JPS6133428U - Chip type solid electrolytic capacitor - Google Patents
Chip type solid electrolytic capacitorInfo
- Publication number
- JPS6133428U JPS6133428U JP11658684U JP11658684U JPS6133428U JP S6133428 U JPS6133428 U JP S6133428U JP 11658684 U JP11658684 U JP 11658684U JP 11658684 U JP11658684 U JP 11658684U JP S6133428 U JPS6133428 U JP S6133428U
- Authority
- JP
- Japan
- Prior art keywords
- case
- solid electrolytic
- type solid
- terminal plate
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はフープ材に取付けられているコンデンサ素子を
示す斜視図、第2図はフープ材から切離されたコンデン
サ素子を示す斜視図、第3図はコンデンサ素子を収納す
るケースの斜視図、第4図は同ケースにコンデンサ素子
を収納した状態を示す断面図、第5図は最終的な組立て
状態を示す断面図である。
図中、1はコンデンサ素子、2は陽極リード、3はフー
プ材、3aはフープ材の小片、4はケース、5は陽極端
子板、6は陰極端子板、7は導電−・即接着剤、8は充
填材、9は蓋体である。FIG. 1 is a perspective view showing a capacitor element attached to a hoop material, FIG. 2 is a perspective view showing a capacitor element separated from the hoop material, and FIG. 3 is a perspective view of a case housing the capacitor element. FIG. 4 is a cross-sectional view showing the capacitor element housed in the case, and FIG. 5 is a cross-sectional view showing the final assembled state. In the figure, 1 is a capacitor element, 2 is an anode lead, 3 is a hoop material, 3a is a small piece of hoop material, 4 is a case, 5 is an anode terminal plate, 6 is a cathode terminal plate, 7 is a conductive-ready adhesive, 8 is a filler, and 9 is a lid.
Claims (4)
部を固着するとともに、該コンデンサ素子の陰極部に陰
極端子板一端部を接続し、かつ、上記コンデンサ素子の
周囲に外装体を取付けて、上記各端子板の他端部を該外
装体の壁面に沿って所定方向に折曲げて入るチップ形固
体電解コンデンサにおいて、 上記外装体は、上記コンデンサ素子を収納する大きさを
有する上面が開放された合成樹脂からなるケースを含み
、上記陽極端子板および陰極端子板の各々は、上記ケー
スの互いに対向する側壁に貫通され、それらの各一端部
には上記コンデンサ素子の陽極リードおよび陰極部が導
電性接着剤を介してそれぞれ接続されるとともに、各他
端部は上記ケースの外面に沿って所定方向に折曲げられ
、かつ、上記ケース内には合成樹脂を充填固化してなる
充填材が設けられていることを特徴とするチップ形固体
電解コンデンサ。(1) fixing one end of the anode terminal plate to the anode lead of the capacitor element, connecting one end of the cathode terminal plate to the cathode of the capacitor element, and attaching an exterior body around the capacitor element, In the chip-type solid electrolytic capacitor that is inserted by bending the other end of each of the terminal plates in a predetermined direction along the wall surface of the exterior body, the exterior body has an open top surface that is large enough to accommodate the capacitor element. Each of the anode terminal plate and the cathode terminal plate is penetrated through the mutually opposing side walls of the case, and the anode lead and cathode part of the capacitor element are connected to one end of each of the anode terminal plate and the cathode terminal plate. They are connected to each other via a plastic adhesive, and each other end is bent in a predetermined direction along the outer surface of the case, and a filler made of a synthetic resin filled and solidified is provided inside the case. A chip-type solid electrolytic capacitor characterized by:
極リードには、フープ材の小片が取付けられていること
を特徴とするチップ形固体電解コンデンサ。(2) The chip-type solid electrolytic capacitor according to claim (1), wherein a small piece of hoop material is attached to the anode lead.
ースはその上面開口部に被せられる蓋体を有し、該蓋体
は上記充填材にて上記ケースに接着固矩されることを特
徴とするチップ形固体電解コンデンサ。(3) Utility model registration Claim (1) is characterized in that the case has a lid that is placed over the top opening of the case, and the lid is adhered and fixed to the case using the filler. Chip type solid electrolytic capacitor.
ース内には上記陽極リードを支持して上記フンデンサ素
子をほぼ水平に構置するための台座が一体成形されてい
ることを特徴とするチップ形固体電解コンデンサ。(4) Utility model registration Claim (1) is characterized in that a pedestal for supporting the anode lead and arranging the Fundensa element substantially horizontally is integrally molded within the case. Chip type solid electrolytic capacitor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11658684U JPS6133428U (en) | 1984-07-30 | 1984-07-30 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11658684U JPS6133428U (en) | 1984-07-30 | 1984-07-30 | Chip type solid electrolytic capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6133428U true JPS6133428U (en) | 1986-02-28 |
Family
ID=30675524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11658684U Pending JPS6133428U (en) | 1984-07-30 | 1984-07-30 | Chip type solid electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6133428U (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04278513A (en) * | 1991-03-07 | 1992-10-05 | Nec Toyama Ltd | Chip type solid electrolytic capacitor |
JPH0774051A (en) * | 1993-09-01 | 1995-03-17 | Nippon Chemicon Corp | Method for manufacturing solid electrolytic capacitor |
JPH0817686A (en) * | 1994-04-28 | 1996-01-19 | Rohm Co Ltd | Structure of packaged solid electrolytic capacitor |
JPH097891A (en) * | 1995-06-22 | 1997-01-10 | Nec Corp | Chip-type solid electrolytic capacitor |
JP2000348975A (en) * | 1999-06-02 | 2000-12-15 | Matsushita Electric Ind Co Ltd | Chip-shaped solid-state electrolytic capacitor and manufacture thereof |
JP2004327887A (en) * | 2003-04-28 | 2004-11-18 | Sanyo Electric Co Ltd | Capacitor array or battery array |
JP2019504487A (en) * | 2015-12-18 | 2019-02-14 | ケメット エレクトロニクス コーポレーション | Manufacturing method using capacitor and sealing material thickness regulating thin film |
-
1984
- 1984-07-30 JP JP11658684U patent/JPS6133428U/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04278513A (en) * | 1991-03-07 | 1992-10-05 | Nec Toyama Ltd | Chip type solid electrolytic capacitor |
JPH0774051A (en) * | 1993-09-01 | 1995-03-17 | Nippon Chemicon Corp | Method for manufacturing solid electrolytic capacitor |
JPH0817686A (en) * | 1994-04-28 | 1996-01-19 | Rohm Co Ltd | Structure of packaged solid electrolytic capacitor |
JPH097891A (en) * | 1995-06-22 | 1997-01-10 | Nec Corp | Chip-type solid electrolytic capacitor |
JP2000348975A (en) * | 1999-06-02 | 2000-12-15 | Matsushita Electric Ind Co Ltd | Chip-shaped solid-state electrolytic capacitor and manufacture thereof |
JP2004327887A (en) * | 2003-04-28 | 2004-11-18 | Sanyo Electric Co Ltd | Capacitor array or battery array |
JP2019504487A (en) * | 2015-12-18 | 2019-02-14 | ケメット エレクトロニクス コーポレーション | Manufacturing method using capacitor and sealing material thickness regulating thin film |
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