JPS61258505A - Dielectric resonator - Google Patents

Abstract

PURPOSE:To decrease the deterioration in the Q0 by bonding a dielectric resonator element to a supporting base by an adhesives and fixing it into a conductor case via the supporting stand so as to decrease the volume of the adhesives and to decrease the dielectric loss. CONSTITUTION:The dielectric resonance element 12 is bonded to the hollow cylindrical supporting base 16 having a diameter smaller than the diameter of the element 12. The base 16 is bonded in the conductor case 20 by the adhesives 18 and the dielectric resonance element 12 is fixed in the case 20 via the adhesives 14, the supporting base 16 and the adhesives 18. The adhesives 14 bonding the element 12 to the supporting base 16 is formed in the dielectric resonator 10 while the adhesives 14 is spread into three positions at the upper end face of the base 16. For example, the adhesives 14 is applied at a center angle 12 deg., applied as a whole to the part of 1/10 of the upper end face of the base 16 and the volume of the adhesives 14 is saved. Thus, the dielectric loss due to the adhesives 14 is less and the deterioration in the Q0 is decreased.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a dielectric resonator, and in particular, the dielectric resonator is bonded to a support base with an adhesive so that the dielectric resonator is supported. For example, TEo+s mode, its modified mode, TM
o+6 mode, HE116 mode, EHI IB
Regarding dielectric resonators such as modes.

(Prior art) A conventional example of this type of dielectric resonator is Utility Model Publication No. 57-264,
It is disclosed in No. 02. 3A and 3B show an example of such a conventional dielectric resonator, FIG. 3A is a plan view thereof, and FIG. 3B is a line B-1[ of FIG. 3A.
It is a sectional view taken at rB at t3.

In this dielectric resonator 1, a hollow cylindrical dielectric resonator element 2 is bonded to a hollow cylindrical support base 3 with an adhesive 4, and the support base 3 made of a dielectric material with a low dielectric constant is bonded with an adhesive 5. The conductor case 6 is bonded to the inside of the conductor case 6, so that the dielectric resonant element 2 is exposed inside the conductor case 6. In this case, the adhesive 4 is made of glass, epoxy resin, or the like, and is formed into a ring shape as shown in FIG. 4.

(Problems to be Solved by the Invention) In such a conventional dielectric resonator 1, the adhesive 4 for bonding the dielectric resonator element 2 and the support base 3 is a dielectric material such as glass or epoxy resin. Materials with high body loss (tan δ) are used. On the other hand, in this dielectric resonator 1,
The electric field strength is high in the portion where the adhesive 4 is formed. Therefore, the dielectric loss caused by the adhesive 4 is large, If
j, and as a result, the Q of the dielectric resonator. (No-load Q) had decreased.

Therefore, the main invention of this invention is to provide a dielectric resonator in which the drop in Qo is minimized.

(Means for Solving the Problems) This invention provides a dielectric resonator that is fixed to a dielectric resonator in a conductor case via the support base by bonding the dielectric resonator element to the support base with an adhesive. This is a dielectric resonator in which the volume of adhesive is reduced compared to body resonators.

(Effects of the Invention) According to the present invention, the volume of the adhesive is smaller than in the past, and the resulting dielectric loss is therefore reduced, so a dielectric resonator with a small drop in Qo can be obtained.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

(Embodiment) FIG. 1A is a front sectional view showing an embodiment of the present invention. This dielectric resonator 10 includes a dielectric resonator element 12 having a hollow cylindrical shape. This dielectric resonant element 12 is made of a dielectric material such as a titanium oxide ceramic dielectric.

This dielectric resonant element 12 is bonded to a hollow cylindrical support 16 with a diameter smaller than that of the dielectric resonator 12 using an adhesive 14 .

Examples of the material for the adhesive 14 include materials such as glass and epoxy resin, and preferably a material with low dielectric loss and dielectric constant and high mechanical strength.

Further, as a material for the support base 16, a material having a small dielectric constant, close to the coefficient of thermal expansion of the dielectric resonant element 1, and having excellent adhesiveness to the dielectric resonant element 12, such as forsterite, can be used.

This support stand 16 is then adhered within the conductor case 20 with an adhesive 18. As a result, the dielectric resonant element 1
2 is adhesive 14. It is fixed within the case 20 via the support stand 16 and adhesive 18.

In this dielectric resonator 10, the adhesive 14 for bonding the dielectric resonant element 12 to the support base 16 is distributed in three locations on the upper end surface of the support base 16, as shown in FIG. 1B. It is formed of. In this example, each adhesive 14 is formed with a central angle of 12 degrees, and therefore is formed on a 1/10th portion of the upper end surface of the support base 16 as a whole. As a result, the volume of the adhesive 14 is made smaller than that of the adhesive of a conventional dielectric resonator.

As a result, in this dielectric resonator 10, the dielectric loss due to the adhesive 14 is reduced, and the reduction in QO is suppressed.

