JPS61267335A - Intercircuit connection method and conductive sheet to be used in the same method - Google Patents
Intercircuit connection method and conductive sheet to be used in the same methodInfo
- Publication number
- JPS61267335A JPS61267335A JP60109784A JP10978485A JPS61267335A JP S61267335 A JPS61267335 A JP S61267335A JP 60109784 A JP60109784 A JP 60109784A JP 10978485 A JP10978485 A JP 10978485A JP S61267335 A JPS61267335 A JP S61267335A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- board
- conductive sheet
- sheet
- terminal parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明はリードレスＩＣ，ハイブリッド回路、ＬｓＩど
基板のボンディングステッヂワイＶ−に代わる液晶板と
回路端子等の回路間の接続を行なう接続方法および該回
路間の接続方法に使用する導電シートに関する。[Detailed Description of the Invention] "Industrial Application Field" The present invention is a bonding step for leadless ICs, hybrid circuits, LSI substrates, etc., which replaces the bonding step W-V- for connecting circuits such as liquid crystal boards and circuit terminals. The present invention relates to a conductive sheet used in the method and the method for connecting circuits.
「従来の技術」
従来、半導体基板の多数個の並列された基板端子部と、
該半導体基板に取付ｉノられる半導体の多数個の並列さ
れた接続端子部とはワイヤーボンディングによってワイ
ヤー接続されている。このため高価な設備が必要である
とともに、ワイヤーの配線接続に時間がかかり、コスト
高となる欠点があった。"Prior Art" Conventionally, a large number of parallel board terminal portions of a semiconductor substrate,
A large number of parallel connection terminal portions of the semiconductor attached to the semiconductor substrate are wire-connected by wire bonding. For this reason, expensive equipment is required, and it takes time to connect the wires, resulting in high costs.
Ｅ本発明の目的」
本発明は以上のような従来の欠点に鑑み、比較的安価な
設備でかつ短時間に多数個の並列された基板端子部と接
続端子部とを導電線によって接続することのできる回路
間の接続方法を得るにある。E. Purpose of the Invention In view of the above-mentioned drawbacks of the conventional art, the present invention aims to connect a large number of board terminals and connection terminals arranged in parallel using conductive wires in a short time using relatively inexpensive equipment. The purpose is to obtain a connection method between circuits that can be used.
本発明の他の目的は多数個の並列された基板端子部と接
続端子部とを同時にそれぞれ接続することのできる導電
シートを得るにある。Another object of the present invention is to obtain a conductive sheet capable of simultaneously connecting a large number of parallel board terminal portions and connection terminal portions.
Ｕ本発明の目的を達成するための手段」本発明は多数個
の並列された基板端子部を有する回路が形成されたリー
ドフレームあるいは半導体基板等の基板と、この基板の
基板端子部とそれぞれ導電線を介して接続される多数個
の並列された接続端子部を有する半導体等の部品を所定
位置に取付ける取付は工程と、前記基板端子部と前記接
続端子部とをそれぞれ接続することのできる多数個の並
列された導電線が形成された導電シートを用いて接続固
定する接続工程とを含むことを特徴としている。Means for Achieving the Objects of the Invention The present invention provides a substrate such as a lead frame or a semiconductor substrate on which a circuit having a large number of parallel substrate terminal portions is formed, and a conductive substrate that connects the substrate terminal portions of the substrate to each other. Attachment of components such as semiconductors having a large number of parallel connection terminal parts connected via wires to a predetermined position is a process, and a large number of parts that can respectively connect the board terminal parts and the connection terminal parts are used. The method is characterized in that it includes a connecting step of connecting and fixing using a conductive sheet on which parallel conductive wires are formed.
「本発明の実施例」
以下、図面に示す実施例により、本発明の詳細な説明す
る。"Embodiments of the present invention" The present invention will be described in detail below with reference to embodiments shown in the drawings.
