JPS6132211A - Thin-film magnetic head assembly - Google Patents

Abstract

PURPOSE:To improve the recording characteristics, durability, and reliability of a thin-film magnetic head by making the magnetic layer pattern formation source of a thin-film magnetic head chip into a faying surface for a floating slide. CONSTITUTION:A magnetic layer pattern 20 is formed on the surface of a substrate 2, an electrode for the connection of wiring 25 is formed by plating or vapor-deposited on the surface of a bonding pad 23 made of a nonmagnetic insulating material which is joined adjacently to the pattern, and external wiring 26 is connected to an outside surface except the surface where the wiring 25 is provided. A recessed part 28 larger than the space that the wiring 25 occupies is formed so as to protect the surface where the magnetic layer pattern 20 and wiring 25 surface of the slider which face said surface. An adhesive layer 24 is formed of, for example, thermosetting epoxy resin or low-melting-point glass between the surfaces to join them tightly and also protect and reinforce the wiring 25 surface where wire bonding is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thin film magnetic head assembly for magnetic recording and reproducing, and more particularly, it relates to a thin film magnetic head assembly for magnetic recording and reproducing. The present invention relates to the structure of a thin-film magnetic head assembly that is bonded using an insulating material and exhibits high performance, especially in perpendicular magnetic recording and reproduction.

[Background of the invention]

The structure of a conventional thin film magnetic head assembly disclosed in, for example, Japanese Patent Application Laid-Open No. 55-87322, as shown in FIG. The back surface 11 of the substrate 1 is bonded to a floating slider (hereinafter simply referred to as slider) 12 using resin or low melting point glass. A protective film 13 of (8 LOa) was formed, or a glass protective film I3 was bonded.

Even if such a protective film 13 is formed, the recording characteristics as a magnetic head,
From the viewpoint of durability and reliability of the magnetic head, it cannot be said that it is sufficient, and in practical terms it is necessary to make the protective film 13 several tens of micrometers thick. There is a problem in that it takes a lot of time and man-hours to form the protective film and bond the protective glass.

In addition, the thin-film magnetic head for perpendicular magnetic recording and reproduction (Japanese Patent Application No. 57-179854) previously proposed by the present inventors has a thin main pole formed on a substrate, and a very thick auxiliary pole on top of the main pole. The relative positional relationship between the main magnetic pole and the auxiliary magnetic pole of the conventional magnetic head, which form the magnetic poles, is reversed, and by adopting such a structure, a high-performance thin-film magnetic head can be obtained.

However, when performing magnetic recording and reproduction using a thin film magnetic head that has asymmetrical magnetic poles, such as a thin main pole and a very thick auxiliary pole, the magnetic recording characteristics depend on the running direction of the magnetic head and magnetic recording medium. However, in order to increase the magnetic recording density, it became necessary to make the magnetic layer pattern forming surface of the magnetic head chip face the slider bonding surface.

[Purpose of the invention]

The purpose of the present invention is to solve the structural problems of conventional thin film magnetic heads for magnetic recording and reproducing, and to provide a perpendicular magnetic recording and reproducing head that has excellent magnetic recording characteristics and durability, is highly reliable, and is easy to manufacture. To provide a thin film magnetic head assembly.

[Summary of the invention]

The present invention aims to improve the recording characteristics, durability, and reliability of the thin-film magnetic head by using the magnetic layer pattern forming surface of the thin-film magnetic head chip as the bonding surface with the floating slider. , and simplifies the process of manufacturing a thin-film magnetic head.

As shown in FIGS. 1 to 4, the structure of a thin film magnetic head assembly which is an example of the present invention is such that a magnetic layer pattern is formed on a substrate, and the surface on which the magnetic layer pattern is formed is connected to external wiring. A recess, which is a space for protecting the wiring surface, is provided in a part of the magnetic layer pattern formation surface of the thin film magnetic □ head chip, which has a wiring surface that is The above-mentioned recess is provided in a part of the joining surface of the floating slider to be joined, and the magnetic layer pattern forming surface and the joining surface of the floating slider are firmly joined with resin or low melting point glass. The thin film magnetic head assembly is characterized by being particularly suitable as a thin film magnetic head for perpendicular magnetic recording and reproduction.

