JPS61285272A - Electrically conductive paint composition - Google Patents

Electrically conductive paint composition

Info

Publication number
JPS61285272A
JPS61285272A JP12682085A JP12682085A JPS61285272A JP S61285272 A JPS61285272 A JP S61285272A JP 12682085 A JP12682085 A JP 12682085A JP 12682085 A JP12682085 A JP 12682085A JP S61285272 A JPS61285272 A JP S61285272A
Authority
JP
Japan
Prior art keywords
weight
electrically conductive
chlorinated polyolefin
resin
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12682085A
Other languages
Japanese (ja)
Inventor
Yasuo Sugawara
泰男 菅原
Toshihiko Ito
敏彦 伊藤
Kengo Kobayashi
謙吾 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12682085A priority Critical patent/JPS61285272A/en
Publication of JPS61285272A publication Critical patent/JPS61285272A/en
Pending legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To provide the titled composition composed of a specific acryl-modified chlorinated polyolefin copolymer and electrically conductive powder (or short fiber), and capable of imparting a polyolefin base with excellent adhesivity, water-resistance and shielding effect without using a primer treatment process. CONSTITUTION:The objective composition contains (A) a copolymer containing chlorinated polyolefin and obtained by polymerizing (i) a monomer mixture of 10-100(wt)% hydrogenated dicyclopentadiene derivative of formula (R is H or lower alkyl; R' is bivalent organic group; n is 0 or 1), 0-90% (meth)acrylic acid ester and 0-50% other copolymerizable vinyl monomer in the presence of (ii) a chlorinated polyolefin resin having a chlorine content of <=50% (the weight ratio of i/ii is 95/5-50/50) and (B) electrically conductive powder such as nickel powder or electrically conductive short fibers.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、塗装性を付与するための表面処理の何等施さ
れていない成形品、フィルムといった等の未処理のポリ
オレフィン系基材に対して、プライマー処理を施さなく
ても優れた密着性、耐水性。
Detailed Description of the Invention (Field of Industrial Application) The present invention applies to untreated polyolefin base materials such as molded products and films that have not been subjected to any surface treatment to impart paintability. , excellent adhesion and water resistance even without primer treatment.

シールド効果を有する導電性塗料組成物に関する。The present invention relates to a conductive coating composition having a shielding effect.

(従来の技術) 近年、IC,LSIの高密度化、高性能化が進むにつれ
て電子機器には多数のIC,LSIが使用されるように
なってきた。しかし、これらのIC,LSIから高周波
パルスが発生するため周囲のテレビ、ラジオ、周辺機器
などがその影響を受け2画像のゆがみ、雑音、誤動作な
どが生じ問題圧なっている。また、IC,LSIからの
高周波パルスのみならず、自動車、高圧線などから発生
する電磁波によっても、テレビ、ラジオなどは同様な影
響を受ける。このよう罠、電磁環境は年々悪化していく
ため、電磁波をシールドする必要性が高まシ、欧米では
法規制が実施され2国内においても法規制の実施は2時
間の問題となってきている。
(Prior Art) In recent years, as the density and performance of ICs and LSIs have increased, a large number of ICs and LSIs have come to be used in electronic devices. However, since high-frequency pulses are generated from these ICs and LSIs, surrounding televisions, radios, peripheral devices, etc. are affected by this, resulting in image distortion, noise, malfunction, etc., and this has become a problem. Furthermore, televisions, radios, and the like are similarly affected not only by high-frequency pulses from ICs and LSIs, but also by electromagnetic waves generated from automobiles, high-voltage lines, and the like. As the electromagnetic environment worsens year by year, there is an increasing need to shield electromagnetic waves, and laws and regulations have been implemented in Europe and the United States, and even in Japan, it has become a two-hour problem to implement laws and regulations. .

電磁波シールドの方法として導電性塗料組成物を電子機
器のハウジングに塗布して、外部から侵入する電磁波か
ら守り、かつ機器自体から発生する電磁波をしやへいす
る方法がある。
As a method of shielding electromagnetic waves, there is a method of applying a conductive coating composition to the housing of an electronic device to protect it from electromagnetic waves that enter from the outside and to suppress electromagnetic waves generated from the device itself.

導電性塗料組成物は、一般に導電性粉末を熱可そ性のア
クリル樹脂、ビニル樹脂、ウレタン樹脂。
Conductive coating compositions generally include conductive powder and thermofusible acrylic resin, vinyl resin, or urethane resin.

ポリエステル樹脂、炭化水素樹脂などに分散したものあ
るいは熱硬化性のアクリル樹脂、不飽和ポリエステル樹
脂、エポキシ樹脂、シリコーン樹脂などに分散したもの
が知られている。
Those dispersed in polyester resin, hydrocarbon resin, etc., or dispersed in thermosetting acrylic resin, unsaturated polyester resin, epoxy resin, silicone resin, etc. are known.

一方1機器類のハウジングとしては種々の産業分野にお
いて、軽量化、防錆、その他の目的から金属に代ってプ
ラスチック化が進みつつある。例、tばパーソナルコン
ピューター、CPU端末、プリンター、VTRなどのハ
ウジングのプラスチック成形品には、ABS樹脂、ポリ
スチレン樹脂。
On the other hand, in various industrial fields, plastics are increasingly being used as housings for equipment in place of metals for weight reduction, rust prevention, and other purposes. For example, ABS resin and polystyrene resin are used for plastic molded housings for personal computers, CPU terminals, printers, VTRs, etc.