第１図ないし第６図の実施例において、１は多数個の回
路２が形成された半導体基板３に多数個の並列された接
続端子部４が形成された半導体５をあらかじめ設定され
た位置に取付ける取付は工程である。In the embodiments shown in FIGS. 1 to 6, reference numeral 1 refers to a semiconductor substrate 3 on which a large number of circuits 2 are formed, and a semiconductor 5 on which a large number of parallel connection terminal portions 4 are formed, at predetermined positions. Installation is a process.
６は前記半導体基板３の多数個の並列された基板端子部
７と前記半導体５の接続端子部４とをそれぞれ接続する
接続工程で、この接続工程６は前記基板端子部７と接続
端子部４とをそれぞれ接続することのできる導電１ａ８
が備えられた、第５図および第６図に示す導電シート９
を用いて、該導電シート９の導電線８を基板端子部７と
接続端子部４とに当接させるように位置させる導電シー
ト取付は工程１０と、この導電シート取付は工程１０後
に導電シート９の導電線８を接続端子部４および基板端
子部７に固定させる導電線固定工程１１とから構成され
ている。Reference numeral 6 denotes a connection step for connecting a large number of parallel board terminal portions 7 of the semiconductor substrate 3 and the connection terminal portions 4 of the semiconductor 5, respectively. Conductive 1a8 that can be connected to
The conductive sheet 9 shown in FIGS. 5 and 6 is provided with
The conductive sheet is attached in step 10, in which the conductive wire 8 of the conductive sheet 9 is positioned so as to come into contact with the board terminal part 7 and the connection terminal part 4, and the conductive sheet is attached after step 10. The conductive wire fixing step 11 includes a conductive wire fixing step 11 in which the conductive wire 8 is fixed to the connecting terminal portion 4 and the board terminal portion 7.
前記導電線固定工程１１は導電シート９の導電線８に、
例えば１２５℃以上の加熱で溶着できる導電性の接着剤
１２、例えばスズ、亜鉛、ハンダ、ロー材等がメッキ処
理等によって付着されている場合には１２２℃以上の加
熱作業であり、また導電シート９の導電線８に導電性の
接着剤が塗布されている場合には押し圧作業によって行
なう。In the conductive wire fixing step 11, the conductive wires 8 of the conductive sheet 9 are
For example, if a conductive adhesive 12 that can be welded by heating at 125°C or higher, such as tin, zinc, solder, brazing material, etc., is attached by plating, etc., the heating work is at 122°C or higher, and the conductive sheet If a conductive adhesive is applied to the conductive wire 8 of 9, this is done by pressing.
前記導電シー１−〇は、第５図および第６図に示すよう
に、薄肉のシリコンゴム等のゴムあるいは絶縁合成樹脂
材で形成された保持部材としての軟質シート１３ど、こ
のシート１３の上面にドライまたはウェットエツヂング
、印刷、電鋳等により形成した前記基板端子部γと接続
端子部４とをそれぞれ接続づ−ることのできる多数個の
並列された導電線８と、この導電線８の上面に接着固定
された、例えば１２５°Ｃ以−にの加熱で前記基板端子
部７および接続端子部４に溶着可能なスズ、亜鉛、ハン
ダ、ロー材等の接着剤１２とから構成されている。As shown in FIGS. 5 and 6, the conductive sheet 1-0 includes a soft sheet 13 as a holding member made of rubber such as thin silicone rubber or an insulating synthetic resin material, and the upper surface of this sheet 13. A large number of parallel conductive wires 8 that can respectively connect the board terminal portions γ and the connection terminal portions 4 formed by dry or wet etching, printing, electroforming, etc., and the conductive wires 8. It is composed of an adhesive 12 such as tin, zinc, solder, brazing material, etc., which is adhesively fixed to the upper surface and can be welded to the board terminal part 7 and the connection terminal part 4 by heating to 125° C. or higher, for example. There is.
