniformity occurs. In particular, the above-mentioned drawbacks have been noticeable in containers that have an appropriate uneven shape to properly protect semiconductor materials and the like. In contrast, in the case of the present invention, even if the container has a storage recess formed inside, the inner wall that makes up the storage recess is almost divided by the outer wall that makes up the outer shape and the hollow part, and the inner wall and the outer wall Each has a substantially uniform wall thickness. That is,
A conductive plastic material made by mixing a conductive substance into a plastic material has substantially uniform inner and outer walls with uniform conductivity, and is suitable for use as a plastic container for storing semiconductor materials and the like.
以下図面に基づき説明するに、1は本考案に係
るプラスチツク容器であり、本体2と蓋体3をヒ
ンジ4にて連設して構成されている。本体2及び
蓋体3の少なくとも一方は中空2重壁に構成さ
れ、5は内壁、6は外壁、7は中空部である。8
は内部に形成された収納物の収納リセスであり、
収納物の外観形状に対応して内壁5を構成するこ
とにより適宜の形状に形成される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, reference numeral 1 denotes a plastic container according to the present invention, which is constructed by connecting a main body 2 and a lid 3 with a hinge 4. At least one of the main body 2 and the lid 3 is formed into a hollow double wall, and 5 is an inner wall, 6 is an outer wall, and 7 is a hollow part. 8
is a recess formed inside for storage of stored items,
By configuring the inner wall 5 in accordance with the external shape of the stored item, it can be formed into an appropriate shape.
また、9は本体2と蓋体3の合わせ面、10は
内壁5と外壁6の内面同志を溶着した溶着部であ
る。 Further, 9 is a mating surface between the main body 2 and the lid 3, and 10 is a welded part where the inner surfaces of the inner wall 5 and the outer wall 6 are welded together.
内壁5及び外壁6はポリエチレン、ポリプロピ
レン、ポリアミド、ポリ塩化ビニル、エチレン−
酢酸ビニル共重合体、ポリスチレン等の熱可塑性
プラスチツクにカーボン等の導電物質を混合して
なる材料で構成される。 The inner wall 5 and outer wall 6 are made of polyethylene, polypropylene, polyamide, polyvinyl chloride, ethylene-
It is made of a material made by mixing a thermoplastic such as vinyl acetate copolymer or polystyrene with a conductive substance such as carbon.
以下にその具体例を示す。 A specific example is shown below.
中低圧ポリエチレン100重量部に対しカーボン
ブラツク40重量部配合したペレツト状のコンパウ
ンドをスクリユー直径65mmの押出機を使用して
200℃の設定温度にて溶融混練し、外径200mm、肉
厚3mmのパリスンを押出す。ついで分割形式の金
型にて該パリスンを閉鎖し、パリスン内に7Kg/
cm2の圧縮空気を吹込み、キヤビテイの形状に成形
する。そして成形品を冷却し金型より取り出した
後、余剰の鋳バリを除去し、第1図に示すような
縦220mm、横200mm、高さ80mm、重量758gの本体
と蓋体からなる中空2重壁ケースを得た。また得
られたケースの表面抵抗率は7.3×104Ω・cmであ
つた。 Using an extruder with a screw diameter of 65 mm, a pellet-like compound containing 40 parts by weight of carbon black and 100 parts by weight of medium-low pressure polyethylene was mixed.
Melt and knead at a set temperature of 200℃ and extrude a parison with an outer diameter of 200mm and a wall thickness of 3mm. Then, the parison is closed using a split mold, and 7 kg/kg is placed inside the parison.
Blow in cm 2 of compressed air and form into the shape of a cavity. After the molded product is cooled and taken out from the mold, excess casting flash is removed, and a hollow double-walled structure consisting of a main body and a lid, measuring 220 mm long, 200 mm wide, 80 mm high, and 758 g in weight, is formed as shown in Figure 1. Got a wall case. The surface resistivity of the obtained case was 7.3×10 4 Ω·cm.
