JPS61247658A - Method of burning ceramic wire distribution substrate - Google Patents

Method of burning ceramic wire distribution substrate

Info

Publication number
JPS61247658A
JPS61247658A JP60086943A JP8694385A JPS61247658A JP S61247658 A JPS61247658 A JP S61247658A JP 60086943 A JP60086943 A JP 60086943A JP 8694385 A JP8694385 A JP 8694385A JP S61247658 A JPS61247658 A JP S61247658A
Authority
JP
Japan
Prior art keywords
firing
sintering aid
partial pressure
pressure ratio
temperature range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60086943A
Other languages
Japanese (ja)
Inventor
戸沢 洋二
作本 義明
義秀 林田
鵜飼 俊行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP60086943A priority Critical patent/JPS61247658A/en
Publication of JPS61247658A publication Critical patent/JPS61247658A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、アルミナ系の同時焼成セラミックス配線基板
の製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing an alumina-based co-fired ceramic wiring board.

(従来技術) 同時焼成セラミックス配線基板は、セラミックスグリー
ンシーl−に高融点の導電性金属粉末ペーヌトの配線を
施したクリーンシーhffiJ二記金J萬扮末の酸化防
止のため還元性雰囲気にて焼成し、これによシセラミッ
クスと金属粉末を同時に焼結するとともにセラミックス
に金属粉末を接合させて製造される。
(Prior art) A co-fired ceramic wiring board is a clean sheet in which wiring is made of high melting point conductive metal powder paint on a ceramic green sheet in a reducing atmosphere to prevent oxidation of the ceramic green sheet. It is manufactured by sintering the ceramics and metal powder at the same time and bonding the metal powder to the ceramics.

この場合、セラミックスクリーンシートに含廿れる有機
性バインダーの焼却が還元雰囲気中では十分でなく、セ
ラミックス中に若干のt々素分が残留しセラミックスの
焼結が不十分となる傾向があるだめ、業界では、バイン
ダーの焼却性向−1にの目的で、水蒸気を含んだ水素−
水蒸気写囲気、あるいは窒素を混入した窒素−水素−水
蒸気の弱還元検算囲気で焼成するのが通例である。
In this case, the organic binder contained in the ceramic screen sheet is not sufficiently incinerated in a reducing atmosphere, and a small amount of t-element remains in the ceramic, which tends to result in insufficient sintering of the ceramic. In the industry, hydrogen containing water vapor is used to reduce the binder's incineration tendency.
It is customary to fire in a steam atmosphere or a weakly reducing nitrogen-hydrogen-steam atmosphere mixed with nitrogen.

この場合”/H,2O分圧比は、バインダーの焼却性の
点だけで々く、金庫粉末の焼結性、セラミックスと金属
の接合強度の点でも大きく影響する安置であり、しかも
バインダーの焼却性と金属粉末の焼結性、セラミックス
と金属の接合強度とは互いに相反する関係にある。すな
わち、バインダーの焼却性の点では”/HrO分圧比が
小さく酸化性が強ければ強いほど好ましく、一方金属粉
末の焼結性、セラミックスと金庫の接合強度の点では”
/H,2O分圧比が犬きぐ、還元性が強ければ強いほど
好ましい。このような事情により、焼成雰囲気として両
者の妥協を計ったHシ市0分圧比5〜8程度の雰囲気で
操業を行うのが従来の通例であった。
In this case, the /H,2O partial pressure ratio has a great influence not only on the incineration property of the binder, but also on the sinterability of the safe powder and the bonding strength between ceramics and metal. The sintering properties of the metal powder and the bonding strength between the ceramic and the metal are contradictory to each other.In other words, in terms of the incineration property of the binder, the smaller the /HrO partial pressure ratio and the stronger the oxidizing property, the better; In terms of powder sinterability and bonding strength between ceramics and safes,
/H,2O partial pressure ratio, the stronger the reducing property, the more preferable. Under these circumstances, it has conventionally been customary to operate the firing atmosphere in an atmosphere with a partial pressure ratio of about 5 to 8, which is a compromise between the two.

ところが、最近の配線パターンの精密化の要求に伴い、
セラミックス基板自体もきめの細かさが要求されるよう
になり、原料粉末も、よシ微細な粉末を指向するように
なってきた。このだめセラミックスグリーンシートのバ
インダー焼却性が悪化し、従来と同様の焼成方法では焼
結不足の状態となる問題が発生している。
However, with the recent demand for more precise wiring patterns,
Ceramic substrates themselves are now required to have finer grains, and raw material powders are also becoming increasingly finer. The binder incineration properties of these ceramic green sheets deteriorate, and a conventional firing method results in insufficient sintering.

