JPS6132732Y2 - - Google Patents
Info
- Publication number
- JPS6132732Y2 JPS6132732Y2 JP5774377U JP5774377U JPS6132732Y2 JP S6132732 Y2 JPS6132732 Y2 JP S6132732Y2 JP 5774377 U JP5774377 U JP 5774377U JP 5774377 U JP5774377 U JP 5774377U JP S6132732 Y2 JPS6132732 Y2 JP S6132732Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- substrate
- recess
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
本考案は金属製基板を金型内に挿入した後樹脂
を注入して上記基板に複数の樹脂製部材を同時に
形成する、いわゆるアウトサート方式による複合
成形品の成形用金型の改良に関するものである。[Detailed description of the invention] This invention is for molding composite molded products using the so-called outsert method, in which a metal substrate is inserted into a mold and then resin is injected to simultaneously form multiple resin members on the substrate. This relates to the improvement of molds.
近年、この種の成形品は生産工程の合理化,省
力化を図る上で有効な手段としてテープレコー
ダ,ラジオ受信機,レコードプレヤー等のメカ基
板等に採用され実施されるようになつてきている
が、現在ではこれをさらに発展させ、上記メカ基
板に取付けられる各種部材もできる限り樹脂成形
品を用いようとする傾向になつてきている。そこ
で斯かる場合、メカ基板に取付ける複数の樹脂製
部材はメカ基板とは別個の金型で成形した後、切
離してメカ基板に取付けるようになされている
が、このようにした場合、次のような欠点が出て
くるものであつた。すなわちメカ基板用金型と基
板に取付けられる部材用金型とが別々に必要であ
るため金型費用が高くつくこと、基板に取付ける
部材を予め集めて準備しておかなければならず、
この作業に比較的多くの時間がとられてしまうこ
と等の欠点がある。 In recent years, this type of molded product has been adopted and implemented in mechanical boards of tape recorders, radio receivers, record players, etc. as an effective means of streamlining the production process and saving labor. Nowadays, this has been further developed, and there is a tendency to use resin molded products as much as possible for various parts attached to the mechanical board. Therefore, in such cases, the multiple resin members to be attached to the mechanical board are molded in a separate mold from the mechanical board, and then separated and attached to the mechanical board. There were some shortcomings. In other words, the mold cost is high because a mold for the mechanical board and a mold for the parts to be attached to the board are required separately, and the parts to be attached to the board must be collected and prepared in advance.
There are drawbacks such as the fact that this work takes a relatively large amount of time.
そこで本考案はこのような問題を解消するた
め、メカ基板の形成時に、該基板に取付用部材を
も同時に作ることができる金型を提供するもので
あり、以下にその一実施例について図面と共に説
明する。第2図において、1は金属製基板、2は
該基板1に同時成形により固定した基板支持部
材、3は往復運動部材4のガイド孔、5は上記部
材4の抜け止め部材6の係止孔である。上記ガイ
ド孔3,係止孔5の周囲には樹脂製の枠7が同時
成形により固定されている。8は各部材を連結す
ると共に樹脂の流路となるランナーである。上記
往復運動部材4とその抜け止め部材6は第2図に
示すように基板1形成時に同時に成形して作成す
る。すなわち基板1に固定される部材間のランナ
ーを利用して形成し、組立て時には切離すもので
ある。さらに金型について第1図を用いて説明す
ると金型は上金型9と下金型10により構成され
ており、上金型9には基板1に設けた透孔11に
対向する第1の凹部12と基板1の主面1aに対
向する第2の凹部13と樹脂を流すための樹脂通
路14が形成され、下金型には上記透孔11に対
向する第1の凹部12′が設けけられている。し
たがつて、基板1を間にして上下の金型9,10
を接合し、樹脂通路14を通して樹脂を注入する
と、第1の凹部12,12′によつて基板支持部
材2が形成され、第2の凹部13によつて往復運
動部材4が形成される。このようにして形成した
複合成形基板を第2図の如き形のまま組立工程に
送り、組立て時に往復運動部材4,抜け止め部材
6を切離し、第3図のように組立てる。 Therefore, in order to solve this problem, the present invention provides a mold that can simultaneously make mounting members on the mechanical board when forming the board.An example of the mold is described below along with drawings. explain. In FIG. 2, 1 is a metal substrate, 2 is a substrate support member fixed to the substrate 1 by simultaneous molding, 3 is a guide hole of the reciprocating member 4, and 5 is a locking hole of the retaining member 6 of the member 4. It is. A resin frame 7 is fixed around the guide hole 3 and locking hole 5 by simultaneous molding. 8 is a runner that connects each member and serves as a resin flow path. The reciprocating member 4 and its retaining member 6 are formed by molding at the same time as the substrate 1 is formed, as shown in FIG. That is, it is formed using runners between members fixed to the substrate 1, and is separated during assembly. Furthermore, to explain the mold using FIG. 1, the mold is composed of an upper mold 9 and a lower mold 10. A recess 12, a second recess 13 facing the main surface 1a of the substrate 1, and a resin passage 14 for flowing the resin are formed, and a first recess 12' facing the through hole 11 is provided in the lower mold. I'm being kicked. Therefore, the upper and lower molds 9 and 10 are placed with the substrate 1 in between.