変性ポリフェニレンオキサイド樹脂、ポリプロピレン樹
脂、ポリブチレンテレフタレート樹脂などが用いられて
いる。中でも、ポリプロピレン、ポリエチレン等のポリ
オレフィン樹脂が価格の点から多用されることが予想さ
れる。しかし、このポリオレフィン樹脂を用いた成形品
に上記の導電性塗料組成物を塗布した塗膜は、一般に密
着性および耐水性に劣っている。従って、ポリオレフィ
ン樹脂を用いた成形品への密着性および耐水性の塗膜性
能を改善するため、従来から数多くの試みが提案されて
おシ表面処理の方法および樹脂の密着性の向上が検討さ
れている。
Modified polyphenylene oxide resin, polypropylene resin, polybutylene terephthalate resin, etc. are used. Among these, polyolefin resins such as polypropylene and polyethylene are expected to be frequently used due to their cost. However, a coating film obtained by applying the above-mentioned conductive coating composition to a molded article using this polyolefin resin generally has poor adhesion and water resistance. Therefore, in order to improve the adhesion and water-resistant coating performance to molded products using polyolefin resin, many attempts have been proposed, and surface treatment methods and improvements in resin adhesion have been investigated. ing.

例えば、これらの成形品の表面に脱脂処理、クロム酸処
理等の表面処理を施して密着性を改善する方法がある。
For example, there is a method of improving adhesion by subjecting the surface of these molded products to surface treatments such as degreasing treatment and chromic acid treatment.

また、該成形品の表面に塩素化ポリオレフィン又はマレ
イン酸若しくはその無水物で変性したポリオレフィン類
を溶液状態又は分散状態で塗布してブライマー処理した
後、塗膜性能の優れた塗料を塗装する方法がある(例え
ば特公昭44−985号公報、特公昭53−47828
号公報、特開昭53−114874号公報、特開昭54
−15976号公報、特開昭55−48260号公報、
特開昭55−148156号公報、特開昭58−830
42号公報2%開昭58−118809号公報、特開昭
59−30830号公報等参照)。
In addition, there is a method in which a chlorinated polyolefin or a polyolefin modified with maleic acid or its anhydride is applied in a solution or dispersed state to the surface of the molded product, treated with a brimer, and then a paint with excellent film performance is applied. (For example, Japanese Patent Publication No. 44-985, Japanese Patent Publication No. 53-47828)
No. 53-114874, Japanese Patent Application Laid-Open No. 1983-114874
-15976 publication, JP-A-55-48260 publication,
JP-A-55-148156, JP-A-58-830
42, 2% (see JP-A-58-118809, JP-A-59-30830, etc.).

一方、ポリオレフィン樹脂を用いた成形品への塗装塗膜
の密着性を改善する塗料組成物として。
On the other hand, as a coating composition that improves the adhesion of paint films to molded products using polyolefin resin.

エポキシ樹脂、エポキシ樹脂用硬化剤及びエポキシ基と
反応する官能基を有するポリオレフィン又はエチレン共
重合体から成る組成物が提案されている(例えば、*公
昭52−47.487号公報。
A composition comprising an epoxy resin, a curing agent for the epoxy resin, and a polyolefin or ethylene copolymer having a functional group that reacts with the epoxy group has been proposed (for example, Japanese Publication No. 52-47.487).

特開昭52−139142号公報、特開昭56−764
33号公報、特開昭56−72053号公報、特開昭5
6−50971号公報、特開昭58−101122号公
報等参照)。また、NCO化合物と反応する官能基を有
するアクリル系樹脂と塩素化ポリオレフィンから成る組
成物及びNCO化合物と反応する官能基を有する塩素化
ポリオレフィン変性アクリル樹脂から成る組成物が提案
されている(例えば、特公昭57−14767号公報、
特開昭58−17174号公報2%開昭59−2796
8号公報等参照)。更に、アクリル系樹脂と塩素化ポリ
オレフィンから成るアクリル変性塩素化ポリオレフィン
樹脂組成物が提案されている(例えば、特開昭58−7
1966号公報。
JP-A-52-139142, JP-A-56-764
Publication No. 33, JP-A-56-72053, JP-A-5
6-50971, JP-A-58-101122, etc.). Furthermore, compositions made of an acrylic resin having a functional group that reacts with an NCO compound and a chlorinated polyolefin, and compositions made of a chlorinated polyolefin-modified acrylic resin having a functional group that reacts with an NCO compound have been proposed (for example, Special Publication No. 57-14767,
JP-A-58-17174 2% JP-A-59-2796
(See Publication No. 8, etc.) Furthermore, acrylic modified chlorinated polyolefin resin compositions comprising an acrylic resin and a chlorinated polyolefin have been proposed (for example, Japanese Patent Laid-Open No. 58-7
Publication No. 1966.

特開昭58−83042号公報2%開昭58−1762
07号公報9%開昭58−176208号公報、特開昭
58−173113号公報2%開昭58−183718
号公報、特開昭58−194959号公報、特開昭59
−30830号公報等参照)。
JP-A-58-83042 2% JP-A-58-1762
Publication No. 07 9% Publication No. 1988-176208, Publication No. 58-173113 2% Publication No. 188-183718
No. 194959, JP 58-194959, JP 59 Sho 59
-Refer to Publication No. 30830, etc.).

