JPS6134735U - Integrated circuit shaping equipment - Google Patents
Integrated circuit shaping equipmentInfo
- Publication number
- JPS6134735U JPS6134735U JP11853284U JP11853284U JPS6134735U JP S6134735 U JPS6134735 U JP S6134735U JP 11853284 U JP11853284 U JP 11853284U JP 11853284 U JP11853284 U JP 11853284U JP S6134735 U JPS6134735 U JP S6134735U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- shaping equipment
- circuit shaping
- back surface
- groove portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
添付図面は本考案の実施例を示し、第1図は平面図、第
2図は第1図中X−X線に沿う断面図、第3図は第2図
中Aて囲んだ部分の拡大図、第4図はベース板上に5個
の集積回路を形成した例を示す平面図、第5図は第4図
中Y−Y線に沿う断面図である。
尚図中、1は本体、2は作業板、3は一側、4は他側、
5は収集積回路、6は溝部、7はベース板、11は表面
、14は合成樹脂、16は裏面、18は突起、19は底
面、21は段部、22は押え板、23は削り刃を示して
いる。The attached drawings show an embodiment of the present invention, in which Fig. 1 is a plan view, Fig. 2 is a sectional view taken along the line X-X in Fig. 1, and Fig. 3 is an enlarged view of the part surrounded by A in Fig. 2. 4 is a plan view showing an example in which five integrated circuits are formed on a base plate, and FIG. 5 is a sectional view taken along line Y--Y in FIG. 4. In the figure, 1 is the main body, 2 is the work plate, 3 is one side, 4 is the other side,
5 is a collection circuit, 6 is a groove, 7 is a base plate, 11 is a front surface, 14 is a synthetic resin, 16 is a back surface, 18 is a protrusion, 19 is a bottom surface, 21 is a stepped portion, 22 is a presser plate, 23 is a cutting blade It shows.
Claims (1)
せしめる為の溝部6を形成すると共に、該溝部6の底面
19に、上記集積回路5の表面11の縁部と当接する段
部21,21を形成し、更に上記溝部6の左右両側に沿
って、集積回路5が形成されているベース板7をガイド
する為の押え板22.22を配設し、そして更に上記溝
部の上方に、集積回路5の裏面16ににじみ出た合成樹
脂14による突起1Bを削り取る為の回転削り刃23を
、上記裏面16と離接させながら臨ませて成したことを
特徴とする集積回路の整形装置。A groove portion 6 for fitting the integrated circuit 5 is formed from one side 3 to the other side 4 of the work plate 2, and a step is formed on the bottom surface 19 of the groove portion 6 to abut the edge of the surface 11 of the integrated circuit 5. holding plates 22 and 22 are provided along both left and right sides of the groove 6 for guiding the base plate 7 on which the integrated circuit 5 is formed; The shaping of the integrated circuit is characterized in that a rotary cutting blade 23 for scraping off the protrusion 1B of the synthetic resin 14 oozing out from the back surface 16 of the integrated circuit 5 is provided above while facing away from and in contact with the back surface 16. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11853284U JPS6134735U (en) | 1984-07-31 | 1984-07-31 | Integrated circuit shaping equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11853284U JPS6134735U (en) | 1984-07-31 | 1984-07-31 | Integrated circuit shaping equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6134735U true JPS6134735U (en) | 1986-03-03 |
Family
ID=30677420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11853284U Pending JPS6134735U (en) | 1984-07-31 | 1984-07-31 | Integrated circuit shaping equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6134735U (en) |
-
1984
- 1984-07-31 JP JP11853284U patent/JPS6134735U/en active Pending
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