JPS6134661Y2 - - Google Patents
Info
- Publication number
- JPS6134661Y2 JPS6134661Y2 JP11483381U JP11483381U JPS6134661Y2 JP S6134661 Y2 JPS6134661 Y2 JP S6134661Y2 JP 11483381 U JP11483381 U JP 11483381U JP 11483381 U JP11483381 U JP 11483381U JP S6134661 Y2 JPS6134661 Y2 JP S6134661Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- coating film
- drain wire
- film
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Description
【考案の詳細な説明】
本考案は電線用シールドテープに関するもので
あつて、導電層を形成する金属面の酸化及び損傷
を防止するとともに端末処理を容易に行なう事が
出来る事をその目的とするものである。[Detailed description of the invention] The present invention relates to a shielding tape for electric wires, and its purpose is to prevent oxidation and damage to the metal surface forming the conductive layer and to facilitate terminal treatment. It is something.
即ち本考案はプラスチツクフイルムを素材に用
いて形成されるベースフイルムの表面に良導電性
金属によつて形成される導電層を設け、同導電層
にはその長手方向に沿つてドレイン線を固着させ
る一方、導電層及びドレイン線に対しては被覆膜
を重合させる様に構成した事をその要旨とするも
のである。 That is, in the present invention, a conductive layer made of a highly conductive metal is provided on the surface of a base film made of plastic film, and a drain wire is fixed to the conductive layer along its longitudinal direction. On the other hand, the gist is that the conductive layer and drain line are constructed so that the coating film is polymerized.
以下に本考案の具体的な実施例を例示の図面に
ついて説明する。第1図は電線Aの一部を剥離さ
せた状態を示す図面であつて、同図面に於いて
1,1は例えばビニール等の被覆1′,1′を介し
て絶縁を施した複数本の導線、2は両導線1,1
を囲繞する介材、3は本考案に係るシールドテー
プ、4は外皮を構成するシースを夫々示す。 Hereinafter, specific embodiments of the present invention will be described with reference to the illustrative drawings. Fig. 1 is a drawing showing a state in which a part of the electric wire A is peeled off, and in the drawing, 1 and 1 are a plurality of wires insulated through coatings 1' and 1' made of vinyl, etc. Conductor, 2 is both conductor 1,1
3 is a shielding tape according to the present invention, and 4 is a sheath forming an outer skin.
第2図及び第3図は本考案に係るシールドテー
プ3の第1の実施例を示す図面であつて、3′は
ベースフイルムを示す。同ベースフイルム3′は
プラスチツクフイルムを素材に用いて長尺帯状に
設ける事により形成され、同ベースフイルム3′
の表面には例えば銅、アルミ等の良導電性の金属
を蒸着させる事により、又ベースフイルム3′の
表面に例えば銅、アルミ等の導電性の優れた金属
箔をラミネートさせる事により導電層5を形成す
る。そして同導電層5上にはその長手方向に沿つ
てドレイン線6を固着する一方、導電層5上に
は、同導電層5及びドレイン線6を密着状に覆う
如くプラスチツクフイルムを貼着させる事によ
り、被覆膜7を形成して成るものである。第4図
は他の実施例を示す図面であつて、ベースフイル
ム3′と被覆膜7を一体に形成して成るものであ
る。 2 and 3 are drawings showing a first embodiment of the shielding tape 3 according to the present invention, and 3' indicates a base film. The base film 3' is formed by providing a long strip of plastic film as a material.
The conductive layer 5 is formed by depositing a highly conductive metal such as copper or aluminum on the surface of the base film 3', or by laminating a highly conductive metal foil such as copper or aluminum on the surface of the base film 3'. form. A drain wire 6 is fixed onto the conductive layer 5 along its longitudinal direction, and a plastic film is pasted onto the conductive layer 5 so as to tightly cover the conductive layer 5 and the drain wire 6. The coating film 7 is formed by the following steps. FIG. 4 is a drawing showing another embodiment, in which a base film 3' and a covering film 7 are integrally formed.
