JPS61281577A - Semiconductor optical device - Google Patents

Abstract

PURPOSE:To enable automatic high-precision axial alignment by mounting a semiconductor light-emitting element and a lens base onto the same substrate and preparing the end surface of the semiconductor light-emitting element and a groove fixing a lens through etching. CONSTITUTION:A photo-resist is applied onto a wafer to which the processes of epitaxial growth and the evaporation of an electrode are completed. When the wafer is etched by a HCl+CH3COOH+HPO3 group etching liquid, a vertical surface is obtained in the (011) direction (direction of the arrow A) and a V groove shape is acquired in the (011) direction (direction of the arrow B). Consequently, the end surface of a semiconductor laser 2 and a lens base 3 are obtained through the same etching, and a semiconductor laser is acquired through cleavage at the position of a dotted line. Accordingly, axial alignment requiring high precision is obtained automatically only by loading a lens on the lens base.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor device in which a semiconductor light emitting element and an optical fiber are coupled.

2. Description of the Related Art In order to efficiently extract light from a semiconductor light emitting device to an optical fiber, an optical system such as a lens is used.

Light emitted from a semiconductor light emitting device with a certain spread angle is converged by a lens and efficiently extracted to an optical fiber. At this time, the smaller the lens, the higher the coupling efficiency, but it is necessary to bring the lens closer to the light emitting part of the semiconductor light emitting element, and high precision is required for axis alignment.

2 years.

A conventional optical semiconductor device using a microlens is shown in FIG. 4, as shown in, for example, Japanese Patent Laid-Open No. 57-1288. That is, a groove 4 is formed in the heat sink on which the semiconductor laser 2 is mounted to form the lens stand 3, and the lens 1 is aligned with the groove 4 to adjust the position of the semiconductor laser and perform axis alignment.

Problems to be Solved by the Invention However, in a semiconductor device that uses a heat sink as a lens stand, it is necessary to align the light emitting part of the semiconductor light emitting element to the center of the lens, and it is difficult to align the light emitting part of the semiconductor light emitting element with the center of the lens, which requires high precision. Lens positioning requires sophisticated technology, and in actual coupling, it often results in a decrease in coupling efficiency.Means for Solving the ProblemsIn order to solve the above problems, the present invention The light-emitting element and the lens stand are on the same substrate, and the end face of the semiconductor light-emitting element and the groove for fixing the lens are created by machining.

3. Function The present invention has a semiconductor light emitting element and a lens stand on the same substrate, so that axis alignment, which requires high precision, can be automatically achieved simply by mounting the lens stand on the lens stand. be.

Embodiment FIG. 1 is a perspective view showing an embodiment of the semiconductor device of the present invention. Reference numeral 1 denotes a lens, and a groove 4 and an end surface 6 are formed by etching so that the center of the lens 1 coincides with the light emitting portion 5 of the semiconductor laser 2 .

Next, a method for manufacturing a semiconductor device having the structure of this embodiment will be explained. FIG. 2 is a perspective view showing a wafer after epitaxial growth and electrode deposition steps have been completed. A photoresist is applied to this wafer in the shaded area shown in the plan view of FIG. Add this to HCl 10CHC0OH+HPO3
When etching is performed using a type of etching solution, a vertical surface is obtained in the (011) direction (arrow direction) and a V-groove shape is obtained in the (011) direction (arrow B direction). In this way,
The end face of the semiconductor laser 2 and the lens stand 3 are obtained by the same etching. Furthermore, by performing fold spacing at the positions indicated by dotted lines, a semiconductor laser having a shape as shown in FIG. 1 can be obtained.

Note that although the above embodiments have been explained in the case of a semiconductor laser,
The same applies to edge-emitting LEDs.

Effects of the Invention Since the present invention has a structure having a lens stand on which a semiconductor light emitting element and a lens are mounted on the same substrate, axis alignment which requires high precision can be automatically obtained simply by mounting the lens on the lens stand.

[Brief explanation of the drawing]

FIG. 1 is a trunk view of a semiconductor device according to an embodiment of the present invention, and FIG.
3 is a perspective view of a wafer before processing, FIG. 3 is a plan view of a wafer coated with resist, and FIG. 4 is a perspective view of a conventional semiconductor device. 1...Lens, 2...Semiconductor laser, 3
... Lens stand, 4 ... Groove, 5 ...
...Light emitting part, 6... End face.

Claims (1)

[Claims] A semiconductor optical device has a semiconductor light emitting element and a lens stand on the same substrate, and a groove for fixing the end face of the semiconductor light emitting element and the lens is created by etching.