(発明が解決しようとする問題点) しかし、前記の表面処理方法では、密着性等の塗膜性能
を充分に向上させることはできない。また、前記のブラ
イマー処理を施す方法では、塩素化ポリオレフィン及び
変性ポリオレフィン゛の種類によっては、密着性の優れ
た塗膜が得られるものもあるが、プライマーを塗布する
操作が煩雑であること、プライマー処理に多くの時間と
労力を要すること、ひいては塗装コストが上昇すること
などの欠点がある。更に、前記のエポキシ系組成物及び
ウレタン系組成物は、ポリオレフィン系基材に対する密
着性が充分であるとは言い難い。また。
(Problems to be Solved by the Invention) However, the surface treatment method described above cannot sufficiently improve coating film performance such as adhesion. In addition, with the method of applying the primer treatment described above, depending on the type of chlorinated polyolefin or modified polyolefin, a coating film with excellent adhesion can be obtained, but the procedure for applying the primer is complicated, and the primer treatment is complicated. The disadvantages are that the treatment requires a lot of time and effort, and the coating cost increases. Furthermore, it cannot be said that the above-mentioned epoxy compositions and urethane compositions have sufficient adhesion to polyolefin base materials. Also.

2液タイプであるから、混合に時間を要し、更に。Since it is a two-part type, it takes time to mix.

硬化型であることから、ポットライフ等の作業性を考慮
しなければならない等の欠点がある。
Since it is a hardening type, there are drawbacks such as pot life and workability must be taken into consideration.

また、前記、アクリル変性塩素化ポリオレフィン組成物
は、塩素化ポリオレフィンの量に密着性が影響を受け、
充分な密着性を得ようとすると。
In addition, the adhesion of the acrylic-modified chlorinated polyolefin composition is affected by the amount of chlorinated polyolefin,
When trying to obtain sufficient adhesion.

樹脂の外観、光沢等の性能が低下する。従って。Performance such as appearance and gloss of resin deteriorates. Therefore.

密着性、樹脂外観及び光沢といった性能の調整が不可能
であるという欠点がある。
The drawback is that it is impossible to adjust properties such as adhesion, resin appearance, and gloss.

本発明は前記の欠点を解消し、ポリオレフィン樹脂を用
いた成形品の上に表面処理を行なうことなく、直接に塗
布することができ、この成形品に対する密着性、耐水性
、シールド性に優れた導電性塗料組成物を提供すること
を目的とする。
The present invention solves the above-mentioned drawbacks, and can be applied directly onto molded products using polyolefin resin without surface treatment, and has excellent adhesion, water resistance, and shielding properties to the molded products. An object of the present invention is to provide a conductive coating composition.

(問題点を解決するための手段) 本発明は。(Means for solving problems) The present invention is.

(A)  塩素含有率が50重量%以下の塩素化ポリオ
レフィン系樹脂の存在下に。
(A) In the presence of a chlorinated polyolefin resin having a chlorine content of 50% by weight or less.

伸)一般式: 〔式中Rは水素又は低級アルキル基を表わし、R′は2
価の有機基を表わし、nは0又は1である〕で表わされ
ろ水添ジシクロペンタジェン誘導体10〜100重量%
と。
Shin) General formula: [In the formula, R represents hydrogen or a lower alkyl group, and R' is 2
10 to 100% by weight of a hydrogenated dicyclopentadiene derivative
and.

(b)  アクリル酸エステル及び/又はメタクリル酸
エステル0〜90重量%と。
(b) 0 to 90% by weight of acrylic ester and/or methacrylic ester.

(C)上記(a)及び(b)と共重合可能な他のビニル
系単量体0〜50重量%とを。
(C) 0 to 50% by weight of another vinyl monomer copolymerizable with the above (a) and (b).

前記(a)、 (b)及び(C)の総量を100重量%
として。
The total amount of (a), (b) and (C) above is 100% by weight
As.

かつ前記塩素化ポリオレフィン系樹脂と前記単量体とを
前者対後者の重量比が5:95〜50 :50の割合と
なる割合で重合させて得られる塩素化ポリオレフィン含
有共重合体 および (B)  導電性粉末または導電性短繊維を含有してな
る導電性塗料組成物に関する。
and (B) a chlorinated polyolefin-containing copolymer obtained by polymerizing the chlorinated polyolefin resin and the monomer at a weight ratio of 5:95 to 50:50. The present invention relates to a conductive coating composition containing conductive powder or conductive short fibers.

前記の塩素含有率が50重114以下の塩素化ポリオレ
フィン系樹脂としては、塩素含有率が50重量−以下の
ポリエチレン樹脂、ボリプaピレン樹脂、エチレン−プ
ロピレン共重合体、エチレン−酢酸ビニル共重合体等が
用いられる。塩素含有率が50重量%を越えると、ポリ
オレフィン系基材に対する密着性か低下する。塩素の含
有率の決定は9種々の塗膜性能を考慮しつつなされるべ
きであり、好ましくは15〜35重量%である。
Examples of the chlorinated polyolefin resins having a chlorine content of 50 weight or less include polyethylene resins, polypropylene resins, ethylene-propylene copolymers, and ethylene-vinyl acetate copolymers having a chlorine content of 50 weight or less. etc. are used. If the chlorine content exceeds 50% by weight, the adhesiveness to the polyolefin base material will decrease. The chlorine content should be determined taking into account various coating properties, and is preferably between 15 and 35% by weight.

(al成分である水添ジシクロペンタジェン誘導体にお
いて、(0−R’)n  OCC=CH2は8位又は9
位に結合している。πは2価の有機基であるが、基材に
対する密着性の点から好ましくは炭素原子数が1〜18
のアルキレン基又は式−(f−o>m−R,−(式中ピ
及びRは同−又は異なシ、炭素原子数2以上のアルキレ
ン基を表わし9mは1以上の整数を表わす)で表わされ
る基が用いられる。
(In the hydrogenated dicyclopentadiene derivative which is the al component, (0-R')n OCC=CH2 is at the 8th or 9th position
It is connected to the position. π is a divalent organic group, but preferably has 1 to 18 carbon atoms from the viewpoint of adhesion to the base material.
or an alkylene group of the formula -(f-o>m-R, - (wherein Pi and R are the same or different, represents an alkylene group having 2 or more carbon atoms, and 9m represents an integer of 1 or more) A group is used.