その他図示省略してあるが、被覆膜7として例
えば導電ビニール等の半導電物質を使用し、同半
導電物質を被覆膜7として導電層5上に重合させ
る事が可能であり、又被覆膜7として例えば鉄、
ニツケル等の金属を蒸着若しくはラミネートさせ
て被覆膜7を形成し、同被覆膜7を導電層5上に
重合させる事が可能である。 Although not shown in the drawings, it is possible to use a semiconductive material such as conductive vinyl as the coating film 7, and to polymerize the semiconductive material on the conductive layer 5 as the coating film 7. As the coating 7, for example, iron,
It is possible to form the coating film 7 by vapor depositing or laminating a metal such as nickel, and to polymerize the coating film 7 on the conductive layer 5.
尚上記半導電物質は上記導電ビニールの他の例
えば銅、アルミ等の良導電性金属をフイルムに対
して比較的まばらに蒸着させる事によつても得る
事が可能である。 The semiconducting material can also be obtained by relatively sparsely depositing a highly conductive metal such as copper or aluminum on the film, in addition to the conductive vinyl.
本考案は以上の様に構成されるものであつて、
上記の様に構成した事により、良導電性の金属に
よつて形成される導電層を機械的、化学的に保護
する事が可能となつた。即ち本考案にあつては上
記の様にベースフイルムの表面に良導電性の金属
によつて形成される導電層に対して被覆膜を重ね
合せる様にした事により、導電層に対する機械的
な外圧力に対して同導電層の損傷を防止する事が
出来、その結果導電層の損傷に起因するノズルの
発生を防止する事が出来るに至つた。 The present invention is constructed as described above.
With the above configuration, it has become possible to mechanically and chemically protect the conductive layer formed of a highly conductive metal. That is, in the present invention, as described above, by overlapping the coating film on the conductive layer formed of a highly conductive metal on the surface of the base film, mechanical damage to the conductive layer is prevented. It is possible to prevent damage to the conductive layer due to external pressure, and as a result, it has become possible to prevent nozzles from occurring due to damage to the conductive layer.
又本考案にあつては上記の様に良導電性の金属
によつ形成される導電層に対して被覆膜を密着状
に重合させて同導電層に対する空気の接触を遮断
させる様にした事により、同導電層の酸化を防止
する事が出来、その結果優れた静電のシールド効
果を得る事が出来るに至つた。 In addition, in the present invention, as mentioned above, the coating film is polymerized in close contact with the conductive layer formed of a highly conductive metal, thereby blocking air contact with the conductive layer. As a result, oxidation of the conductive layer can be prevented, and as a result, an excellent electrostatic shielding effect can be obtained.
又本考案いあつては上記の様に導電層に対して
その長手方向に沿つてドレイン線を固着させ、同
ドレイン線に対して上記被覆膜を一体に被覆させ
る様にした事により、同シールドテープの端末処
理、即ちコネクタ、端子板等に対する接続作業を
容易に行なう事が出来るに至つた。 In addition, in the present invention, as described above, the drain wire is fixed to the conductive layer along its longitudinal direction, and the drain wire is integrally covered with the coating film, thereby achieving the same effect. It has now become possible to easily perform terminal processing of the shield tape, that is, connection work to connectors, terminal boards, etc.
即ち従来構造のシールドテープにあつては、そ
の端末部をコネクタ、端子板等に対して接続させ
るに際しては同一ケーブル内に被覆される処の他
のドレイン線との接触を避けるべく各ドレイン線
の端部に対して絶縁用のコンバイヤチユーブを嵌
挿させる作業が、端末処理作業の一かんとして通
常行われるのであるが、ドレイン線の端部より絶
縁用のコンバイヤチユーブを嵌挿させる作業は簡
単ではなく、著しく面倒を生じているのが実情で
ある。 In other words, in the case of conventional shielding tapes, when connecting the terminal portion to a connector, terminal board, etc., each drain wire should be carefully connected to avoid contact with other drain wires covered within the same cable. The work of inserting an insulating converter tube into the end of the drain wire is normally done as part of the terminal processing work, but the work of inserting an insulating converter tube into the end of the drain wire is The reality is that it is not easy, and it is extremely troublesome.
しかして本考案に係るシールドテープにあつて
は第5図に示す様にシールドテープの端部をドレ
イン線が被覆される部分を除いて切取る事によ
り、ドレイン線の端部には、同端末部がテープと
被覆膜によつて囲繞された状態、即ち従来構造の
シールドテープにおいてドレイン線の端末部に対
して絶縁チユーブが嵌挿されたと同一の状態を、
単にシールドテープの端部をドレイン線が固着さ
れる部分を除いて切取るのみの極く簡単な作業に
よつて得る事が可能となつたのである。 However, in the case of the shield tape according to the present invention, as shown in FIG. 5, by cutting off the end of the shield tape except for the part where the drain wire is covered, The state where the part is surrounded by the tape and the coating film, that is, the same state as when the insulating tube is inserted into the end part of the drain wire in the shield tape of the conventional structure,
It has become possible to obtain the shield tape by simply cutting off the end of the shield tape except for the part to which the drain wire is fixed.