In the thin film magnetic head according to the present invention, the magnetic layer pattern surface formed on the substrate is firmly bonded to the floating slider bonding surface with resin, low melting point glass, etc., and the wiring surface connected to external wiring is also The magnetic layer pattern forming surface side or the slider bonding surface side is strongly protected and reinforced by a pre-formed recess and an adhesive such as resin or low melting point glass. Therefore, it is possible to improve the recording characteristics and durability of the thin film magnetic head, as well as to improve its reliability. Manufacturing the magnetic head is extremely simple, as all that is required is to provide a recess to protect the wiring surface on the magnetic layer pattern forming surface or the slider bonding surface in advance, and then glue it with resin, etc. .

In the thin film magnetic head assembly of the present invention, the shape of the recess formed to protect the wiring surface may be a groove shape or a notch shape, or any shape that sufficiently protects and reinforces the wiring surface. It may be of any shape. Further, the depth h of the recess is preferably in the range of 0.1 to 0.7 m considering the space of the wiring section and the flying characteristics of the magnetic head, and the depth h of the recess is preferably in the range of 0.1 to 0.7 m. The interval t may be about 0.3 to 0.7 m as a wiring space, and in short, it may be a space that can sufficiently protect the wiring surface, and its value is not particularly limited. The recess may be divided into one or more parts, and the width W of the recess in the lateral direction with respect to the magnetic layer pattern forming surface or the slider bonding surface is preferably 0.3 uin or more in view of the wiring surface, and the upper limit thereof is allowed up to the full width of the magnetic head.

Furthermore, in the thin film magnetic head assembly of the present invention, in order to prevent deterioration of the soft magnetic properties of the magnetic pole due to distortion of the substrate, the substrate on which the magnetic layer pattern is formed and the substrate on which the wiring surface is formed are made of the same material. Alternatively, it is necessary to select a material with an extremely small difference in coefficient of thermal expansion.

Further, in the thin film magnetic head assembly of the present invention, the connection portion with external wiring may be provided on the back surface of the substrate forming the wiring surface.

[Embodiments of the invention]

Embodiments of the present invention will be described below based on the drawings. FIG. 1 is a longitudinal cross-sectional view showing a schematic structure of a thin film magnetic head for perpendicular magnetic recording and reproduction, which is an embodiment of the present invention.

As is clear from the figure, a magnetic layer pattern 20 is formed on the surface of the substrate 2, and a bonding pad 23 made of a non-magnetic insulating material is bonded adjacent to it. The surface of the bonding pad 23 is plated or vapor-deposited with, for example, Au, Ag, Pd, or an alloy thereof to a thickness of several centimeters as an electrode for connecting the wiring 25. Then, a magnetic layer pattern 2 formed on the surface of the substrate 2
0 and the surface of the bonding pad 23 (A
(U wire, Au wire, etc.) 25 is performed by ultrasonic wire bonding method, soldering method, etc.

