JPS6128407A - Semipermeable membrane module - Google Patents

Abstract

PURPOSE:The form the titled module prevented from the peeling of a resin caused by the contraction thereof at the time of curing and excellent in long- term durability, by curing and sealing the end part of the semipermeable membrane module with a mixture consisting of a resin solution prior to curing and particles comprising the same kind of the already cured resin. CONSTITUTION:A resin solution such as an epoxy resin is mixed with cured resin particles obtained by pulverizing the same kind of the separately pre-cured resin. If necessary, a catalyst is mixed with the resulting mixture to prepare a resin composition which is, in turn, used to cure and seal the end part of a hollow fiber membrane module.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a membrane modineal end-sealed with a mixed resin composition.

More specifically, the present invention relates to a separation membrane module whose ends are hardened and sealed with a resin composition that is a mixture of a resin liquid before hardening and particles of the same kind of resin that have already been hardened.

Semipermeable membrane modules, which are the heart of reverse osmosis, ultrafiltration, and precision R-compliant equipment, have been put into practical use in a variety of formats depending on the application.These various formats of semipermeable membrane modules are Seal on the high-pressure side and low-pressure side is an important element in both cases, and with the exception of some types of modules, all of them use a method of hardening and sealing the ends with adhesive.

Particularly in the case of hollow fiber membrane modules, sealing the ends with an adhesive can be said to be the most important step in the module manufacturing process.

(Prior art) In conventionally manufactured hollow fiber type separation membrane modules, separation occurs between the end sealing resin and the cylindrical case or backing holder due to shrinkage when the resin hardens.
This was one of the causes of module leaks.

In order to solve this problem, the following measures have been taken.

For example, a) A method in which only the hollow fiber bundle is sealed with resin, and after it is sufficiently cured, it is adhesively fixed to the cylindrical case again with resin.

口) A method in which only the hollow fiber bundle is sealed with resin and tightly sealed in a cylindrical case using an O-ring or the like.

c) A method of applying lip to the end sealing part of the cylindrical case to prevent peeling.

2) A method of mixing fillers (glass fiber, silica, alumina, aluminum powder, thermoplastic resin powder, etc.).

e) A method of injecting resin little by little into the casting mold from around it and allowing it to harden.

and so on.

(Problems to be Solved by the Invention) However, each of the above methods has the following problems.

for example, In case b), it takes time because it is a two-step method.

In the case of 0-rings, etc., the sealing part is not bonded to the casing, so the shape must be designed so that it does not move in the longitudinal direction of the module, and the seal part such as the O-ring may have a stagnant part of the raw liquid or permeate. This causes contamination with the raw solution or permeate, and it takes a long time to replace the solution during cleaning and sterilization.

In the case of c), even if the entire peeling edge can be prevented, partial peeling occurs outside the lip, creating a stagnation area for the liquid, and shrinkage stress of the resin concentrates on the lip, resulting in long-term use. Cracks may occur in the nearby sealing resin.

Furthermore, in the case of 2), the cutter used when sealing the end of the hollow fiber bundle and cutting off the hollow closed part at the tip to open the hollow fiber end is severely worn, and the cutter is used for trimming. Since the cut surface is not smooth because the resin contains fillers of

In case e), the cylindrical case of the semipermeable membrane module corresponds to the casting mold, but this method cannot be applied in fact.

In view of this situation, the present inventors have completed the present invention as a result of intensive studies.

(Structure of the Invention) That is, the present invention provides a semi-permeable membrane module whose ends are hardened and sealed with a resin composition, which comprises a resin liquid before hardening, a catalyst if necessary, and an already hardened resin of the same kind. A semipermeable membrane module characterized by curing and sealing a mixture with particles of.

The configuration of the present invention will be explained in detail below.

The characteristic of the cured sealing resin composition used in the module of the present invention is that it is essentially the same kind of material, and the state after curing is a uniform state, that is, close to that obtained by curing without mixing any filler. . However, since a considerable portion of the whole is made of the same type of resin that has been separately cured in advance, this portion has already finished shrinking and will not shrink any further. Incidentally, the similar substances mentioned in the present invention refer to, for example, the relationship between one type of epoxy resin and another epoxy resin.

Moreover, since the resin is a cured product of the same type that is in a uniform state after curing, several of the above-mentioned problems can be solved at the same time.

The cured resin particles used in the module of the present invention are obtained by pulverizing the cured product to a particle size of several tens to several hundred microns by a commonly used pulverizing method.

If the mixing ratio of the cured resin particles is high, the high root shrinkage ratio will be small, but since the viscosity of the mixture before curing increases and the workability deteriorates, there is a limit. Although it depends on the viscosity of the resin liquid, it is desirable to mix 10 to 100 parts with respect to 100 parts of the resin liquid. Examples of low-viscosity resins include, in the case of epoxy resins, bisphenol A and bisphenol F types diluted with alicyclic epoxy resins.

(Effects of the Present Invention) The semipermeable membrane module of the present invention is improved in the above-mentioned problems as compared to conventional ones, and has excellent long-term durability.

Next, the present invention will be explained in detail with reference to Examples and Comparative Examples.

Example 1 [Epicor] 815J - Made of Yuka Shell Epoxy ■...
・・・・・・・・・－・・・・・・・・・・・・・・・
・・・・・・・・・・・・・・・・・・100 copies “Persamide 140” - Made by Henkel Japan ■・・・43
Part Same as above Composition Cured product powder・・・・・・・・・・・・・・・
・・・・・・・・・Curing temperature 53℃ with a composition of 14 parts or more
The linear shrinkage rate after curing for 4 hours was 0.66%.

Example 2 [Epicoat 815J-Made by Yuka Shell Epoxy ■...
・・・・・・・・・・・・・・・2・・・・・・・・・・・・
100 parts "Persamide 140" - manufactured by Henkel Japan Ltd. 43 parts Same composition as above Hardened product powder・・・・・・・・・
......The linear shrinkage rate after curing for 4 hours at a curing temperature of 53° C. was 0.15 yen with a composition of 43 parts or more.

Comparative example [Epicoat 815J... Yuka shell epoxy ■
Made・・・・・・・・・・・・・・・・・・・・・
・・・・・・・・・・・・－・・・・・・・・・・・・1
00 parts "Persamide 140"...Made by Henkel Japan ■...With a composition of 43 parts or more, the linear shrinkage rate after curing at 53°C for 4 hours was 0.7'9. .

Claims (1)

[Claims] A semipermeable membrane module whose ends are cured and sealed with a resin composition, and sealed by curing a mixture of uncured resin liquid, optionally a catalyst, and particles of the same type of resin that have already been cured. A semipermeable membrane module characterized by: