JPS61266594A - Partial plating method - Google Patents
Partial plating methodInfo
- Publication number
- JPS61266594A JPS61266594A JP10867885A JP10867885A JPS61266594A JP S61266594 A JPS61266594 A JP S61266594A JP 10867885 A JP10867885 A JP 10867885A JP 10867885 A JP10867885 A JP 10867885A JP S61266594 A JPS61266594 A JP S61266594A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- roll
- contact
- parts
- plating soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野〕
本発明は、メッキ液を用いて行なう部品の部分メッキ方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for partial plating of parts using a plating solution.
本発明は、メッキ液を用いて行なう部品の部分メッキ方
法にお匹で2表面に滲透性物質を装着し一部がメッキ液
中に浸漬されて回転するローラーに部品を接触させてメ
ッキ付けをすることにより複雑な形状の部品でも同時に
必要箇所を部分メッキすることができる。The present invention is a method for partial plating parts using a plating solution, in which a permeable substance is attached to two surfaces, and a part of the part is immersed in the plating solution, and the part is brought into contact with a rotating roller. By doing so, even parts with complex shapes can be partially plated at the necessary locations at the same time.
従来、1気部品等の一部にメッキf:施す場合には、メ
ッキ付けをしない部分は合成樹脂などでマスクをして保
護してからメッキ液中に浸漬してメッキ付けを行なうか
、または、一部分をメッキ液に浸漬してメッキ付けを行
なっていた。Conventionally, when plating a part of a part, etc., the part that is not to be plated is protected by masking it with a synthetic resin, etc., and then immersed in a plating solution and plated. In the past, plating was done by immersing a portion in a plating solution.
しかし、前述のようにメッキ付けしない部分をマスクに
より保護する方法、あるいは一部分をメッキ液中に浸漬
する方法では
1、工数がかかり製品が高価となる。However, as described above, the method of protecting the unplated portion with a mask or the method of immersing a portion in a plating solution requires a lot of man-hours and makes the product expensive.
2、メッキ付けの範囲が安定せず、微小部分のメッキ付
けは不可能である。2. The plating range is unstable and it is impossible to plate minute parts.
等の問題がある。There are other problems.
〔発明が解決しよりとする問題点及び目的〕本発明は、
上記のよりな問題点を解決するものでありその目的とす
るところは、複雑な形状の部品の突起部分や断面部分等
の複数箇所?同時にメッキ付けをし、特に高価な貴金属
メッキについては経済的にすぐれた有効な部分メッキ方
法?提供するととくある。[Problems and objects to be solved by the invention]
It is intended to solve the above-mentioned problems, and is aimed at multiple locations such as protrusions and cross-sections of parts with complex shapes? Is there an economical and effective partial plating method for plating expensive precious metals at the same time? There is a lot to offer.
C問題点を解決するための手段〕
本発明の部分メッキ方法は、メッキ槽に取付けられ2表
面に滲透性物質を装着し1〜200デpmの範囲内で変
速可能なローラーの一部をメッキ液中に浸漬させ、ロー
ラー表面に部品を接触させてメッキ付けをすることを特
徴とする。Means for Solving Problem C] The partial plating method of the present invention involves plating a part of a roller which is attached to a plating tank and has a permeable material attached to its surface and whose speed can be varied within a range of 1 to 200 depm. It is characterized by plating by immersing the parts in a liquid and bringing the parts into contact with the roller surface.
本発明の方法によhば、ローラー表面には常に新らし匹
メッキ液が供給されるためメッキ品質も良く、メッキ必
要箇所をローラーに接触させるため簡便で、またメッキ
液の損失も少ない。According to the method of the present invention, the plating quality is good because a fresh plating solution is constantly supplied to the roller surface, and the plating area is brought into contact with the roller, so it is simple and there is little loss of the plating solution.
第1図は1本発明の実施例jを示す断面図である。 FIG. 1 is a sectional view showing an embodiment j of the present invention.