上記、具体例のように、本考案に係るプラスチ
ツク容器1を製造するには、ブロー成形にて一体
に製造するほか、その他の手段として内壁、外壁
をそれぞれバキユーム成形、インジエクシヨン成
形、コンプレツシヨン成形にして成形した後それ
らを組み合わせることができるが、一体に製造で
き、かつ内壁と外壁が一体に連設されることによ
り導電特性の低下しないブロー成形が本考案のプ
ラスチツク容器を得るのに望ましい。 As shown in the above specific example, in order to manufacture the plastic container 1 according to the present invention, in addition to manufacturing the plastic container 1 integrally by blow molding, other methods include vacuum molding, injection molding, and compression molding for the inner wall and outer wall, respectively. Although it is possible to mold them and then combine them, blow molding is preferable to obtain the plastic container of the present invention because it can be manufactured in one piece and the conductive properties do not deteriorate because the inner and outer walls are connected as one unit.
本考案のプラスチツク容器1において収納リセ
ス8内に収納されたIC等の半導体材料は内壁5
に接触しているので半導体材料自体帯電すること
なく、また半導体材料が帯電している場合であつ
ても内壁5と外壁6は合わせ面9にて連設されて
いるので容易に誘電エネルギーを外部に除去する
ことができ半導体材料等の収納物の機能が帯電に
より影響をうけることがない。そして熱可塑性プ
ラスチツクに対する導電物質の混合比また導電物
質の種類を適宜に選択することにより用途に応じ
て所望の導電性を得ることができる。またプラス
チツク容器1は比重の小さいプラスチツクで構成
され、さらに中空2重壁に構成されているので従
来の金属製容器に比べはるかに軽量で、さらに緩
衝効果の面で収納物の保護性に優れている。 In the plastic container 1 of the present invention, the semiconductor material such as an IC stored in the storage recess 8 is placed on the inner wall 5.
Since the semiconductor material is in contact with the semiconductor material itself, it does not become electrically charged, and even if the semiconductor material is electrically charged, the inner wall 5 and the outer wall 6 are connected to each other at the mating surface 9, so that dielectric energy is easily transferred to the outside. The functions of stored items such as semiconductor materials are not affected by the charging. By appropriately selecting the mixing ratio of the conductive material to the thermoplastic plastic and the type of the conductive material, desired conductivity can be obtained depending on the application. In addition, the plastic container 1 is made of plastic with low specific gravity and has a hollow double-walled structure, so it is much lighter than conventional metal containers, and has excellent cushioning effects to protect stored items. There is.
本考案の実施態様として、導電性に優れ且つ軽
量で緩衝性の優れたプラスチツク容器を得る場
合、ポリエチレン等のポリオレフインに粒子表面
を特殊処理してなるカーボンを5〜70重量%好ま
しくは10〜40重量%混合してなるプラスチツク材
料をブロー成形し、内壁5、外壁6を有する中空
2重壁構造の容器を一体に構成するのが、量産性
及び安価に提供できる点で望ましい。 As an embodiment of the present invention, when obtaining a plastic container with excellent conductivity, light weight, and excellent cushioning properties, 5 to 70% by weight of carbon, which is made by specially treating the particle surface of polyolefin such as polyethylene, is preferably 10 to 40% by weight. It is preferable to blow mold a plastic material obtained by mixing % by weight to integrally construct a hollow double-walled container having an inner wall 5 and an outer wall 6, from the viewpoint of mass production and low cost.