なお、前記接着剤１２は導電線８の上面にメッキ処理等
によって付着されている。Note that the adhesive 12 is attached to the upper surface of the conductive wire 8 by plating or the like.
「本発明の異なる実施例」
次に第７図ないし第１６図に示す本発明の異なる実施例
につき説明する。なお、これらの実施例の説明に当って
、前記本発明の実施例と同一構成部分には同一符号を付
して重複する説明を省略する。"Different Embodiments of the Present Invention" Next, different embodiments of the present invention shown in FIGS. 7 to 16 will be described. In the description of these embodiments, the same components as those of the embodiments of the present invention are designated by the same reference numerals and redundant explanations will be omitted.
□
第７図ないし第９図の実施例において、前記第５図およ
び第６図の実施例と主に異なる点は、保持部材としての
シート１３Ａをシリコンゴム等のゴム、絶縁合成樹脂材
あるいは金属箔等の剥離紙どして使用できるものにする
とともに、該シート１３Ａに剥離可能な接着剤１４を介
して多数個の並列された導電線８を接着固定させた点で
、このように導電シート９Ａを構成しても良い。□ In the embodiments shown in FIGS. 7 to 9, the main difference from the embodiments shown in FIGS. This conductive sheet can be used as a release paper such as foil, and a large number of parallel conductive wires 8 are adhesively fixed to the sheet 13A via a removable adhesive 14. 9A may be configured.
第１０図の実施例において、前記第１図の実施例と主に
異なる点は接続工程６Ａで、この接続工程６Ａは導電シ
ート９Ａを用いて導電シート取付は工程１０、導電線固
定工程１１を行なうとともに、導電線固定工程１１後に
導電シート９Ａのシート１３Ａを剥離する剥離工程１５
を行なった点で、このようにして導電線８を基板端子部
７および接続端子部４に接続固定させても良い。In the embodiment shown in FIG. 10, the main difference from the embodiment shown in FIG. At the same time, a peeling step 15 of peeling off the sheet 13A of the conductive sheet 9A after the conductive wire fixing step 11 is performed.
In this way, the conductive wire 8 may be connected and fixed to the board terminal portion 7 and the connection terminal portion 4 in this manner.
第１１図および第１２図の実施例において、前記第５図
および第６図の実施例と主に異なる点は、保持部材とし
てのシート１３に固定された導電線８間に加硫前のシリ
コンゴム、対樹脂あるいは対金属への加熱接着用樹脂、
高分子等の絶縁バインダー１６を介装させて導電シート
９Ｂを構成した点で、このように導電シート９Ｂを構成
することにより、導電線８に接着剤を固定しておかなく
ても、所定温度の加熱にＪ：って導電線８と基板端子部
および接続端子部との接続固定を図ることができる。The main difference between the embodiments shown in FIGS. 11 and 12 and the embodiments shown in FIGS. 5 and 6 is that the silicone before vulcanization Resin for heat bonding to rubber, resin or metal,
The conductive sheet 9B is constructed by interposing an insulating binder 16 such as a polymer, and by configuring the conductive sheet 9B in this way, it is possible to maintain a predetermined temperature without fixing an adhesive to the conductive wires 8. By heating J:, it is possible to secure the connection between the conductive wire 8 and the board terminal portion and the connection terminal portion.
第１３図おＪ：び第１４図の実施例において、前記本発
明の実施例と主に異なる点は、導電シート９Ｃで、この
導電シート９Ｃは多数個の並列された導電線８の端部と
薄肉の折曲げ切断部１７を介して、一体成型により保持
部１１３［３を形成した点で、このように導電シー１−
９０を構成することにより第１５図および第１６図に示
す多数個の並列された端子部１８．１９間の接続に使用
することができる。端子部１８．１９と導電線８を接続
固定した後、保持部材１３Ｂを持って折曲げることによ
り折曲げ切断部１７で切断し、保持部材１３３を除去す
ることができる。In the embodiments shown in FIGS. 13 and 14, the main difference from the embodiments of the present invention is a conductive sheet 9C, which covers the ends of a large number of parallel conductive wires 8. The conductive sheet 1-
By configuring 90, it can be used for connection between a large number of parallel terminal portions 18 and 19 shown in FIGS. 15 and 16. After the terminal portions 18, 19 and the conductive wire 8 are connected and fixed, the holding member 13B is held and bent to be cut at the bending/cutting portion 17, and the holding member 133 can be removed.