メッキ液5の入りたメッキ槽4には陰極2となるメッキ
しため金属と同種の金属または白金等の不溶性金属ある
いはカーボンが底部に装着されている。ローラー3の表
面には5例えば布またはスボンヂ等の滲透性物質6が装
着されて訃り、ローラー3は図示してない1〜20Oγ
pmの範囲内で任意に回転数を設定できるモーターに接
続されており、また2図示されていない取付部に取付け
られて回転する。A plating tank 4 containing a plating solution 5 has a metal of the same type as the metal to be plated which will become the cathode 2, an insoluble metal such as platinum, or carbon attached to the bottom. A permeable material 6 such as cloth or trousers is attached to the surface of the roller 3.
It is connected to a motor whose rotational speed can be arbitrarily set within the range of pm, and is rotated by being attached to a mounting part (not shown).
1はメッキ付けする部品で、ローラー3の表面に装着し
た滲透性物質6に接触させて電極に通電して電気分解を
行なうことにより接触部のみに部分メッキを付けること
ができる。Reference numeral 1 denotes a part to be plated, and by bringing it into contact with a permeable substance 6 attached to the surface of a roller 3 and electrolyzing the electrode by energizing it, partial plating can be applied only to the contact area.
以上述べたように2本発明によればメツキネ要な部分を
マスク等で保護することもなく複雑な形状の部品の突起
部分や断面部分の一定部分を同時に、多数箇所をメッキ
付けすることができるし、また、メッキ液中に部品全体
と浸漬することなくメッキするために、メッキ液の流出
も汚ルもなくなり、特に、貴金属メッキのように高価な
メッキ液を使用する場合などにはすぐれた効果を発揮す
るものである。As described above, according to the present invention, it is possible to plate a large number of protruding parts and certain cross-sectional parts of complex-shaped parts at the same time without having to protect important parts with masks or the like. In addition, since the entire part is plated without being immersed in the plating solution, there is no leakage or contamination of the plating solution, which is particularly advantageous when using expensive plating solutions such as precious metal plating. It is effective.
鎗1図は5本発明の実施例1を示す断面図。 1@・・部品 2・・・陰極 3IIe*ローラー 4・・・メッキ液槽 5・・・メッキ液 6・・・滲透性物質 以上 Figure 1 is a sectional view showing Embodiment 1 of the present invention. 1@・Parts 2...Cathode 3IIe*Roller 4...Plating liquid tank 5...Plating solution 6... Permeable substance that's all
Claims (1)
200γpmの範囲内で変速回転可能なローラーの一部
をメッキ液中に浸漬させ、該ローラー表面に部品を接触
させてメッキ付けをすることを特徴とする部分メッキ装
置。It is attached to the plating tank and a permeable substance is attached to the surface.
A partial plating apparatus characterized in that a part of a roller capable of rotating at a variable speed within a range of 200 γ pm is immersed in a plating solution, and a part is brought into contact with the roller surface to perform plating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10867885A JPS61266594A (en) | 1985-05-21 | 1985-05-21 | Partial plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10867885A JPS61266594A (en) | 1985-05-21 | 1985-05-21 | Partial plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61266594A true JPS61266594A (en) | 1986-11-26 |
Family
ID=14490897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10867885A Pending JPS61266594A (en) | 1985-05-21 | 1985-05-21 | Partial plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61266594A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140224A1 (en) * | 2009-06-02 | 2010-12-09 | 三菱電機株式会社 | Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board |
-
1985
- 1985-05-21 JP JP10867885A patent/JPS61266594A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010140224A1 (en) * | 2009-06-02 | 2010-12-09 | 三菱電機株式会社 | Method for manufacturing semiconductor device, printed circuit board, and method for manufacturing the printed circuit board |
JP5345214B2 (en) * | 2009-06-02 | 2013-11-20 | 三菱電機株式会社 | Manufacturing method of solar cell |
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