JPS6127065U

JPS6127065U - Absorption heat pump device

Info

Publication number: JPS6127065U
Application number: JP11063484U
Authority: JP
Inventors: 貴雄田中; 米造井汲
Original assignee: 三洋電機株式会社
Priority date: 1984-07-20
Filing date: 1984-07-20
Publication date: 1986-02-18

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案によるこの種の吸収ヒートポンプ装置の
一実施例を示した慨略構成説明図、第２図は第１図に示
したこの種の吸収ヒートボンブ装置を運転した場合のデ
ューリンク線図の一例を表わした図である。１・・・発生器、２・・・凝縮器、３・・・低温蒸発器
、４・・・吸収器、５・・・高温蒸発器、６・・・高温
吸収器、７，８・・・高温、低温溶液熱交換器、１２・
・・ポンプ、２７．２８・・・管、２９・・・加熱器、
３０・・・冷却器、３１・・・給熱器、３２・・・熱交
換器、３３・・・被加熱器、４５．４６．４７・・・溶
液溜め、６０．６１・・・オーバーフロー管。Fig. 1 is a schematic structural explanatory diagram showing one embodiment of this type of absorption heat pump device according to the present invention, and Fig. 2 shows the due link line when this type of absorption heat bomb device shown in Fig. 1 is operated. It is a figure showing an example of a figure. 1... Generator, 2... Condenser, 3... Low temperature evaporator, 4... Absorber, 5... High temperature evaporator, 6... High temperature absorber, 7, 8...・High temperature, low temperature solution heat exchanger, 12・
...pump, 27.28...pipe, 29...heater,
30...Cooler, 31...Heat supply device, 32...Heat exchanger, 33...Heated device, 45.46.47...Solution reservoir, 60.61...Overflow pipe .

Claims

[Scope of utility model registration request]

Generators and condensers driven by the heat of waste steam and other low-temperature fluids, low-temperature evaporators that evaporate refrigerant using the heat of waste steam and other low-temperature fluids, and generated when absorption liquid absorbs refrigerant vapor from low-temperature evaporators. An absorber that uses the heat generated to raise the temperature of the refrigerant liquid in a heat exchanger built into the vessel, a high-temperature evaporator that evaporates the refrigerant liquid that has risen in temperature in the heat exchanger of the absorber, and a high-temperature evaporator that uses heat from the high-temperature evaporator Piping connects devices such as high-temperature absorbers, high-temperature solution heat exchangers, and low-temperature solution heat exchangers that raise the temperature of the fluid in the heated device built into the device using the heat generated when the absorption liquid absorbs refrigerant vapor. In addition, the absorption liquid overflows from the high-temperature absorber, bypasses the high-temperature solution heat exchanger, and is distributed to the heat exchanger of the absorber, and also overflows from the absorber and bypasses the low-temperature solution heat exchanger. The absorber, high-temperature absorber, generator and absorber are each placed in a liquid-sealed type U so as to be distributed to the heater of the container.
An absorption heat pump device characterized by being connected by a letter-shaped overflow pipe.