なお、前記本発明の実施例では半導体基板３に半導体５
を取付りるものについて説明したが、本発明はこれに限
らず、リードフレームに半導体を取付けたものや、その
信条数個の並列された基板端子部を備えた基板等と前記
基板端子部と接続する多数個の並列された接続端子部を
有する部品を結線する場合にも同様に使用することがで
きる。In addition, in the embodiment of the present invention, the semiconductor substrate 3 has a semiconductor 5.
Although the invention has been described with respect to a device to which a semiconductor is attached to a lead frame, the present invention is not limited to this, and the invention is not limited to this. It can be similarly used when connecting components having a large number of parallel connection terminal portions.
１本発明の効果」
以上の説明から明らかなように、本発明にあっては、次
に列挙する効果がある。1. Effects of the Present Invention As is clear from the above description, the present invention has the following effects.
（１）多数個の並列された基板端子部と多数個の並列さ
れた接続端子部とをそれぞれ接続することのできる導電
線を備えた導電シートを用いて基板端子部と接続端子部
とを導電線で接続するので、従来のようなワイヤーボン
ディングによるワイヤーの接続作業に比べ、容易に接続
することができる。(1) Using a conductive sheet with conductive wires that can connect a large number of parallel board terminal parts and a large number of parallel connection terminal parts, the board terminal parts and the connection terminal parts are electrically conductive. Since the connection is made with a wire, the connection can be made more easily than the conventional wire connection work using wire bonding.
（２）基板端子部と接続端子部との上部より、該端子部
に導電線を当接させるように位置さ１士で所定温度に加
熱あるいは押し圧するだけで固定作業を行なうことがで
きるので、比較的安価な設備で、効率の良い配線接続を
行なうことができる。(2) Since the fixing work can be performed by simply positioning the conductive wire from above the board terminal part and the connecting terminal part so that the terminal part comes into contact with the terminal part and heating or pressing it to a predetermined temperature, Efficient wiring connections can be made with relatively inexpensive equipment.
く３）前記（１）、（２）によって安価に配線を行なう
ことができる。(3) Wiring can be done at low cost due to (1) and (2) above.
（４）導電シートの保持部材に軟質絶縁材シートを用い
ることにより、該シートに導電線、基板端子部および接
続端子部のカバー機能を持たせることができる。(4) By using a soft insulating material sheet as the holding member for the conductive sheet, the sheet can have the function of covering the conductive wire, the board terminal portion, and the connection terminal portion.