水添ジシクロペンタジェン誘導体としては、トリシクロ
デシルアクリレート、トリシクロデシルメタクリレート
、トリシクロデシロキシエチルアクl)レー)、)リシ
クロデシロキシエチルメタクリレート、トリシクロデシ
ロキシプロピルアクリレート、トリシクロデシロキシメ
タクリレート等のトリシクロデシロキシアルキルアクリ
レート又はメタクリレート、ジエチレングリコールトリ
シクロデシルモノエーテルのアクリレート又はメタクリ
レート等のポリアルキレングリコールトリシクロデシル
モノエーテルのアクリレート又はメタクリレートなどが
ある。
Hydrogenated dicyclopentadiene derivatives include tricyclodecyl acrylate, tricyclodecyl methacrylate, tricyclodecyloxyethyl acrylate),) tricyclodecyloxyethyl methacrylate, tricyclodecyloxypropyl acrylate, tricyclodecyloxy Examples include tricyclodecyloxyalkyl acrylate or methacrylate such as methacrylate, acrylate or methacrylate of polyalkylene glycol tricyclodecyl monoether such as acrylate or methacrylate of diethylene glycol tricyclodecyl monoether, and the like.

当該水添ジシ多ロペンタジェン誘導体の量に関しては、
これが10重量%未満の場合、耐水性。
Regarding the amount of the hydrogenated disypolopentadiene derivative,
If this is less than 10% by weight, it is water resistant.

光沢、樹脂外観等が低下するので10〜100重量%、
好ましくは20〜100重量%の量で使用する。
10 to 100% by weight, as gloss, resin appearance, etc. are reduced.
Preferably it is used in an amount of 20 to 100% by weight.

(b)成分であるアクリル酸エステル又はメタクリル酸
エステルとしては、アクリル酸メチル、アクリル酸エチ
ル、アクリル酸ブチル、アクリル酸イツブチル、アクリ
ル酸2−エチルヘキシル、アクリル酸ラウリル等のアル
キルアクリレート、メタクリル酸メチル、メタクリル酸
エチル、メタクリル酸ブチル、メタクリル酸イソブチル
、メタクリル酸2−エチルヘキシル、メタクリル酸ラウ
リル等のアルキルメタクリレート、アクリル酸シクロヘ
キシル、メタクリル酸シクロヘキシル等が挙ケられる。
The acrylic ester or methacrylic ester as component (b) includes alkyl acrylates such as methyl acrylate, ethyl acrylate, butyl acrylate, isbutyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, methyl methacrylate, Examples include alkyl methacrylates such as ethyl methacrylate, butyl methacrylate, isobutyl methacrylate, 2-ethylhexyl methacrylate, and lauryl methacrylate, cyclohexyl acrylate, and cyclohexyl methacrylate.

これらの使用に際しては、1種又は2種以上のいずれで
もよく、マた。メタアクリル酸−2−ヒドロキシエチル
、アクリル酸−2−ヒドロキシエチル、メタアクリル酸
ヒドロキシグロピル。
When using these, either one type or two or more types may be used. 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, hydroxyglopyr methacrylate.

アクリル酸ヒドロキシプロピル、グリシジルメタアクリ
レート、グリシジルアクリレート、メタアクリル酸、ア
クリル酸、メタアクリルアミド、アクリルアミド等の水
酸基、グリシジル基、カルボン酸基、アミン基等の官能
基を含有した重合性単量体を一部併用してもよい。これ
らのエステルを90重量係を越えて使用すると、樹脂外
観、光沢。
Polymerizable monomers containing functional groups such as hydroxyl groups, glycidyl groups, carboxylic acid groups, amine groups, etc., such as hydroxypropyl acrylate, glycidyl methacrylate, glycidyl acrylate, methacrylic acid, acrylic acid, methacrylamide, and acrylamide, are May be used in combination. If these esters are used in excess of 90% by weight, the appearance of the resin and gloss will be reduced.

耐水性等が低下するのでその使用量は90重量%以下と
される。
Since water resistance etc. decrease, the amount used is limited to 90% by weight or less.

前記の(a)水添ジシクロペンタジェン誘導体及び(b
)アクリル酸エステル及び/又はメタクリル酸エステル
と共重合可能な他のビニル系単量体である(C)成分と
しては、スチレン、又はフタル酸、マレイン酸等の不飽
和二塩基酸及びそのエステル、塩化ビニル、酢酸ビニル
等のビニル誘導体などがある。これらのビニル系単量体
を50重量係を越えて使用すると、樹脂に濁シが生じる
ので、50重量%以下の量で用いられる。
The above (a) hydrogenated dicyclopentadiene derivative and (b)
) Component (C), which is another vinyl monomer copolymerizable with acrylic ester and/or methacrylic ester, includes styrene, or unsaturated dibasic acids such as phthalic acid and maleic acid and their esters; Examples include vinyl derivatives such as vinyl chloride and vinyl acetate. If these vinyl monomers are used in an amount exceeding 50% by weight, the resin will become cloudy, so they are used in an amount of 50% by weight or less.

本発明においては、前記塩素化ポリオレフィン系−樹脂
と前記単量体とを前者対後者の重量比が5:95〜50
 :50の割合となる割合で重合させる。この重量比が
50 :50を越えると、耐溶剤性や硬さが低下する。
In the present invention, the weight ratio of the chlorinated polyolefin resin and the monomer is 5:95 to 50.
: Polymerization is carried out at a ratio of 50. If this weight ratio exceeds 50:50, solvent resistance and hardness will decrease.