この対策として、良く行われている方法は次の通りであ
る。
As a countermeasure against this problem, the following methods are commonly used.

■ 焼成時間を長くし、バインダー焼却性の悪さを時間
的にカバーする方法。
■ A method of increasing the firing time to compensate for the poor burnability of the binder.

■ 被焼成物の焼成炉内における漬方法の工夫、および
雰囲気ガスの供給層増加等によシ炬内雰囲気ガスの通風
を向−1−させ、バインダー焼却の反応全促進させる方
法。
(2) A method of improving the method of dipping the material to be fired in the firing furnace, and increasing the supply layer of atmospheric gas to direct the ventilation of the atmospheric gas inside the kiln, thereby promoting the complete reaction of binder incineration.

これ等の対策によυある程度の効果が得られ従来から比
軸するとかなり微細な粉末を用いることが可能となり現
在のところは粉末平均径2〜3μが主流となっている。
These countermeasures have been effective to a certain extent, and it has become possible to use powders that are quite fine in terms of specific axis, and at present, powder average diameters of 2 to 3 μm are the mainstream.

しかしながら一層微細化しようとする場合、上記の延長
線上の対策では焼成効率の低下が顕著になること、また
技術的にもバインダーの焼却性に限りがあること等の限
界があシ、異なった視野からの新たな対策が必要とされ
ていた。
However, when trying to achieve further refinement, there are limitations such as the reduction in firing efficiency becomes noticeable with the above-mentioned extension measures, and there is a technical limit to the incineration property of the binder. New countermeasures were needed.

(発明が解決しようとする問題点) 本発明は上記要請に基づくものであって、バインダーの
焼却性、金属粉末の焼結性、セラミックスと金属の接合
強度、以上の諸点の全てに良好な結果の得られる同時焼
成セラミックス配線基板の新規な製造方法の提供全目的
とする。
(Problems to be Solved by the Invention) The present invention is based on the above-mentioned requirements, and has good results in all of the above-mentioned points, including the incineration property of the binder, the sinterability of the metal powder, and the bonding strength between ceramics and metal. The overall purpose of the present invention is to provide a new method for manufacturing a co-fired ceramic wiring board that yields a co-fired ceramic wiring board.

(問題点を解決するだめの手段) 本発明は従来、7<インダー焼却性とメタライズ性との
妥協のだめに決められたところの焼成雰囲気中のHシ”
H,2O分圧比による方法を見直し、バインダー焼却性
とメタライズ性(導通抵抗、メタライズ強度)のなかの
相互関係の新たな知見が得られたことからなされたもの
である。
(Means for Solving the Problems) The present invention has been developed in the past in accordance with the present invention.
This was done after reviewing the method using the partial pressure ratio of H and 2O and gaining new knowledge about the interrelationship between binder incineration properties and metallization properties (continuity resistance, metallization strength).

すなわち、バインダーの焼却において重要な温度域は常
温より12O0℃、1300′C4での範囲でアリ、こ
の温度域においてはセラミックスの収縮は緩慢でありバ
インダーの焼却除去にとって好都合な温度域である。こ
れを脱バインダ一温度域と称することにする。一方13
00℃をt=える温度域になるとセラミックスの収縮が
促進され、この時点捷で炭素分が残留した場合には、そ
の′−1!−セラミックス中に閉じ込められ焼結障害を
引き起す、この温度域を焼結温度域と称することにする
That is, the important temperature range for binder incineration is from room temperature to 1200° C. and 1300'C4. In this temperature range, shrinkage of ceramics is slow and it is a convenient temperature range for binder removal by incineration. This will be referred to as the binder removal temperature range. On the other hand 13
When the temperature reaches t = 00°C, the shrinkage of ceramics is accelerated, and if carbon remains at this point, the '-1! - This temperature range that is confined within the ceramic and causes sintering failure will be referred to as the sintering temperature range.