第１図は本発明の一実施例を示す概略工程図、第２図は
半導体を半導体基板に取付（プた状態の説明図、第３図
および第４図は導電シートを取付けた状態を示す説明図
、第５図および第６図は導電シートの説明図、第７図な
いし第９図、第１０図、第１１図および第１２図、第１
３図ないし第１６図はそれぞれ本発明の異なる実施例を
示す説明図である。
１：取付は工程、 ２二回路、
３：半導体基板、 ４：接続端子部、５：半導体、
６．６Ａ：接続工程、７：基板端子部、
８：導電線、
９．９Ａ、９Ｂ：導電シート、
１０：導電シート取付（づ工程、
１１：導電線固定工程、 １２：接着剤、□
１３．１３Ａ：保持部材としてのシート、１４：接着剤
、 １５：剥離工程、＝ １１−
１６：絶縁バインダー。
特 許 出 願 人 脛 好 克
聡寸 へ
Ｕ）
（Ｎ
く
° ↑ ６
へ
「−τ″こ
図
ＩＬ−！二〇」、
口
呻 く −廿■
ｉ
特開昭６ｌ−２６７３３５（６）
○
Ｉ：：１
１：＠：１
１・１
Ｌユに７
Ｊ ￥Fig. 1 is a schematic process diagram showing one embodiment of the present invention, Fig. 2 is an explanatory diagram of a state in which a semiconductor is attached to a semiconductor substrate (in a state where it is not attached), and Figs. 3 and 4 show a state in which a conductive sheet is attached. Explanatory drawings, FIGS. 5 and 6 are explanatory drawings of conductive sheets, FIGS. 7 to 9, 10, 11 and 12, and 1
3 to 16 are explanatory views showing different embodiments of the present invention, respectively. 1: Installation is a process, 2: Two circuits, 3: Semiconductor board, 4: Connection terminal section, 5: Semiconductor,
6.6A: Connection process, 7: Board terminal part,
8: Conductive wire, 9.9A, 9B: Conductive sheet, 10: Conductive sheet installation (step 1), 11: Conductive wire fixing step, 12: Adhesive, □ 13.13A: Sheet as a holding member, 14: Adhesive , 15: Peeling process, = 11-16: Insulating binder. -廿■ i JP-A-6L-267335 (6) ○ I::1 1:@:1 1・1 Lyuni7 J ¥
Claims (1)
されたリードフレームあるいは半導体基板等の基板と、
この基板の基板端子部とそれぞれ導電線を介して接続さ
れる多数個の並列された接続端子部を有する半導体等の
部品を所定位置に取付ける取付け工程と、前記基板端子
部と前記接続端子部とをそれぞれ接続することのできる
多数個の導電線が形成された導電シートを用いて接続固
定する接続工程を含むことを特徴とする回路間の接続方
法。 ２）接続工程は半導体等の部品の接続端子部および基板
の基板端子部上に導電シートを位置させ、導電シートの
導電線と部品の接続端子部および基板の基板端子部とを
当接させる導電シート取付け工程と、この導電シート取
付け工程後に導電シートの導電線を部品の接続端子部お
よび基板の基板端子部に固定させる導電線固定工程とか
らなることを特徴とする特許請求の範囲第１項記載の回
路間の接続方法。 ３）接続工程は部品および基板上に保持部材としての剥
離紙に導電線が取付けられた導電シートを位置させ、該
導電シートの導電線と部品の接続端子部および基板の基
板端子部とを当接させる導電シート取付け工程と、この
導電シート取付け工程後に導電シートの導電線を部品の
接続端子部および基板の基板端子部に加熱溶着等により
固定させる導電線固定工程と、この導電線固定工程後に
導電シートの保持部材としての剥離紙を剥離除去する保
持部材除去工程とからなることを特徴とする特許請求の
範囲第１項記載の回路間の接続方法。 ４）保持部材と、この保持部材に取付けられた半導体等
の部品の接続端子部と基板の基板端子部とを接続するこ
とのできる多数の並列された導電線と、この導電線の上
面に固着された所定の加熱で接続端子部および基板端子
部に溶着固定する導電性の接着剤とからなることを特徴
とする導電シート。 ５）保持部材はシリコンゴム等のゴムあるいは絶縁合成
樹脂材でシート状に形成されていることを特徴とする特
許請求の範囲第４項記載の導電シート。 ６）保持部材は溶着固定された多数個の並列された導電
線と剥離できる金属箔等の導電材で形成されたシートで
あることを特徴とする特許請求の範囲第４項記載の導電
シート。 ７）導電線はドライまたはウェットエッチング、印刷、
電鋳等により形成されていることを特徴とする特許請求
の範囲第４項ないし第６項いずれかに記載の導電シート
。 ８）導電性の接着剤は１２５℃以上で溶解するスズ、亜
鉛、ハンダ、ロー材等をメッキ処理等で導電線に固着さ
れていることを特徴とする特許請求の範囲第４項ないし
第７項いずれかに記載の導電シート。[Claims] 1) A substrate such as a lead frame or a semiconductor substrate on which a circuit having a large number of parallel substrate terminal portions is formed;
A mounting process of attaching a component such as a semiconductor having a large number of parallel connection terminal parts each connected to the board terminal part of the board via a conductive wire at a predetermined position; 1. A method for connecting circuits, comprising a connecting step of connecting and fixing using a conductive sheet on which a large number of conductive wires are formed, which can be connected to each other. 2) The connection process is a conductive process in which a conductive sheet is placed over the connection terminals of the semiconductor component and the board terminals of the board, and the conductive wires of the conductive sheet are brought into contact with the connection terminals of the component and the board terminals of the board. Claim 1, characterized in that the method comprises a sheet attaching step, and a conductive wire fixing step of fixing the conductive wires of the conductive sheet to the connecting terminal portions of the component and the board terminal portions of the board after the conductive sheet attaching step. How to connect between the circuits described. 