また1重量比が5:95未満である場合には、ポリオレ
フィン基材に対する密着性が低下する。この重量比が1
0+90〜35:65であるのが好ましい。
Furthermore, if the weight ratio is less than 5:95, the adhesion to the polyolefin substrate will decrease. This weight ratio is 1
Preferably, the ratio is 0+90 to 35:65.

本発明の導電性粉末としてはカーボン、ニッケル、銅、
銀などの粉末が用いられる。電磁波シールド用の塗料組
成物の場合にはニッケル、銅、銀などの粉末を用いるこ
とが好ましい。ニッケル粉は、針状結晶およびフレーク
状結晶のいずれでも良く、商品名としては、インコ社製
のタイプ123゜255.287.ノバメット社製のH
CA−1゜HCTなどがあげられる。またニッケルメッ
キされたマイカ粉または有機繊維粉末をニッケル粉とし
て用いても良い。銅粉、銀粉についても針状。
The conductive powder of the present invention includes carbon, nickel, copper,
Powders such as silver are used. In the case of a coating composition for electromagnetic shielding, it is preferable to use powders of nickel, copper, silver, etc. The nickel powder may be either needle-like crystals or flake-like crystals, and its trade name is Type 123°255.287. manufactured by Inco. Novamet H
Examples include CA-1°HCT. Further, nickel-plated mica powder or organic fiber powder may be used as the nickel powder. Copper powder and silver powder are also acicular.

樹脂状およびフレーク状結晶のいずれでも良く。Either resin-like or flake-like crystals may be used.

銅粉としては、補出金属箔粉工業社製の115シリーズ
、三井金属工業株式会社のアトマイズ銅粉などがある。
Examples of the copper powder include 115 series manufactured by Shushu Metal Foil and Powder Industries Co., Ltd. and atomized copper powder manufactured by Mitsui Kinzoku Kogyo Co., Ltd.

銀粉としては、補出金属箔粉工業社製のシルコートシリ
ーズなどがある。さらに、銅粉に銀をメッキした粉末等
を用いても良く、短繊維としてはポリエステル短繊維な
どにニッケル。
Examples of silver powder include the Silcoat series manufactured by Hakushu Metal Foil and Powder Industries Co., Ltd. Furthermore, copper powder plated with silver may be used, and short fibers such as polyester short fibers and nickel may be used.

銅、銀などをメッキした好ましくは繊維長が1mm以下
の短繊維などが用いられる。これらの粉末または短繊維
は、二種以上を併用しても良い。また。
Short fibers plated with copper, silver, etc. and preferably having a fiber length of 1 mm or less are used. Two or more types of these powders or short fibers may be used in combination. Also.

塗料添加剤として、チキン性の付与を目的として酸化ケ
イ素、酸化チタン、炭酸カルシウム、炭酸マグネシウム
等の充てん材、シリコーンオイル。
Fillers such as silicon oxide, titanium oxide, calcium carbonate, magnesium carbonate, and silicone oil are used as paint additives to impart chicken properties.

シリコーンカップリング剤、イオン系界面活性剤などを
用いても良い。また、希釈用の溶剤としては、トルエン
、キシレン、アセトン、メチルエチルケトン、メチルイ
ソブチルケトン、メチルアルコール、エチルアルコール
、エチルセロンルプ。
Silicone coupling agents, ionic surfactants, etc. may also be used. In addition, as a diluting solvent, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl alcohol, ethyl alcohol, and ethyl selonol.

プチルセロンルブ、脂肪族系の溶剤などの一般に使用さ
れているものが使用される。
Commonly used solvents such as butylceronlube and aliphatic solvents are used.

本発明に用いられる樹脂と導電性粉末の配合比は、塩素
化ポリオレフィン含有共重合体100重量部に対して導
電性粉末が100〜600重量部が好ましい。導電性粉
末が100重量部未満では導電性が低下する傾向にあf
i、600重量部を超えるとペースト状になりにくく塗
装作業性、造膜性が劣るようになり、プラスチック成形
品の塗装表面がざらつく傾向がある。
The blending ratio of the resin and the conductive powder used in the present invention is preferably 100 to 600 parts by weight of the conductive powder per 100 parts by weight of the chlorinated polyolefin-containing copolymer. If the amount of conductive powder is less than 100 parts by weight, the conductivity tends to decrease.
If it exceeds 600 parts by weight, it becomes difficult to form a paste, resulting in poor coating workability and film-forming properties, and the painted surface of the plastic molded product tends to become rough.

また、塗料添加剤を使用する場合には、これらの添加量
は、塗料組成物に対して0.1〜5重量%程度が好まし
い。希釈用の溶剤の混合比には、制限はないが充てん材
の沈降を少なくするためにはその添加量が少ないことが
好ましい。
Further, when paint additives are used, the amount added thereof is preferably about 0.1 to 5% by weight based on the paint composition. There is no limit to the mixing ratio of the diluting solvent, but in order to reduce sedimentation of the filler, it is preferable that the amount added is small.

(発明の効果) 本発明になる導電性塗料組成物をポリオレフィン樹脂の
成形品に塗装した場合、従来の導電性塗料組成物をポリ
オレフィン系基材に塗装した場合に比べて密着性、耐水
性、シールド効果にすぐれたハウジングを得ることがで
きる。
(Effects of the Invention) When the conductive coating composition of the present invention is applied to a polyolefin resin molded article, the adhesion, water resistance, and A housing with excellent shielding effect can be obtained.

(実施例) 本発明の詳細な説明する。(Example) The present invention will be described in detail.