尚被覆膜を例えば導電ビニール等の半導電物質
を用いて形成する事により、上記の効果に加えて
電位の急激な変化に対して、その変化を緩げる事
が出来、その結果振動ノイズの発生を防止する事
が可能となつたのである。 By forming the coating film using a semiconductive material such as conductive vinyl, in addition to the above effects, it is possible to slow down sudden changes in potential, and as a result, vibration noise can be reduced. It became possible to prevent the occurrence of
又ベースフイルムに対して鉄、ニツケル等の金
属を蒸着若しくはラミネートさせる事によつて被
覆膜を形成する事により、上記の効果に加えて磁
気シールド効果を得る事が可能である。 Furthermore, by forming a coating film on the base film by vapor depositing or laminating metal such as iron or nickel, it is possible to obtain a magnetic shielding effect in addition to the above-mentioned effects.
第1図は本考案に係るシールドテープを使用す
る電線の一部を剥離した状態を示す斜視図、第2
図及び第3図は第1の実施例を示す図面であつ
て、第2図は展開状態を示す拡大斜視図、第3図
は同側断面図である。第4図は第2の実施例を示
す展開状態の拡大図、第5図は第1の実施例にお
ける端末処理の作用状態を示す拡大斜視図であ
る。
A……電線、1……導線、1′……被膜、2…
…介材、3……シールドテープ、3′……ベース
フイルム、4……シース、5……導電層、6……
ドレイン線、7……被覆膜。
Fig. 1 is a perspective view showing a state in which a part of the electric wire using the shielding tape according to the present invention is peeled off;
3 and 3 are drawings showing the first embodiment, in which FIG. 2 is an enlarged perspective view showing the unfolded state, and FIG. 3 is a sectional view of the same side. FIG. 4 is an enlarged view of the second embodiment in an expanded state, and FIG. 5 is an enlarged perspective view of the operating state of terminal processing in the first embodiment. A...Electric wire, 1...Conducting wire, 1'...Coating, 2...
... Intermediate material, 3 ... Shield tape, 3' ... Base film, 4 ... Sheath, 5 ... Conductive layer, 6 ...
Drain wire, 7... coating film.
Claims (1)
電層にはテープの長手方向に沿つてドレイン線
を固着させ、導電層及びドレイン線に対しては
被覆膜を重合させて成る電線用シールドテー
プ。 (2) 被覆膜は導電ビニール等の半導電物質により
形成した事を特徴とする実用新案登録請求の範
囲第1項に記載の電線用シールドテープ。 (3) 被覆膜は鉄、ニツケル等の導電性金属を蒸着
若しくはラミネートさせる事により形成した事
を特徴とする実用新案登録請求の範囲第1項に
記載の電線用シールドテープ。[Claims for Utility Model Registration] (1) A conductive layer is provided on the surface of the base film, a drain wire is fixed to the conductive layer along the longitudinal direction of the tape, and the conductive layer and drain wire are coated. Shield tape for electric wires made of polymerized film. (2) The shielding tape for electric wires according to claim 1 of the utility model registration claim, wherein the coating film is formed of a semiconductive material such as conductive vinyl. (3) The shielding tape for electric wires according to claim 1, wherein the coating film is formed by depositing or laminating a conductive metal such as iron or nickel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11483381U JPS5820422U (en) | 1981-07-31 | 1981-07-31 | Shield tape for electric wires |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11483381U JPS5820422U (en) | 1981-07-31 | 1981-07-31 | Shield tape for electric wires |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5820422U JPS5820422U (en) | 1983-02-08 |
JPS6134661Y2 true JPS6134661Y2 (en) | 1986-10-08 |
Family
ID=29909108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11483381U Granted JPS5820422U (en) | 1981-07-31 | 1981-07-31 | Shield tape for electric wires |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5820422U (en) |
-
1981
- 1981-07-31 JP JP11483381U patent/JPS5820422U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5820422U (en) | 1983-02-08 |
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