According to the inventor's experiments, Qo=240 when no adhesive is used to bond the dielectric resonant element to the support base.
For a 6-mode dielectric resonator with a TEo of 00, 1/lan δ-
When using adhesive No. 50, Q decreased by 1 to 3% in the conventional example shown in FIGS. 3A and 3B, whereas
Q in the embodiment shown in FIG. 1A. decreased by only 0.1 to 0.3%.

From this experiment, the example Q shown in FIG. 1A. decrease in
It can be seen that the reduction can be reduced to 1/10 of the conventional example shown in FIGS. 3A and 3B.

In this way, by reducing the volume of the adhesive, the dielectric loss due to the adhesive can be reduced, and as a result, the dielectric resonator 1
Q of 0. This makes it possible to suppress the decline in

Next, in the example of FIG. 1A, why Q.

We will explain in detail whether it is possible to suppress the decline in

Dielectric resonator 10. Dielectric resonant element 12. Adhesive 14.
Support stand 16. The no-load Q of the adhesive 18 and the conductor case 20 are respectively Qo, Q, , Q2, Q3 . Assuming Q4 and Q5, the following formula (1)% formula% Here, when looking at 02 of the adhesive 14 for bonding the dielectric resonant element 12 and the support base 16, the complex permittivity of the adhesive 14 is ε (−ε′−jε″), and the adhesive 14
Let the dielectric loss be tan δ, and let the electric field inside the adhesive 14 be a plate; however, the electric field is constant inside the adhesive 14)
, the volume of the adhesive 14 is {circle around (2)}, and the time average of the electromagnetic energy stored in the dielectric resonator 10 is Wt, then Q2 is given by the following equation (2).

P... (2) ω0: Resonance angular frequency... (3) The following equation (4) in the denominator of the right side of equation (3) is...
(4) Therefore, if we reduce the physical size, we can obtain equation (2) and (
It can be seen from equation 3) that Q2 becomes large. It can be seen from equation (1) that if this 02 is increased, the decrease in Qo becomes smaller. That is, if the volume of the adhesive layer 14 is reduced, the Q of the dielectric resonator will be reduced. This makes it possible to suppress low F.

Regarding the adhesive 18, since the magnitude of the electric field E' at the adhesive 18 portion is extremely smaller than the magnitude of the electric field E at the adhesive 14 portion, Q4 of the adhesive 18 is extremely larger than Q2 of the adhesive 14, The impact on QO can be ignored.

In this embodiment, as shown in FIG. 1B, the adhesive I4 was dispersed at three locations on the upper end surface of the support base 16, but the adhesive 14 was dispersed at two or four or more locations. may be formed.

In this way, the adhesive 14 is dispersed and formed, and the adhesive 14
The volume may be made smaller.

FIG. 2 is a perspective view showing a modification of the support base.

This support stand 16 has three notches 17 formed at its upper end. Therefore, the adhesive area of the support base 16 is reduced, and if a dielectric resonator is formed using this support base 16, the area of adhesive for bonding the dielectric resonant element to the support base 16 is reduced. The volume of the adhesive is reduced.

In this case, the adhesive is always formed with a constant area and the Q of the dielectric resonator. can be made constant. In addition, depending on the size and number of the notches 17 of the support base 16, the adhesive surface 1! '1 can be varied, thereby reducing the dielectric loss of the adhesive and thus the Q of the dielectric resonator. can be changed.

Furthermore, in order to reduce the volume of the adhesive 14, the thickness of the adhesive 14 may be reduced.

Note that it is desirable that the adhesive 14 be formed rotationally symmetrically with respect to the central axis of the dielectric resonator.

[Brief explanation of the drawing]

FIG. 1A is a front sectional view showing an embodiment of the present invention. FIG. 1B is a plan view showing the adhesive and support base of the embodiment shown in FIG. 1A. FIG. 2 is a perspective view showing a modification of the support base. 3A and 3B show a conventional example, FIG. 3A is a front sectional view thereof, and FIG. 3B is a line TIIB in FIG. 3A.
- It is a sectional view in ITIB. FIG. 4 is a plan view showing an adhesive for bonding the conventional dielectric resonant element shown in FIGS. 3A and 3B to a support base. In the figure, 1o is a dielectric resonator, 12 is a dielectric resonant element, 14 and 18 are adhesives, 16 is a support base, and 20 is a conductor case. Patent applicant: Toda Hizasho Co., Ltd. Agent: Patent attorney: Yama 1) Yoshito (1 idiot) Figure 1A and Figure 2 1' N J Kumai...

Claims (1)

[Scope of Claims] 1. A dielectric resonator in which the dielectric resonance element is fixed in a conductor case via the support base by bonding the dielectric resonance element to the support base with an adhesive, comprising: A dielectric resonator characterized by a reduced adhesive volume. 2. The dielectric resonator according to claim 1, wherein the thickness of the adhesive is reduced in order to reduce the volume of the adhesive. 3. The dielectric resonator according to claim 1, wherein the area of the adhesive is reduced in order to reduce the volume of the adhesive. 4. The dielectric resonator according to claim 3, wherein the adhesive is formed in a dispersed manner in order to reduce the area of the adhesive. 5. The dielectric resonator according to claim 3, wherein the adhesive area of the support base is reduced in order to reduce the area of the adhesive.