JPS6127193Y2 - - Google Patents
Info
- Publication number
- JPS6127193Y2 JPS6127193Y2 JP1977008243U JP824377U JPS6127193Y2 JP S6127193 Y2 JPS6127193 Y2 JP S6127193Y2 JP 1977008243 U JP1977008243 U JP 1977008243U JP 824377 U JP824377 U JP 824377U JP S6127193 Y2 JPS6127193 Y2 JP S6127193Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed wiring
- wiring board
- circuits
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 14
- 239000007769 metal material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 229910000833 kovar Inorganic materials 0.000 description 8
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- FEEABVAOCDUXPH-UHFFFAOYSA-N [Ag].[P].[Cu] Chemical compound [Ag].[P].[Cu] FEEABVAOCDUXPH-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【考案の詳細な説明】
本考案は、印刷配線板に関し、特に回路相互間
を、導電線材で接続した印刷配線板に関する。[Detailed Description of the Invention] The present invention relates to a printed wiring board, and more particularly to a printed wiring board in which circuits are connected to each other by conductive wires.
従来印刷配線板における回路の変更による相互
接続は、一本、あるいは、複数本を撚り合わせた
導電線を芯線として絶縁体で被覆した導線を用
い、該被覆導線端部の絶縁被覆を剥離除去し、所
望回路に半田付けで接続することによりなされて
いるか、あるいはコバール線、あるいは、金めつ
きコバール線等を回路間の接続線材として用い、
所望回路上に溶接することによりなされていた。
しかしながら該絶縁被覆導線の端部を半田付ける
方法は、端部の絶縁被覆の剥離に面倒な工数を要
するのみならず、微細回路への半田付けが困難で
ある。また、印刷配線板に部品を搭載し、フロー
ソルダリング等により一時に半田付接続を施す際
に、半田熱により、該接続導線と回路との接続が
破壊されるという欠点を有していた。このため、
回路相互の接続のために、専用の端子穴を該回路
に設けた印刷配線板も出現したが、かゝる印刷配
線板では、回路密度を高くすることが困難であ
り、また、回路の自由な変更が殆ど不可能であつ
た。他方、コバール線、あるいは、金めつきコバ
ール線等を用いて回路相互の接続をなした印刷配
線板においては、回路密度、あるいは、部品搭載
時の半田溶融による接続破壊の点では、前述の導
線を半田付接続してなる印刷配線板に比して改善
されたが、コバール線、あるいは、金めつきコバ
ール線等と回路との接続は、印刷回路を溶融する
ことにより形成されているため、接続時の溶融断
線、あるいは、経時的劣化による断線の危険が大
であつた。さらにまた、コバール線、あるいは、
金めつきコバール線等は、印刷配線板の回路に比
し、体積抵抗率は、約10倍と高く、従つて、回路
の電流容量が半減するという欠点があつた。 Conventionally, interconnection by changing the circuit on a printed wiring board uses a conductor wire made of one or more conductive wires twisted together and coated with an insulator, and the insulation coating at the end of the covered conductor is peeled and removed. , by connecting to the desired circuit by soldering, or by using Kovar wire, gold-plated Kovar wire, etc. as a connecting wire between the circuits,
This was done by welding onto the desired circuit.
However, the method of soldering the ends of the insulated conductive wire not only requires laborious labor to peel off the insulating coating at the ends, but also makes it difficult to solder to fine circuits. Furthermore, when components are mounted on a printed wiring board and soldered together by flow soldering or the like, the soldering heat destroys the connection between the connecting wire and the circuit. For this reason,
Printed wiring boards have also appeared in which dedicated terminal holes are provided in the circuits for mutual connection between circuits, but with such printed wiring boards, it is difficult to increase the circuit density, and it is difficult to increase circuit freedom. It was almost impossible to make any major changes. On the other hand, in printed wiring boards in which circuits are connected using Kovar wire or gold-plated Kovar wire, the above-mentioned conductor wire is less effective in terms of circuit density or connection breakage due to solder melting when components are mounted. Although this is an improvement over printed circuit boards that are made by soldering connections, the connections between Kovar wires, gold-plated Kovar wires, etc. and circuits are formed by melting the printed circuits. There was a high risk of melting and disconnection during connection or disconnection due to deterioration over time. Furthermore, Kovar wire or
Gold-plated Kovar wire and the like have a volume resistivity that is about 10 times higher than printed wiring board circuits, and therefore have the disadvantage that the current capacity of the circuit is halved.