External wiring 26 is connected to a surface located outside the bonding pad 23 other than the surface on which the wiring 25 is provided. Then, the surface on which the magnetic layer pattern 20 is formed on the substrate 2, the surface on which the wiring 25 is formed on the bonding pad 23 adjacent thereto, the magnetic layer pattern facing surface 27 of the slider 22 facing thereon, and the bonding pad In order to protect the wiring 25 surface of 23, a thermosetting epoxy resin (Epicoat resin manufactured by Hitachi Chemical Co., Ltd., Araldite manufactured by Nichiban Co., Ltd., etc. ) or low-melting point glass to form a bonding layer 24 for strong bonding, and also to protect and reinforce the wiring 25 surface to which wire bonding has been performed. Here, as a wiring connection structure between the wiring 25 of the bonding pad and the external wiring 26, the wire is wired inside the substrate of the bonding pad 23, and the outer surface other than the wire bonding surface facing the recess 28 of the slider 22 is formed. For example, the back surface 29 of the bonding pad 23 can be connected to the external wiring 26 to protect and reinforce the wiring surface. What should be noted here is that the wiring 25 may be damaged by breakage or other problems during the assembly of the magnetic layer, the pattern 20 forming surface, and the wiring 25 surface formed on the bonding pad 23 and the =10-slider 22. The distance t between the concave portion 28 provided on the slider 22 side and the wiring 25 surface provided on the bonding pad 23 is at least 0.3 nn to prevent , it is necessary to form the recess 28 of the slider 22. Further, the depth h of the recess 28 needs to be at least 0.1+nm from the relationship with the wiring 25, but if the depth h is made too large, the air flow will be disturbed and the flying characteristics of the magnetic head will become unstable. Therefore, it is preferably 0.7 nwn or less. Also, the width W of the concave portion 28 in the lateral direction with respect to the magnetic layer pattern forming surface or the slider bonding surface is required to be at least 0.3 cm due to the relationship with the wiring 25, and the upper limit is even if the width W of the magnetic head is full. good. In this embodiment, the shape of the recess 28 is described as one groove, but it may be in the shape of a notch, and the shape is not particularly limited. Further, a plurality of recesses 28 may be provided, and in short, the wiring 28 of the wire bonding pad 23
It can be of any shape as long as it has enough space to protect and reinforce the surface.

Next, another embodiment of the present invention will be described based on the drawings. FIG. 3 shows wiring 35 on the surface where the magnetic layer pattern 30 is formed.
FIG. 3 is a longitudinal cross-sectional view of a thin film magnetic head having a structure in which a recessed portion 38 for protection and reinforcement is formed. As is clear from the figure, a magnetic layer pattern 30 is formed on the surface of the substrate 3 in which notches (recesses 38) have been made in advance, and wiring 35 for flowing current is formed on the surface of the substrate 3.
This thin-film magnetic head has a structure in which the connection is made using the space (distance t) created by the notch, and is firmly bonded to the slider 32 via the adhesive layer 34. FIG. 4 shows a thin film magnetic film in which a cutout (recess 48) is made in advance on the slider 42 side, and the surface on which the magnetic layer pattern 40 to which the wiring 45 is connected is bonded to the slider 42 via the adhesive layer 44. This is a head assembly.

As described in the embodiments above, in the thin film magnetic head assembly of the present invention, all the magnetic layer patterns formed on the substrate surface are firmly protected by an adhesive layer such as resin or glass between the substrate and the slider. Since it is reinforced, a highly reliable thin film magnetic head with excellent magnetic recording characteristics and durability can be obtained. Then, the wiring between the magnetic layer pattern surface formed on the substrate surface and the bonding pad (for example,
Wire bonding, soldering, etc.) are also protected and reinforced by an adhesive layer such as resin between the substrate and slider, so the thin film magnetic head assembly as a whole is extremely reliable.

When manufacturing a magnetic head as shown in FIG. 1, which is a thin-film magnetic head assembly of the present invention, a substrate 2 on which a bonding pad 23 and a thin-film magnetic layer pattern 20 are formed, which is a substrate for connection with external wiring 26. What should be kept in mind when adhering to the thin film magnetic head substrate 2 is that, for example, when bonding with resin, if the thermal expansion coefficients of the bonding pad 23 and the thin film magnetic head substrate 2 are different, the thin film magnetic head substrate 2 will be strained.
The soft magnetic properties of the magnetic poles will deteriorate. therefore,
It is preferable that the bonding pad 23 and the thin film magnetic head substrate 2 are made of the same material. If they cannot be made of the same material, it is necessary to select a material with a small difference in coefficient of thermal expansion between the two, and the difference is 100%. It is desirable that the temperature is not more than X 10-'/°C.

In particular, the thin film magnetic head assembly of the present invention, as in the thin film magnetic head for perpendicular magnetic recording/reproduction proposed earlier by the present inventors (Japanese Patent Application No. 57-179854), It is effective when applied to magnetic head chips whose magnetic recording characteristics vary greatly, and by using the thin-film magnetic head assembly structure of the present invention, the magnetic recording density characteristics can be greatly improved.