従って脱バインダ一温度域においてバインダーの焼却除
去が完了していることが必要であり、このため基本的な
考え方として、メタライズ性を犠牲にしでも酸化性の高
い雰囲気で焼成し、バインダーの焼却除去を完了させる
べきである。但しこの場合、一度犠牲になったメタライ
ズ性が後の焼成過程で回復されなければならないが、脱
バインダ一温度域における昇囲気ガスの酸化性の程度ど
、焼結温度域における雰囲気ガスの還元性の程度を適度
に選定し、さらに酸化−還元の雰囲気ガス切り替え時の
温度全適度に選定することにより、メタライズ性は回復
し、バインダー焼却除去とメタライズ性の双方を両立し
得ることの発見に基づくものである。
Therefore, it is necessary to complete the incineration removal of the binder within the same temperature range for binder removal.For this reason, the basic idea is to perform baking in a highly oxidizing atmosphere and remove the binder by incineration, even at the cost of sacrificing metallization properties. It should be completed. However, in this case, the metallization property once sacrificed must be recovered in the subsequent firing process, but the degree of oxidation of the ambient gas in the debinding temperature range and the reducing property of the atmospheric gas in the sintering temperature range Based on the discovery that by appropriately selecting the degree of oxidation and reducing the temperature at which the atmosphere gas is switched between oxidation and reduction, the metallization property can be restored and both binder removal by incineration and metallization property can be achieved. It is something.

本発明は次記の方法を要旨とする。The gist of the present invention is the following method.

At2O Jを主成分とし、焼結助剤としてSiC2゜
MgO,CaOのうち1秤または2種板」二を含み、ま
た必要に応じ呈色剤として金属酸化物または水酸化物を
含むセラミックヌグリーンシートに高融点金属粉末ペー
ストで配線を施し、仮焼成としてセラミックス中の上記
焼結助剤の溶融温度以下の温度域で”/HrO分圧比を
05〜40とした弱還元性雰囲気中で焼成し、次いで本
焼成として前記焼結助剤の溶融温度以下の温度域からH
2/H,2O分圧比を5以上とした強還元性雰囲気中で
焼成する同時焼成セラミックス配線基板の焼成方法。
Ceramic Nugreen whose main component is At2OJ, contains one or two of SiC2゜MgO, CaO as a sintering aid, and also contains a metal oxide or hydroxide as a coloring agent if necessary. Wiring was applied to the sheet using high-melting point metal powder paste, and pre-firing was performed in a slightly reducing atmosphere with a partial pressure ratio of ``/HrO'' of 05 to 40 in a temperature range below the melting temperature of the above-mentioned sintering aid in the ceramic. Then, as main firing, H is heated from a temperature range below the melting temperature of the sintering aid.
A method for firing a co-fired ceramic wiring board in which firing is performed in a strongly reducing atmosphere with a 2/H, 2O partial pressure ratio of 5 or more.

また、前焼成として150〜350しての酸化焼成を行
い、次いで上記仮焼成および上記本焼成を行う同時焼成
セラミックス配線基板の焼成方法。
Also, a method for firing a co-fired ceramic wiring board, in which oxidation firing at a temperature of 150 to 350 ℃ is performed as pre-firing, and then the above-mentioned preliminary firing and the above-mentioned main firing are performed.

および、前焼成として300〜700℃での水蒸気酸化
焼成を行い、次いで前記仮焼成および前記本焼成を行う
同時焼成セラミックス配線基板の焼成方法。
and a method for firing a co-fired ceramic wiring board, which performs steam oxidation firing at 300 to 700°C as pre-firing, and then performs the preliminary firing and the main firing.

さらに、前焼成として150〜350℃での酸化焼成、
続いて300〜700 ℃での水蒸気酸化焼成を行い、
次いで前記仮焼成および前記本焼成を行う同時焼成セラ
ミックス配線基板の焼成方法。
Furthermore, oxidation firing at 150 to 350°C as pre-calcination,
Subsequently, steam oxidation firing was performed at 300 to 700 °C.
A method for firing a co-fired ceramic wiring board, which then performs the preliminary firing and the main firing.

本発明におけるセラミックスの素材としてはAt2O3
を主成分とし、焼結助剤としてS3−02. MgO。
The ceramic material used in the present invention is At2O3
as a main component, and S3-02. as a sintering aid. MgO.

CaO等の1種または2種以上を含むものであるが、そ
の組成および原料粉末の粒度については特に限定しない
Although it contains one or more kinds of CaO and the like, the composition and the particle size of the raw material powder are not particularly limited.