本考案の目的は、かゝる従来の印刷配線板の欠
点を除去した優れた回路間接続を有した印刷配線
板を提供することにある。本考案による印刷配線
板は同一の絶縁基板上に形成されてなる電気伝導
性回路の相互間を、少くとも片面にろう材層を有
する一本の導電性金属材のみで、電気的に接続し
た箇所を１箇所以上設けたことを特徴とする。 An object of the present invention is to provide a printed wiring board that eliminates the drawbacks of conventional printed wiring boards and has excellent circuit connections. The printed wiring board according to the present invention electrically connects electrically conductive circuits formed on the same insulating substrate with only one conductive metal material having a brazing metal layer on at least one side. It is characterized by having one or more locations.
以下、本考案の実施例を、図面により説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
第１図の部分斜視図に示す如く印刷配線板にお
ける回路間の相互接続はろう材層１と良導電性金
属２とで構成された接続材３で、電気的に独立し
た二つの回路４および５を接続した接続部１０に
よつてなされている。第２図は、この接続部１０
の断面拡大図であり、該接続材３は、ろう材層１
を該金属２の片面に設けた例である。ここにおい
て二つの回路４，５は鋼材で形成されている。該
接続材３のろう材層１は、銀−リン−銅合金であ
り、該金属２は銅材である。 As shown in the partial perspective view of FIG. 1, the interconnection between the circuits on the printed wiring board is through a connecting material 3 composed of a brazing filler metal layer 1 and a highly conductive metal 2, and two electrically independent circuits 4 and This is done by a connecting portion 10 to which 5 is connected. FIG. 2 shows this connection 10
is an enlarged cross-sectional view of , and the connecting material 3 is a brazing material layer 1
is provided on one side of the metal 2. Here, the two circuits 4 and 5 are made of steel. The brazing material layer 1 of the connecting material 3 is a silver-phosphorus-copper alloy, and the metal 2 is a copper material.
次に本実施例における回路変更部を有する印刷
配線板の形成方法を述べる。 Next, a method for forming a printed wiring board having a circuit modification portion in this embodiment will be described.
今、印刷配線板を製造後、その回路を変更する
必要が生じ、両回路４および５を接続する場合を
想定する。先ず、回路４と接続材３に、ろう材層
１側を回路４と接するように重ねておき、抵抗溶
接法による溶接機を用いて該線材３の上から通電
加熱して溶接する。銀−リン−銅合金からなるろ
う山層１の融点は、回路４や該金属２に用いる銅
の融点よりはるかに低く、ろう材層１のみを溶融
させる加熱条件を見出すことは極めて容易であ
る。かゝる加熱溶融条件下で、接続部３を通電加
熱すると、ろう材層１のみが溶融するとともに、
回路４への溶融したろうの拡散が生じ、ろう材層
１と回路４の銅とが合金化して溶着し、回路や線
材自体には殆ど損傷を与えることなく接続点１１
が形成される。前述と同様にして回路５と接続材
３との接続点１３が形成され、回路変更が完了す
る。 Now, assume that after manufacturing the printed wiring board, it becomes necessary to change the circuit, and both circuits 4 and 5 are connected. First, the circuit 4 and the connecting material 3 are stacked so that the brazing material layer 1 side is in contact with the circuit 4, and welding is performed by heating the wire 3 with electricity using a welding machine using a resistance welding method. The melting point of the brazing filler metal layer 1 made of a silver-phosphorus-copper alloy is much lower than the melting point of copper used for the circuit 4 and the metal 2, and it is extremely easy to find heating conditions that melt only the brazing filler metal layer 1. . When the connecting portion 3 is heated with electricity under such heating and melting conditions, only the brazing material layer 1 is melted, and
The molten solder diffuses into the circuit 4, and the brazing material layer 1 and the copper of the circuit 4 are alloyed and welded, and the connection point 11 is formed without causing almost any damage to the circuit or the wire itself.
is formed. The connection point 13 between the circuit 5 and the connection material 3 is formed in the same manner as described above, and the circuit modification is completed.