〔Effect of the invention〕

As explained in detail above, the thin film magnetic head assembly according to the present invention has a magnetic layer pattern formed on the substrate surface that is strongly protected and reinforced with resin or the like between the substrate and the floating slider. The magnetic layer pattern surface is on the outside, and it has particularly excellent magnetic recording characteristics compared to thin film magnetic heads that use a Sin, AQ, 03 protective film or a protective glass film, and it is easy to peel off the magnetic layer pattern or protective film. The defect rate due to problems such as deterioration of magnetic recording characteristics and decrease in durability can be reduced from several tens of percent in the past to 5% or less.

In addition, in terms of manufacturing processes, many time-consuming and man-hour-intensive operations such as forming conventional SiO2 and H203 protective films and adhering protective glass films are eliminated, and the process is approximately 5. Manufacturing time can be reduced by ~50 hours.

Furthermore, since the shape of the bonding pad for drawing out external wiring can be arbitrarily changed and the size can be increased, wiring connection operations such as soldering are facilitated, and the practical effect is extremely large.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view showing a schematic structure of a thin film magnetic head that is an embodiment of the present invention, FIG. 2 is a view taken along the line B-B in FIG. 1, and FIGS. 3 and 4 are views of the present invention. FIG. 5 is a vertical cross-sectional view showing the schematic structure of a thin-film magnetic head according to another embodiment. FIG. 5 is a vertical cross-sectional view showing the schematic structure of a conventional thin-film magnetic head. Explanation of symbols 1.2.3.4... Substrate 10... Magnetic layer pattern 11... Substrate back side 12... Floating slider 13... Protective film 14... Adhesive layer 20
...Magnetic layer pattern 21...Substrate back side 22...
・Floating slider 23...ponding pad 2
4... Adhesive layer 25... Wiring 26...
External wiring 27...Magnetic layer pattern opposing surface 28...Recessed part

Claims (9)

[Claims] (1) forming a magnetic layer pattern on a substrate, having a surface on which the magnetic layer pattern is formed and a wiring surface connected to external wiring;
A recessed portion serving as a wiring space for protecting the wiring surface is provided in a part of the magnetic layer pattern forming surface of the thin film magnetic head chip, or the method is bonded to face the magnetic layer pattern forming surface of the thin film magnetic head chip. A recess is provided in a part of the floating slider bonding surface as a wiring space to protect the wiring surface, and the magnetic layer pattern forming surface and the floating slider bonding surface are bonded with an insulating material to form a thin film magnetic material. A thin film magnetic head assembly comprising a head. (2) The thin film magnetic head assembly according to claim 1, wherein the distance between the magnetic layer pattern forming surface formed by the recess and the floating slider bonding surface is 0.3 mm or more. (3) A thin film magnetic head according to claim 1 or 2, characterized in that the depth of the recess for wiring space provided on the substrate or slider is 0.1 to 0.7 mm. assembled body. (4) There are one or more recesses, and each recess has a width of 0.3 mm or more in the lateral direction with respect to the magnetic layer pattern forming surface or the floating slider bonding surface, and the total width of the recesses is equal to that of the thin-film magnetic head. A thin film magnetic head assembly according to any one of claims 1 to 3, characterized in that the width is less than or equal to the width of the thin film magnetic head assembly. (5) The thin film magnetic head assembly according to any one of claims 1 to 4, wherein the recess has a shape of a groove or a notch. (6) The substrate on the magnetic layer pattern forming surface and the substrate forming the wiring surface, which are bonded to each other, are made of the same material or have a difference in thermal expansion coefficient of 100 x 10^-^7/°C.
A thin film magnetic head assembly according to any one of claims 1 to 5, characterized in that the following materials are used. (7) The thin film magnetic head according to any one of claims 1 to 6, wherein the recess on the floating slider side is located at a position facing a wiring surface formed on the substrate. assembled body. (8) A patent claim characterized in that, in a thin film magnetic head chip having a magnetic layer pattern forming surface and a wiring surface connected to external wiring, an external wiring connection portion is provided on the back surface of the substrate forming the wiring surface. A thin film magnetic head assembly according to any one of items 1 to 7. (9) The thin film magnetic head assembly according to any one of claims 1 to 8, which is a thin film magnetic head for perpendicular magnetic recording and reproduction.