また呈色剤として適当な酸化物、または水酸化物を含ん
でも良い。また高融点金属粉末とはW。
It may also contain a suitable oxide or hydroxide as a coloring agent. Also, high melting point metal powder is W.

MO,Mnの1種または2種以上からなるもので、その
組成および粉末粒度については特に限定しない。
It is composed of one or more of MO and Mn, and its composition and powder particle size are not particularly limited.

次に焼成雰囲気中のH’/HrO分圧比の調整方法につ
いてであるが、業界では一般にH2を含むガス中へH,
2Oを混入させているが、この方法に限らすOaを混入
させて焼成か内のH,2−0,2平衡の結果として所定
のHr/H,2O分圧比となるような調整方法でもよい
Next, regarding the method of adjusting the H'/HrO partial pressure ratio in the firing atmosphere, in the industry, H2 is generally added to the H2-containing gas.
Although 2O is mixed in, this method is limited to this method.An adjustment method such as mixing Oa and achieving a predetermined Hr/H2O partial pressure ratio as a result of H,2-0,2 equilibrium in the firing process may also be used. .

こ\でH2を含むガスとは、水素ガス1だは水素ガスー
不活性ガスの混合ガスを意味し、不活性ガスとしては窒
素ガスを使用することが多い。
Here, the gas containing H2 means hydrogen gas 1 or a mixed gas of hydrogen gas and inert gas, and nitrogen gas is often used as the inert gas.

また本発明の実施には、仮焼炉と木戸との2溶金分離し
た焼成でもよいし、壕だ1恒に合体し炉内を雰囲気区分
した焼成でもよく、その効果は同様である。
Further, in carrying out the present invention, the firing may be carried out by separating the molten metals in the calcining furnace and the kido, or the firing may be performed by combining the molten metal into a single furnace and dividing the atmosphere inside the furnace, and the effect will be the same.

(作 用) 次に本発明において、仮焼成および本焼成でのHシ](
,2O分圧比ならびに温度域を頭記の如く限定しだ3]
11由について述べる。
(Function) Next, in the present invention, the H-shield during preliminary firing and main firing]
, 2O partial pressure ratio and temperature range are limited as above 3]
Let me explain 11 reasons.

セラミックス中のバインダーの勺]却除去ヲ効率よく行
うためには仮焼成においてHx7山。分圧比を4以下と
し、比較的酸化性の強い条件での焼成が有効である。し
かしながら、””/H,2O分圧比を4以下としたま〈
本焼成まで行うとメタライズ性の点で問題を生じる。
[Removal of binder in ceramics] In order to efficiently remove the binder, Hx7 peaks are required during pre-firing. It is effective to set the partial pressure ratio to 4 or less and to calcinate under relatively oxidizing conditions. However, as long as the ``''/H,2O partial pressure ratio was kept below 4,
If the final firing is carried out, a problem will arise in terms of metallization properties.

そこでメタワイズ性回復の可能性について種々実験を行
った結果、次の41実が判明I〜だ。
As a result of conducting various experiments on the possibility of meta-wise recovery, the following 41 results were discovered.

■ メタライズ性の回復のためには、本焼成におけるH
−VH2O分圧比として5以」二が必要である。
■ In order to recover metallizability, H
-VH2O partial pressure ratio of 5 or more is required.

■ 本焼成においてHs/H,2O分圧比を5以上とし
た古しても、仮焼成においてHダI−(io分圧比が0
5未満のときはメタライズ性の回復は不可能である。
■ Even if the Hs/H,2O partial pressure ratio is set to 5 or more in the main firing, the Hs/H,2O partial pressure ratio is 0 or more in the preliminary firing.
When it is less than 5, recovery of metallizability is impossible.

■ 仮焼成においてH−2//H2O分圧比を05〜4
゜とした場合でも、セラミックス中の焼結助剤の溶融温
度を越えた温度域にまで焼成した場合は、その後の本焼
成においてHダ](,2O分圧比を5以」ユとしても、
最早メタライズ性の回復は不可能である。
■ H-2//H2O partial pressure ratio during pre-firing is set to 05 to 4.
Even in the case where the ceramic is fired to a temperature exceeding the melting temperature of the sintering aid in the ceramic, in the subsequent main firing, even if the 2O partial pressure ratio is 5 or more,
It is no longer possible to recover the metallizability.