このようにして製造された印刷配線板は、接続
材３の成分が印刷回路と殆ど同一であるため、接
続部１０を印刷回路で形成した印刷配線板と電気
的諸特性が殆ど同じになるという利点を持つてい
る。またろう材の融点は銅の融点よりもはるかに
低いとはいえ、印刷配線板に部品を搭載し接続す
る時の半田付け温度よりははるかに高いので、半
田付け時の熱により接続部１１，１２が破壊され
るということはない。 The printed wiring board manufactured in this manner has almost the same electrical characteristics as a printed wiring board in which the connecting portion 10 is formed of a printed circuit, since the components of the connecting material 3 are almost the same as those of the printed circuit. Has advantages. Also, although the melting point of the brazing filler metal is much lower than that of copper, it is much higher than the soldering temperature when mounting and connecting components to a printed wiring board, so the heat during soldering causes the connection part 11, 12 will never be destroyed.
以上、本考案による印刷配線板は、回路接続部
の印刷回路や接続材に殆ど損傷を与えないので経
時的劣化に対して強く、接続信頼性が高い。また
回路相互の接続のための座や穴を必要としないの
で、回路密度が損われることもない。 As described above, the printed wiring board according to the present invention hardly causes any damage to the printed circuit or the connecting material at the circuit connecting portion, so it is resistant to deterioration over time and has high connection reliability. Furthermore, since no seats or holes are required for interconnecting circuits, circuit density is not compromised.
以上、本考案による印刷配線板の特徴を一実施
例を用いて説明したが、ろう材層１は、金属２の
片面のみならず、両面あるいは周囲に形成されて
いても支障なく、ろう材層１の組成も、銀−リン
−銅の合金のみならず、印刷回路４，５と金属２
とをろう付けするに適切な合金、もしくは、単体
であれば何ら支障はないことは勿論である。 As above, the characteristics of the printed wiring board according to the present invention have been explained using one embodiment. However, the brazing material layer 1 can be formed not only on one side of the metal 2, but also on both sides or around the metal 2 without any problem. The composition of 1 is not only a silver-phosphorus-copper alloy, but also a printed circuit 4, 5 and a metal 2.
Of course, there will be no problem as long as it is an alloy suitable for brazing or a single substance.
第１図は本考案による印刷配線板の部分斜視図
であり、第２図は接続部の拡大断面図である。
図中の符号、１……ろう材層、２……良導電性
金属、３……線材、４，５……互いに独立した印
刷回路、１０……接続部、１１，１２……接続
点。
FIG. 1 is a partial perspective view of a printed wiring board according to the present invention, and FIG. 2 is an enlarged sectional view of a connecting portion. Symbols in the figure: 1... Brazing material layer, 2... Good conductive metal, 3... Wire, 4, 5... Mutually independent printed circuits, 10... Connection portion, 11, 12... Connection point.
Claims (1)
を、少くとも片面にろう材を有する一本の導電性
金属材のみで電気的に接続した箇所を１箇以上有
することを特徴とする印刷配線板。 Printing characterized by having one or more locations where electrically conductive circuits on the same printed wiring board are electrically connected only by one conductive metal material having a brazing material on at least one side. wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977008243U JPS6127193Y2 (en) | 1977-01-26 | 1977-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977008243U JPS6127193Y2 (en) | 1977-01-26 | 1977-01-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53103564U JPS53103564U (en) | 1978-08-21 |
| JPS6127193Y2 true JPS6127193Y2 (en) | 1986-08-13 |
Family
ID=28694586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977008243U Expired JPS6127193Y2 (en) | 1977-01-26 | 1977-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127193Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528244A (en) * | 1975-07-09 | 1977-01-21 | Mitsui Eng & Shipbuild Co Ltd | Floating wave power plant with propeller turbine |
| JPS528238A (en) * | 1975-06-11 | 1977-01-21 | Hitachi Ltd | Contactless ignition system |
-
1977
- 1977-01-26 JP JP1977008243U patent/JPS6127193Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528238A (en) * | 1975-06-11 | 1977-01-21 | Hitachi Ltd | Contactless ignition system |
| JPS528244A (en) * | 1975-07-09 | 1977-01-21 | Mitsui Eng & Shipbuild Co Ltd | Floating wave power plant with propeller turbine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53103564U (en) | 1978-08-21 |
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