JPS61270198A - Transfer sheet - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Li business field of use) The present invention relates to a transcription sheet, and more particularly, to a transcription sheet.

This invention relates to a transfer sheet (K) that can transfer a pattern well even onto a substrate with poor surface smoothness such as a wooden substrate.

(Prior art) Conventional transfer methods include a method using a transfer sheet in which a release layer, a pattern layer, and an adhesive layer are laminated on a film base material by printing, and A method has been adopted in which both a transfer sheet and an adhesive transfer sheet are used to first transfer the adhesive sheet and then the pattern sheet to the base material.

(Problem to be Solved by the Invention) However, although the former method can perform smooth transfer in the case of a transfer substrate with one surface smooth, the adhesive layer is thin, so In the case of a substrate with significant unevenness, it is difficult to obtain good adhesion between the substrate and the pattern layer and a clear pattern, and the post-mortem method requires two types of transfer sheets with different specifications. However, since the transfer itself requires two steps, there are problems with high costs and poor workability.

The present invention has been developed in view of the above points, and it is possible to obtain a clear pattern with good adhesion between the transfer substrate and the pattern layer even on the transfer substrate having an uneven surface. The purpose is to provide a transfer sheet that is easy to work with and has good workability.

(Means for Solving the Problems) The transfer sheet of the present invention includes a film base material, a release layer provided on the core film base material, a pattern layer provided on the release layer,
It is composed of an adhesive layer made of a thermoplastic resin film provided on the pattern layer by extrusion lamination.

(Example) - a release layer provided; film base Material 1 is polyester with a thickness of 6 to 100 μm.

A resin film such as nylon or polypropylene, or a cellophane film alone or in combination can be used, and transparent or translucent films are used.

The peeling layer 2 is provided to peel off the film base material 1 after transfer, and its material can be Vi, acrylic, cellulose, rubber, or vinyl resin, and its thickness is usually 1. It is about -10μ. Forming means for the release layer 2 include gravure coating, roll coating, air knife coating, kiss coating, spray coating,
Examples include peta coat and flow coat made by Silk Scree.

This is a pattern layer formed on the 3Fi release layer 2. The pattern layer 3 includes a vehicle and a coloring agent such as a pigment or dye.

It is formed by adding and kneading a plasticizer, stabilizer, other additives, solvent or diluent.

Vehicles include polymethyl methacrylate, polyethyl methacrylate, and polyethyl acrylate.

A homopolymer of acrylic acid monomers such as polybutyl acrylate or methacrylic acid monomers.

or copolymers containing these acrylic acid monomers and methacrylic acid monomers as comonomers, cellulose derivatives such as ethyl cellulose, ethyl hydroxyethyl cellulose, cellulose acetate glopionate, cellulose acetate, and polystyrene.

Styrenic resins such as poly-α-methylstyrene.

1 m of rosin, rosin-modified maleic acid resin, rosin-modified phenolic resin, rosin ester resin such as 9-polymerized rosin, vinyl acetate resin, coumaron resin, vinyl toluene resin, vinyl chloride resin, polyester, polytalethane, butyral resin, rubber resin, etc. Alternatively, two or more kinds can be used in combination.

The pattern layer 3 is formed by, for example, gravure printing, silk screen printing, offset printing, etc., and its thickness is usually about 5 to 15 μm. Further, the pattern layer 3 may be formed partially or entirely on the release layer 2.

5 is an adhesive layer formed on the pattern layer 3 and made of a thermoplastic resin film. As the thermoplastic resin which is this material, ethylene vinyl acetate copolymer, polyethylene, polypropylene, butyral resin, etc. can be used. The adhesive layer 5 is formed by extruding and laminating the resin using a T-die extruder, and has a thickness of 10 mm.
~100μ, particularly 10-30μ is preferred.

If necessary, a primer layer 4 may be provided between the pattern layer 3 and the adhesive layer 5 to improve the adhesion between the pattern layer 3 and the adhesive layer 5. The primer layer 4 is formed by applying transparent or opaque ink such as rubber resin, 3##-ethylene vinyl acetate copolymer, polypropylene resin, acrylic resin, etc. by a known coating method.

When transferring the transfer sheet of the present invention to a transfer base material, the transfer sheet was heat-pressed onto the transfer base material 6 with the adhesive layer 5 facing each other as shown in FIG. After that, by peeling off the film base material 1, the pattern layer 3 and the like can be transferred to the base material 6. As a heat compression bonding method, 1, for example, using a rubber roll, at a temperature of 140 to 220°C,
Pressure 2-5 kg/cd.

It is carried out at a speed of 5-15 a/l1il. Specific examples of the transfer target substrate 6 include fiberboard, particle board, plywood, etc., but are not limited to these.

Next, the present invention will be explained in more detail by giving specific examples.

Example 1 A release layer was formed by coating a polyester film base material with a thickness of 25 μm with an acrylic resin-based transparent ink, and then gravure printing was performed on the release layer using an acrylic resin-based ink to form a pattern layer having a wood grain pattern. Formed. Next, a rubber-based ink was coated on the pattern layer using gravure printing) to form one layer of primer, and then ethylene-vinyl acetate copolymer was extruded and laminated on the primer layer using a T-die extruder to form a 20μ adhesive. An agent layer was formed to obtain a transfer sheet.

Next, the transfer sheet was transferred to a particle board with a thickness of 10 mm with an uneven surface using a thermal transfer machine.

When transferred at a temperature of 200°C, a pressure of 2 kll/cd, and a speed of 5 m/-, a clear wood grain pattern could be efficiently transferred despite the surface unevenness of the wood base material, and the transferred wood grain pattern The adhesion was also good.

(Effects of the Invention) As described above, in the transfer sheet of the present invention, an adhesive layer made of a thermoplastic resin film provided by extrusion lamination is formed on the pattern layer.

It is a matter of course that the adhesive layer has sufficient thickness and has a smooth surface.The adhesive layer will surely adhere to the transfer substrate even if the surface is uneven, resulting in clear and excellent adhesion. The transfer sheet of the present invention has the effect of being able to transfer a picture pattern, and the transfer sheet of the present invention is easy to manufacture, easy to handle, and has good workability.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view showing an embodiment of the transfer sheet of the present invention;
FIG. 2 is a longitudinal cross-sectional view showing a state in which the transfer sheet of the present invention is used to transfer onto a transfer substrate.

Claims (1)

[Claims] a film base material, a release layer provided on the film base material,
A transfer sheet comprising a pattern layer provided on the release layer and an adhesive layer made of a thermoplastic resin film provided on the pattern layer by extrusion lamination.