これらの結果よ勺、メタライズ性の基本的な要素として
、セラミックスと金属粉末の接触状態およびセラミック
ス中の焼結助剤が溶融するときの金属粉末の表面状態の
2点が重要と判断される。
Based on these results, it has been determined that two important basic elements of metallizability are the contact condition between the ceramic and the metal powder and the surface condition of the metal powder when the sintering aid in the ceramic is melted.

セラミックスと金属粉末の接触状態を良好に保つだめに
仮焼成で酸化させすぎないことが重要であり、酸化が過
ぎると金属粉末は膨れ、そのため仮焼成での”/H2O
分圧比として05以上が必要と考えられる。
In order to maintain good contact between the ceramic and the metal powder, it is important not to oxidize it too much during calcination. Excessive oxidation causes the metal powder to swell, which is why "/H2O"
It is considered that a partial pressure ratio of 05 or more is required.

次に、セラミックス中の焼結助剤の溶融の際は金属粉末
は還元状態になっていることが必要であり、このため酸
化性の強い仮焼成は焼結助剤の溶融温度以下の温度域で
の焼成にとどめることが必要であシ、さらに還元性の強
い本焼成に移ってから焼結助剤の溶融温度に達する寸で
の間に金属粉末の表面を還元しなければならない。その
だめ焼結助剤の溶融温度以下のl晶度域からHダI(x
○分圧比を5以」二とした雰囲気での焼成が必要である
Next, when melting the sintering aid in ceramics, the metal powder must be in a reduced state, so the highly oxidizing pre-firing must be performed at a temperature below the melting temperature of the sintering aid. Furthermore, it is necessary to reduce the surface of the metal powder between the time when the main firing, which has a strong reducing property, reaches the melting temperature of the sintering aid. Therefore, from the l crystallinity range below the melting temperature of the sintering aid,
○It is necessary to perform firing in an atmosphere with a partial pressure ratio of 5 or more.

このとき、本焼成に入ってから焼結助剤の溶融寸での間
に金属粉末の還元のだめの若干の時間が必要であり、そ
の時間は好ましくは数十分以上であるが、特に限定はし
ない。
At this time, some time is required for the reduction of the metal powder between the start of the main firing and the melting of the sintering aid, and this time is preferably several tens of minutes or more, but there are no particular limitations. do not.

次に前焼成の温度と雰囲気の1狐定理由について述べる
Next, the reason for determining the temperature and atmosphere for pre-firing will be described.

仮焼成において出来るだけ酸化性を強くした雰囲気が有
機性バインダーの焼却性を上げる上で好ましいことは既
に述べたが、その意味では空気中での酸化焼成が考えら
れる。この発恕は例えば特開昭59−98594公報に
、350 ℃以下の焼成であればメタライズ1生に悪影
響を出さずにバインダーの焼却除去に効果のあることが
開示されている。
As already mentioned, it is preferable to use an atmosphere with as strong an oxidizing property as possible in the preliminary firing in order to increase the incineration property of the organic binder, and in that sense, oxidizing firing in air can be considered. This discovery is disclosed, for example, in Japanese Patent Application Laid-open No. 59-98594, which discloses that firing at a temperature of 350 DEG C. or lower is effective in removing the binder by incineration without adversely affecting the metallization 1 raw material.

本発明者は空気中における150〜850をCの低温酸
化焼成と第1項の本発明とを組合せることにより、バイ
ンダーの焼却除去はより一層効果的に行われ、しかもメ
タライズ性にも何等問題のないことを確認した。すなわ
ち空気中における低温150〜850℃酸化焼成のあと
の仮焼成においても、焼成雰囲気の酸化性が強いほどバ
インダーの焼却除去にとっては有利となる。この点従来
はメタライズ性の懸念からH’lHr O分圧比として
5〜8程度の雰囲気で妥協していたのが実状であるが、
前記組合せ、すなわち空気中での低温150〜350℃
酸化焼成の後の仮焼成としてよシ強い酸化性雰囲気での
焼成が可能なことにより、バインダーの焼却除去がよシ
一層効果的に行われ得るのである。この方法での予備焼
成における酸化焼成は空気中の他、酸素と不活性ガスの
混合ガスおよび酸素ガスが同様効果があることは明白で
ある。
The present inventor has discovered that by combining the low-temperature oxidation firing of 150 to 850 C in air with the present invention described in item 1, the binder can be removed by incineration even more effectively, and there is no problem with metallization. It was confirmed that there were no That is, even in the pre-calcination after the low-temperature 150 to 850°C oxidative firing in air, the stronger the oxidizing nature of the firing atmosphere, the more advantageous it is for removing the binder by incineration. In this regard, in the past, due to concerns about metallization properties, the actual situation was to compromise with an atmosphere with an H'lHrO partial pressure ratio of about 5 to 8.
The above combination, i.e. low temperature 150-350°C in air
By making it possible to perform calcination in a highly oxidizing atmosphere as a preliminary calcination after oxidation calcination, the binder can be removed by incineration more effectively. It is clear that the oxidation firing in the preliminary firing in this method is effective not only in air but also in a mixed gas of oxygen and an inert gas and oxygen gas.