第3図は他の実施例を示す容器壁の拡大断面図
であり、内壁5及び外壁6は導電性の付与された
プラスチツク材料からなる表層5a,6aと導電
性の付与されていないプラスチツク材料からなる
主体層5b,6bにて構成されている。第3図の
如く構成するには、例えば表層と主体層からなる
2層パリスンを共押出し、該パリスンを凸型キヤ
ビテイ、凹型キヤビテイからなる分割金型にて閉
鎖しブロー成形することにより得られるが、この
場合、導電性の付与されたプラスチツク材料から
なる表層のブロー成形性の低下を主体層にて補な
うことができ、また導電性の付与された比較的高
価なプラスチツク材料を低減し、且つ表面抵抗率
は第2図に示した容器壁のものとほぼ同じ値を保
つことができる。 FIG. 3 is an enlarged sectional view of a container wall showing another embodiment, in which the inner wall 5 and the outer wall 6 are made of surface layers 5a and 6a made of a plastic material imparted with conductivity and a plastic material not imparted with conductivity. It is composed of main layers 5b and 6b. The structure shown in FIG. 3 can be obtained, for example, by co-extruding a two-layer parison consisting of a surface layer and a main layer, and blow-molding the parison by closing it in a split mold consisting of a convex cavity and a concave cavity. In this case, the main layer can compensate for the decrease in blow moldability of the surface layer made of conductive plastic material, and also reduce the need for relatively expensive conductive plastic material. Moreover, the surface resistivity can be maintained at approximately the same value as that of the container wall shown in FIG.
本考案のプラスチツク容器は上記の如く、内部
に収納リセスを成形した中空2重壁構造からな
り、内壁及び外壁を導電性の付与されたプラスチ
ツク材料にて構成したので半導体材料の保護、電
子機器のノイズ発生防止、精密部品の梱包、電波
遮敞等の用途に応じて所望の導電性を得ることが
でき、且つ軽量で緩衝性に優れる等の実用的な効
果を奏するものである。 As described above, the plastic container of the present invention has a hollow double wall structure with a storage recess formed inside, and the inner and outer walls are made of conductive plastic material, so it can protect semiconductor materials and protect electronic equipment. Desired conductivity can be obtained depending on the application such as noise prevention, precision parts packaging, radio wave shielding, etc., and it also has practical effects such as being lightweight and having excellent cushioning properties.
〔考案の効果〕
本考案は上記の如く、従来の金属製容器また導
電性プラスチツク容器に比べて軽量で運搬等が簡
便に行なえるとともに、従来の導電性プラスチツ
ク容器に比べ導電率の一定した容器を得ることが
できる。[Effects of the invention] As described above, the present invention is a container that is lighter and easier to transport than conventional metal containers or conductive plastic containers, and has a more constant electrical conductivity than conventional conductive plastic containers. can be obtained.
第1図は本考案に係るプラスチツク容器の一部
破断斜視図、第2図は同上の容器壁拡大断面図、
第3図は他の実施例を示す容器壁拡大断面図であ
る。
1……プラスチツク容器、2……本体、3……
蓋体、5……内壁、6……外壁、7……中空部。
Fig. 1 is a partially cutaway perspective view of a plastic container according to the present invention, Fig. 2 is an enlarged sectional view of the wall of the same container;
FIG. 3 is an enlarged sectional view of a container wall showing another embodiment. 1...Plastic container, 2...Main body, 3...
Lid body, 5...Inner wall, 6...Outer wall, 7...Hollow part.
Claims (1)
らなり、内壁及び外壁を導電性の付与されたプラ
スチツク材料にて構成したことを特徴とするプラ
スチツク容器。 1. A plastic container comprising a hollow double-walled structure with a storage recess formed therein, and comprising an inner wall and an outer wall made of a conductive plastic material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6753081U JPS6137670Y2 (en) | 1981-05-12 | 1981-05-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6753081U JPS6137670Y2 (en) | 1981-05-12 | 1981-05-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57181097U JPS57181097U (en) | 1982-11-17 |
JPS6137670Y2 true JPS6137670Y2 (en) | 1986-10-31 |
Family
ID=29863532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6753081U Expired JPS6137670Y2 (en) | 1981-05-12 | 1981-05-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6137670Y2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0544313Y2 (en) * | 1986-04-05 | 1993-11-10 | ||
JPH0710559Y2 (en) * | 1989-10-05 | 1995-03-08 | キョーラク株式会社 | Electrical equipment housing panel |
JPH0687515B2 (en) * | 1989-12-26 | 1994-11-02 | キョーラク株式会社 | Method for manufacturing housing for electric device |
-
1981
- 1981-05-12 JP JP6753081U patent/JPS6137670Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57181097U (en) | 1982-11-17 |
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