When they are joined and resin is injected through the resin passage 14, the first recesses 12, 12' form the substrate support member 2, and the second recess 13 forms the reciprocating member 4. The composite molded substrate thus formed is sent to an assembly process in the form shown in FIG. 2, and during assembly, the reciprocating member 4 and the retaining member 6 are separated and assembled as shown in FIG. 3.
以上説明したように本考案の複合成形品の成形
用金型によれば、金属製基板に設けた透孔に係止
される樹脂製部材を形成するための第1の凹部
と、金属製基板の主面上に形成し、形成後切離し
て上記基板に取付ける樹脂製部材を形成するため
の第2の凹部と、これら第1,第2の凹部に同時
に樹脂を注入するための樹脂通路を設けたため金
属製基板に固着する部材と組立てる部材とを同時
に成形できるので、成形時間の短縮と金型費用の
削減が図れると共に基板に組立てる部材を予め集
めて準備する必要が全くなるなるので組立工数の
削減を図ることができる。 As explained above, according to the mold for forming a composite molded product of the present invention, the first recess for forming the resin member to be locked in the through hole provided in the metal substrate; A second recess is formed on the main surface of the resin member to be separated and attached to the substrate after formation, and a resin passage is provided for simultaneously injecting resin into the first and second recesses. Therefore, the parts to be fixed to the metal board and the parts to be assembled can be molded at the same time, which reduces molding time and mold costs, and eliminates the need to collect and prepare parts to be assembled to the board in advance, reducing assembly man-hours. reduction can be achieved.
第1図は本考案の一実施例における金型の側断
面図、第2図は同金型によつて得た複合成形基板
の斜視図、第3図は同基板を組立てた状態を示す
斜視図である。
1……金属製基板、2……基板支持部材、4…
…往復運動部材、9,10……金型、11……透
孔、12,12′……基板支持部材形成用凹部
(第1の凹部)、13……往復運動部材形成用凹部
(第2の凹部)、14……樹脂通路。
Fig. 1 is a side sectional view of a mold according to an embodiment of the present invention, Fig. 2 is a perspective view of a composite molded substrate obtained using the same mold, and Fig. 3 is a perspective view showing the assembled state of the same substrate. It is a diagram. 1... Metal substrate, 2... Substrate support member, 4...
...Reciprocating member, 9, 10...Mold, 11...Through hole, 12, 12'...Recess for forming substrate support member (first recess), 13...Recess for forming reciprocating member (second recess), 14...resin passage.
Claims (1)
材を形成するための第1の凹部と、上記金属製基
板の主面上に形成し、形成後切離して上記基板に
取付ける樹脂製部材を形成するための第2の凹部
と、上記第1,第2の凹部に同時に樹脂を注入す
るための樹脂通路を有してなる複合成形品の成形
用金型。 a first recess for forming a resin member to be locked in a through hole provided in a metal substrate; and a resin member formed on the main surface of the metal substrate, separated after formation, and attached to the substrate. A mold for forming a composite molded product, the mold having a second recess for forming a mold, and a resin passage for simultaneously injecting resin into the first and second recesses.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5774377U JPS6132732Y2 (en) | 1977-05-07 | 1977-05-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5774377U JPS6132732Y2 (en) | 1977-05-07 | 1977-05-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53153054U JPS53153054U (en) | 1978-12-01 |
JPS6132732Y2 true JPS6132732Y2 (en) | 1986-09-24 |
Family
ID=28955910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5774377U Expired JPS6132732Y2 (en) | 1977-05-07 | 1977-05-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6132732Y2 (en) |
-
1977
- 1977-05-07 JP JP5774377U patent/JPS6132732Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS53153054U (en) | 1978-12-01 |
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