3) In the connection process, a conductive sheet with conductive wires attached to a release paper serving as a holding member is placed on the component and the board, and the conductive wires of the conductive sheet are connected to the connection terminals of the component and the board terminals of the board. A conductive sheet attachment process in which the conductive sheets are brought into contact with each other, a conductive wire fixing process in which the conductive wires of the conductive sheet are fixed by heat welding etc. to the connection terminals of the component and the board terminals of the board after this conductive sheet attachment process, and after this conductive wire fixing process 2. The method for connecting circuits according to claim 1, further comprising a holding member removing step of peeling and removing a release paper serving as a holding member for the conductive sheet. 4) A holding member, a large number of parallel conductive wires that can connect the connection terminals of components such as semiconductors attached to the holding member, and the board terminals of the board, and a number of conductive wires fixed to the upper surface of the conductive wires. 1. A conductive sheet comprising a conductive adhesive that is welded and fixed to a connecting terminal portion and a substrate terminal portion by heating at a predetermined temperature. 5) The conductive sheet according to claim 4, wherein the holding member is formed in a sheet shape of rubber such as silicone rubber or an insulating synthetic resin material. 6) The conductive sheet according to claim 4, wherein the holding member is a sheet made of a conductive material such as metal foil that can be peeled from a large number of parallel conductive wires that are welded and fixed. 7) Conductive wires can be dry or wet etched, printed,
The conductive sheet according to any one of claims 4 to 6, which is formed by electroforming or the like. 8) Claims 4 to 7, characterized in that the conductive adhesive is fixed to the conductive wire by plating or the like with tin, zinc, solder, brazing material, etc. that melts at 125° C. or higher. The conductive sheet according to any one of paragraphs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60109784A JPS61267335A (en) | 1985-05-22 | 1985-05-22 | Intercircuit connection method and conductive sheet to be used in the same method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60109784A JPS61267335A (en) | 1985-05-22 | 1985-05-22 | Intercircuit connection method and conductive sheet to be used in the same method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61267335A true JPS61267335A (en) | 1986-11-26 |
Family
ID=14519131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60109784A Pending JPS61267335A (en) | 1985-05-22 | 1985-05-22 | Intercircuit connection method and conductive sheet to be used in the same method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61267335A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372647A (en) * | 1989-05-11 | 1991-03-27 | Seiko Epson Corp | Manufacture of semiconductor device |
| JP2012084294A (en) * | 2010-10-08 | 2012-04-26 | Fujikura Rubber Ltd | Sheet connector, socket for electronic component, and electronic component testing device |
-
1985
- 1985-05-22 JP JP60109784A patent/JPS61267335A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0372647A (en) * | 1989-05-11 | 1991-03-27 | Seiko Epson Corp | Manufacture of semiconductor device |
| JP2012084294A (en) * | 2010-10-08 | 2012-04-26 | Fujikura Rubber Ltd | Sheet connector, socket for electronic component, and electronic component testing device |
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