JPS6133523U - surface acoustic wave device - Google Patents
surface acoustic wave deviceInfo
- Publication number
- JPS6133523U JPS6133523U JP11544384U JP11544384U JPS6133523U JP S6133523 U JPS6133523 U JP S6133523U JP 11544384 U JP11544384 U JP 11544384U JP 11544384 U JP11544384 U JP 11544384U JP S6133523 U JPS6133523 U JP S6133523U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- package stem
- piezoelectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図、第２図は本考案の実施例を示す図、第３図は本
考案に使用するリード端子の１実施例の拡大図、第，４
図は従来例を示す図、第５図、第６図は本考案の実施例
と、従来例の性能を比較する図である。
１・・・・・・圧電基板、２・・・・・・リード端子、
２１・・・・・・リード端子頭部、３・・・・・・パッ
ケージステム、４・・・・・・弾性表面波用電極、５・
・・・・・接着剤、６・・・・・・ワイヤー、７・・・
・・・気密キャップ、８・・・・・・反射器。Figures 1 and 2 are diagrams showing an embodiment of the present invention, Figure 3 is an enlarged view of one embodiment of the lead terminal used in the present invention, and Figures 4 and 4 are views showing an embodiment of the present invention.
The figure shows a conventional example, and FIGS. 5 and 6 are diagrams comparing the performance of the embodiment of the present invention and the conventional example. 1...Piezoelectric substrate, 2...Lead terminal,
21...Lead terminal head, 3...Package stem, 4...Surface acoustic wave electrode, 5...
...Adhesive, 6...Wire, 7...
...Airtight cap, 8...Reflector.
Claims (1)
に関与しない電極引出部の形成された圧電基板を接着し
、前記圧電基板は、前記パッケージステムに植設され頭
部を前記パッケージステム方向に弾性を有する構造にし
たリード端子が、前記電極引出部を押圧により電気的接
続を行うことを特徴とする弾性表面波装置。A piezoelectric substrate on which a surface acoustic wave electrode and an electrode lead-out portion not involved in surface wave propagation are formed is adhered onto the package stem, and the piezoelectric substrate is implanted in the package stem with its head facing toward the package stem. A surface acoustic wave device characterized in that a lead terminal having an elastic structure makes an electrical connection by pressing the electrode lead-out portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544384U JPS6133523U (en) | 1984-07-28 | 1984-07-28 | surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544384U JPS6133523U (en) | 1984-07-28 | 1984-07-28 | surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6133523U true JPS6133523U (en) | 1986-02-28 |
Family
ID=30674413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11544384U Pending JPS6133523U (en) | 1984-07-28 | 1984-07-28 | surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6133523U (en) |
-
1984
- 1984-07-28 JP JP11544384U patent/JPS6133523U/en active Pending
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