実施例1 攪拌機及び冷却器を備え付けた反応器に塩素化ポリプロ
ピレン(塩素含有率26重量襲、固形分15重量%のト
ルエン溶液)220重量部を入れ。
Example 1 220 parts by weight of chlorinated polypropylene (a toluene solution with a chlorine content of 26% by weight and a solid content of 15% by weight) was placed in a reactor equipped with a stirrer and a cooler.

100℃に加熱し、そこに、メタクリル酸メチル75重
量部、トリシクロデシルメタクリレート(日立化成工業
株式会社製、FA−513M)25重量部及び過酸化ベ
ンゾイル1重量部を均一て溶解して得た溶解物を3時間
にわたって滴下し。
It was heated to 100°C, and 75 parts by weight of methyl methacrylate, 25 parts by weight of tricyclodecyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., FA-513M) and 1 part by weight of benzoyl peroxide were uniformly dissolved therein. Add the lysate dropwise over 3 hours.

同温度に5時間保持して不揮発分42.2重f%のアク
リル変性塩素化ポリプロピレン樹脂を得た。
The same temperature was maintained for 5 hours to obtain an acrylic-modified chlorinated polypropylene resin with a nonvolatile content of 42.2% by weight.

次に上記で得た樹脂100重量部にニッケル粉(補出金
属箔粉工業■製カーボニッケルφ287゜平均粒径4.
0ミクロン)160重量部、メチルインブチルケトン3
5重量部を混合攪拌し、塗料組成物1を得た。この塗料
組成物1をシンナーを用いて7オードカツプで15秒に
なるように粘度を調整し「ノーブレンBC3BJ  (
三菱油化株式会社製、無処理ポリプロピレン厚さ2mm
Xf50画X150mmの大きさ)の成形板にスプレー
塗装し60℃で15分乾燥した。こうして得られた塗膜
について密着性、耐水性、シールド効果を評価した。そ
の結果を第1表に示す。
Next, 100 parts by weight of the resin obtained above was added with nickel powder (carbon nickel φ287°, average particle size 4.
0 micron) 160 parts by weight, methyl in butyl ketone 3
5 parts by weight were mixed and stirred to obtain coating composition 1. The viscosity of this paint composition 1 was adjusted using thinner so that it would last for 15 seconds in a 7-odd cup, and the viscosity was adjusted to "Noblen BC3BJ (
Manufactured by Mitsubishi Yuka Co., Ltd., untreated polypropylene, thickness 2mm
It was spray-painted on a molded plate (size: Xf50 x 150mm) and dried at 60°C for 15 minutes. The coating film thus obtained was evaluated for adhesion, water resistance, and shielding effect. The results are shown in Table 1.

実施例2 攪拌機及び冷却器を備え付けた反応器に塩素化ポリプロ
ピレン(塩素含有率26重量%、固形分15重量%)2
20重量部を入れ、100℃に加熱し、そこに、トリシ
クロデシルメタクリレート(日立化成工業株式会社製、
FA−513M)100重量部及び過酸化ベンゾイル1
重量部を均一に溶解して得た溶解物を3時間にわたって
滴下し、同温度に5時間保持して不揮発分42−1重量
%の水添ジシクロペンタジェン変性塩素化ポリプロピレ
ン樹脂を得た。
Example 2 Chlorinated polypropylene (chlorine content 26% by weight, solid content 15% by weight) 2 was placed in a reactor equipped with a stirrer and a cooler.
Add 20 parts by weight and heat to 100°C, and add tricyclodecyl methacrylate (manufactured by Hitachi Chemical Co., Ltd.,
FA-513M) 100 parts by weight and 1 part benzoyl peroxide
A melt obtained by homogeneously dissolving parts by weight was added dropwise over 3 hours and maintained at the same temperature for 5 hours to obtain a hydrogenated dicyclopentadiene-modified chlorinated polypropylene resin with a nonvolatile content of 42-1% by weight.

次いで上記で得た樹脂100重量部にニッケル粉(補出
金属箔工業■製カーボニルニッケルφ255、平均粒径
3,0ミクロン)100重量部。
Next, to 100 parts by weight of the resin obtained above, 100 parts by weight of nickel powder (carbonyl nickel φ255, average particle size 3.0 microns, manufactured by Shushu Metal Foil Industry ■) was added.

銅粉(補出金属箔粉工業■製115−A)40重量部、
酸化ケイ素粉末(日本エアロシール社製エロジール38
0)0.5重量部、トルエン30重量部を混合攪拌し、
塗料組成物2を得た。次いで実施例1と同様にして粘度
を調整して塗装、乾燥を行ない、同様にして塗膜の評価
を行なった。その結果を第1表に示す。
40 parts by weight of copper powder (115-A manufactured by Shushu Metal Foil & Powder Industry ■),
Silicon oxide powder (Erosil 38 manufactured by Nippon Aeroseal Co., Ltd.)
0) Mix and stir 0.5 parts by weight and 30 parts by weight of toluene,
Paint composition 2 was obtained. Next, the viscosity was adjusted and the coating and drying were carried out in the same manner as in Example 1, and the coating film was evaluated in the same manner. The results are shown in Table 1.

実施例3 攪拌機及び冷却器を備え付けた反応器に塩素化ポリプロ
ピレン(塩素含有率26重量%、固形分15重量%)3
7重量部と塩素化ポリエチレン(塩素含有率26%、固
形分20%)27.5重量部及びトルエン75重量部を
入れ、80℃に加熱し、そこにメタクリル酸メチル55
重量部、メタクリル酸イノブチル20重量部、トリシク
ロデシルメタクリレート(日立化成工業株式会社製、F
A−513M)25重量部、過酸化ベンゾイル1重量部
及びトルエン38重量部を均一に溶解して得た溶解物を
3時間にわたって滴下し、同温度に10時間保持して不
揮発分41.5重量−のアクリル変性塩素化ポリオレフ
ィンを得た。
Example 3 Chlorinated polypropylene (chlorine content 26% by weight, solid content 15% by weight) 3 was placed in a reactor equipped with a stirrer and a cooler.
7 parts by weight, 27.5 parts by weight of chlorinated polyethylene (chlorine content 26%, solid content 20%) and 75 parts by weight of toluene were heated to 80°C, and 55 parts by weight of methyl methacrylate was added thereto.
Parts by weight, 20 parts by weight of Ibutyl methacrylate, Tricyclodecyl methacrylate (manufactured by Hitachi Chemical Co., Ltd., F
A-513M) 25 parts by weight, 1 part by weight of benzoyl peroxide, and 38 parts by weight of toluene were uniformly dissolved and the resulting solution was added dropwise over 3 hours and maintained at the same temperature for 10 hours until the non-volatile content was 41.5 parts by weight. - acrylic modified chlorinated polyolefin was obtained.

次に上記で得た樹脂100重量部に、ニッケルメッキマ
イカ粉(ノプコ社製平均粒径0.2on*ニッケル含i
50%、比重4.1)60重量部、ニッケル粉(補出金
属箔粉工業■製カーボニルNi Φ255)50重量部
、メチルイソブチルケトン30重量部を混合攪拌し、塗
料組成物3を得た。次いで実施例1と同様にして粘度を
調整して塗装、乾燥を行ない、同様にして塗膜の評価を
行なった。
Next, to 100 parts by weight of the resin obtained above, nickel-plated mica powder (manufactured by Nopco Co., Ltd., average particle size 0.2 on
50%, specific gravity 4.1), 50 parts by weight of nickel powder (Carbonyl Ni Φ255 manufactured by Fukushu Metal Foil & Powder Industry ■), and 30 parts by weight of methyl isobutyl ketone were mixed and stirred to obtain coating composition 3. Next, the viscosity was adjusted and the coating and drying were carried out in the same manner as in Example 1, and the coating film was evaluated in the same manner.

その結果を第1表に示す。The results are shown in Table 1.

比較例1 実施例1においてトリシクロデシルメタクリレートの代
わシに、メタクリル酸ブチル25重量部を用いた以外は
、実施例1と同様にして不揮発分42.0重量%のアク
リル変性塩素化ポリプロピレンを得て、更に実施例1と
同様にして塗料組成物4を得た。次いで、実施例1と同
様にして粘度を調整して塗装、乾燥を行ない、同様にし
て塗膜の評価を行なった。その結果を第1表に示す。
Comparative Example 1 Acrylic-modified chlorinated polypropylene with a nonvolatile content of 42.0% by weight was obtained in the same manner as in Example 1, except that 25 parts by weight of butyl methacrylate was used instead of tricyclodecyl methacrylate in Example 1. Then, coating composition 4 was obtained in the same manner as in Example 1. Next, the viscosity was adjusted and the coating was applied and dried in the same manner as in Example 1, and the coating film was evaluated in the same manner. The results are shown in Table 1.

比較例2 実施例1において塩素化ポリプロピレンを用いずに、ト
ルエンを87重量部に仕込み、100℃に加熱し、そこ
にメタクリル酸メチル75重量部。
Comparative Example 2 In Example 1, chlorinated polypropylene was not used, but 87 parts by weight of toluene was added, heated to 100°C, and 75 parts by weight of methyl methacrylate was added thereto.

トリシクロデシルメタクリレート25重量部、トルエン
63重量部及び過酸化ベンゾイル1重量部を均一に溶解
して得た溶解物を3時間にわたって滴下し、同温度に5
時間保持して、不揮発分40.5チのアクリル樹脂を得
た。更に実施例1と同様にして塗料組成物5を得た。
A solution obtained by uniformly dissolving 25 parts by weight of tricyclodecyl methacrylate, 63 parts by weight of toluene, and 1 part by weight of benzoyl peroxide was added dropwise over 3 hours, and the mixture was heated to the same temperature for 5 minutes.
After holding for a period of time, an acrylic resin with a non-volatile content of 40.5 cm was obtained. Furthermore, coating composition 5 was obtained in the same manner as in Example 1.

次いで実施例1と同様にして粘度を調整し塗装。Next, the viscosity was adjusted and painted in the same manner as in Example 1.

乾燥を行ない、同様にして塗膜の評価を行なった。After drying, the coating film was evaluated in the same manner.

その結果を第1表に示す。The results are shown in Table 1.

なお、塗膜性能は下記のようにして行なった。The coating film performance was measured as follows.

密着性 :  JIS  K  5400のゴバン目セ
ロテープ試験法による。
Adhesion: Based on JIS K 5400 cross-cut Sellotape test method.

耐水性 : 湿度95チ以上、温度50℃の状態で72
時間放置後の外観を目視により評価し、下記の記号で示
す。
Water resistance: 72 at humidity of 95 degrees or higher and temperature of 50 degrees Celsius
The appearance after standing for a period of time was visually evaluated and indicated by the following symbols.

◎ 異常なし ○ ややつやびけ ム ややつやびけ、剥離有り シールド効果 : タケダ理研工業■製のスペクトラム
アナライザーによりシールド効果を測定した。
◎ No abnormality ○ Slightly blurred and flaky Slightly blurred and peeled Shielding effect: The shielding effect was measured using a spectrum analyzer manufactured by Takeda Riken Kogyo ■.

第1表 本発明になる導電性塗料組成物によシ、密着性。Table 1 Adhesion of the conductive coating composition of the present invention.

耐水性、シールド効果に優れた塗膜が得られる。A coating film with excellent water resistance and shielding effect can be obtained.

h法・:9−H method: 9-

Claims (1)

【特許請求の範囲】 1、(A)塩素含有率が50重量%以下の塩素化ポリオ
レフィン系樹脂の存在下に (a)一般式: ▲数式、化学式、表等があります▼ 〔式中Rは水素又は低級アルキル基を表わし、R′は2
価の有機基を表わし、nは0又は1である〕で表わされ
る水添ジシクロペンタジエン誘導体10〜100重量%
と、 (b)アクリル酸エステル及び/又はメタクリル酸エス
テル0〜90重量%と、 (c)上記(a)及び(b)と共重合可能な他のビニル
系単量体0〜50重量%とを、 前記(a)、(b)及び(c)の総量を100重量%と
して、かつ前記塩素化ポリオレフィン系樹脂と前記単量
体とを前者対後者の重量比が5:95〜50:50の割
合となる割合で重合させて得られる塩素化ポリオレフィ
ン含有共重合体 および (B)導電性粉末または導電性短繊維 を含有してなる導電性塗料組成物。
[Claims] 1. (A) In the presence of a chlorinated polyolefin resin with a chlorine content of 50% by weight or less, (a) General formula: ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the formula, R is Represents hydrogen or a lower alkyl group, R' is 2
10 to 100% by weight of a hydrogenated dicyclopentadiene derivative represented by a valent organic group, and n is 0 or 1.
(b) 0 to 90% by weight of acrylic ester and/or methacrylic ester; (c) 0 to 50% by weight of another vinyl monomer copolymerizable with (a) and (b) above. The total amount of (a), (b) and (c) is 100% by weight, and the weight ratio of the chlorinated polyolefin resin and the monomer is 5:95 to 50:50. An electrically conductive coating composition comprising a chlorinated polyolefin-containing copolymer obtained by polymerization at a ratio of (B) electrically conductive powder or electrically conductive short fibers.
JP12682085A 1985-06-11 1985-06-11 Electrically conductive paint composition Pending JPS61285272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12682085A JPS61285272A (en) 1985-06-11 1985-06-11 Electrically conductive paint composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12682085A JPS61285272A (en) 1985-06-11 1985-06-11 Electrically conductive paint composition

Publications (1)

Publication Number Publication Date
JPS61285272A true JPS61285272A (en) 1986-12-16

Family

ID=14944753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12682085A Pending JPS61285272A (en) 1985-06-11 1985-06-11 Electrically conductive paint composition

Country Status (1)

Country Link
JP (1) JPS61285272A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002201236A (en) * 2000-12-28 2002-07-19 Mitsubishi Rayon Co Ltd Resin for coating material
US20180265715A1 (en) * 2017-03-15 2018-09-20 Nihon Tokushu Toryo Co., Ltd Antistatic composition for vehicle, vehicle, and method for manufacturing vehicle

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002201236A (en) * 2000-12-28 2002-07-19 Mitsubishi Rayon Co Ltd Resin for coating material
US20180265715A1 (en) * 2017-03-15 2018-09-20 Nihon Tokushu Toryo Co., Ltd Antistatic composition for vehicle, vehicle, and method for manufacturing vehicle
JP2018154665A (en) * 2017-03-15 2018-10-04 日本特殊塗料株式会社 Antistatic composition for vehicle, vehicle, and method for manufacturing vehicle
CN108624155A (en) * 2017-03-15 2018-10-09 日本特殊涂料株式会社 The manufacturing method of vehicle antistatic composition, vehicle and vehicle
US10428227B2 (en) 2017-03-15 2019-10-01 Nihon Tokushu Toryo Co., Ltd. Antistatic composition for vehicle, vehicle, and method for manufacturing vehicle
DE102018105987B4 (en) 2017-03-15 2022-11-03 Nihon Tokushu Toryo Co., Ltd. Antistatic composition for a vehicle, vehicle and method of making a vehicle

Similar Documents

Publication Publication Date Title
JP3577576B2 (en) Surface treatment agent, surface-treated flaky pigment and method for producing the same
US6737474B2 (en) Modified polyvinyl acetal resin, curable resin composition containing the same, and laminated products
JPH07116388B2 (en) EMI blocking paint and its manufacturing method
JPH0372586A (en) Acrylic adhesive composition containing crosslinking agent and impact modifier
DE3625587A1 (en) METHOD FOR IMPROVING THE ADHESIVITY OF ELECTRICALLY DEPOSED METAL LAYERS ON PLASTIC SURFACES
JP2006144003A (en) Conductive coating composition and method for producing the same
JP2006335976A (en) Conductive coating
JPS62275168A (en) Paint resin composition
JPS61285272A (en) Electrically conductive paint composition
KR100582659B1 (en) Electrically conductive paint compositions and preparation method thereof
JP3194163B2 (en) Paint resin
JPH0249087A (en) Adhesive composition
EP0023371A1 (en) Underwater coating composition
WO2002064857A1 (en) Treating agent for metal surface, method of treating metal surface, and surface-treated metallic material
JPS6230168A (en) Metallic coating composition
JPS60177080A (en) Electrically conductive paint
JPS58145769A (en) Conductive coating
JP2005120301A (en) Conductive paint
JPS6230167A (en) Metallic coating composition
JPS5936163A (en) Radiation beam-curable coating composition
JPS61179802A (en) Treatment of metallic powder
JP2005350704A (en) Surface treatment composition for metal
JPS6333780B2 (en)
JPH05186567A (en) Curable epoxy resin composition
JP2000154349A (en) Coating composition and metal material coated with the same