次に、同じく予備焼成としての300〜700℃での水
蒸気酸化焼成の限定について、これは水素を含まない水
蒸気中、または水蒸気−不活性ガス中の雰囲気焼成であ
るが、バインダーの焼却除去を有効に行うだめには30
0℃以上の焼成が必要であり、またメタライズ性の点で
700℃以下の焼成にとどめることが必要である。
Next, regarding the limitation of steam oxidation firing at 300 to 700°C as a preliminary firing, this is atmospheric firing in steam that does not contain hydrogen or in a steam-inert gas atmosphere, but it is effective for removing the binder by incineration. 30 to do
Firing is required at a temperature of 0° C. or higher, and from the viewpoint of metallizability, it is necessary to keep the firing temperature to 700° C. or lower.

(実施例および発明の効果) 主成分がA1.2O394%で焼結助剤としてSi0.
2゜MgO,Ca0f:)−タルで6%を添加した無機
物に、さらに樹脂、可塑剤、溶剤を加えて混合し、一般
のテープキャスティング法により09履厚のグリ−ンシ
ートを作成した。本実施例における原料粉末の粒径は平
均径12μであり業界の通例に比較してかなり徽細な粉
末である。
(Effects of Examples and Invention) The main component is A1.2O394% and Si0.
A resin, a plasticizer, and a solvent were further added to the inorganic substance to which 6% of 2°MgO, Ca0f:)-tal had been added and mixed, and a green sheet with a thickness of 0.9 mm was prepared by a general tape casting method. The particle size of the raw material powder in this example is an average diameter of 12μ, which is considerably finer than that commonly used in the industry.

このグリーンシー11−140X25の大きさに切断し
バインダー焼却性の評価の試料としだ。またこのグリー
ンシートを100期角の大きさに切断したものにW粉末
からつくったタングステンベーヌトを用いて印刷パター
ンを形成した試料を作成しメタライズ性評価の試料とし
だ。W粉末の粒径は平均径08μである。
This Green Sea 11-140 x 25 piece was cut into a sample for evaluation of binder incineration properties. In addition, a sample was prepared by cutting this green sheet into a size of 100 squares and having a printed pattern formed thereon using tungsten beanute made from W powder, and used as a sample for metallization evaluation. The average particle size of the W powder is 08μ.

これら2種類の試料を用い、本発明による焼成方法と従
来技術による焼成方法および本発明を完成する過程にお
ける種々の焼成方法により、バインダー焼却性とメタラ
イズ性を比較評価した結果を第」表に示す。
Using these two types of samples, the binder incineration properties and metallization properties were comparatively evaluated using the firing method according to the present invention, the firing method according to the conventional technology, and various firing methods in the process of completing the present invention. The results are shown in Table 1. .

注1、第1表の実施例の仮焼成は特記のないものは12
50 ℃X 2時間、本焼成は152(1,X2時間の
条件である。なおセラミックス中の焼結助剤の溶融温度
は約1850 ℃である。
Note 1: Temporary firing of Examples in Table 1 is 12 unless otherwise specified.
The conditions were 50°C for 2 hours, and main firing for 152°C for 2 hours.The melting temperature of the sintering aid in the ceramic was approximately 1850°C.

注2、第1表の焼結密度の単位はgX黛。導通抵抗は体
積固有抵抗で評価しており、単位は10−5Ω備でアシ
、またメタライズ強度はタングステンメタワイズとセラ
ミックスの引はがし強度で評価しておシ、単位はkQで
ある。
Note 2: The unit of sintered density in Table 1 is gX. The conduction resistance is evaluated by the volume resistivity, and the unit is 10-5Ω, and the metallization strength is evaluated by the peeling strength of tungsten metallize and ceramics, and the unit is kQ.

第1表にみるように、本発明の焼成方法を用いることに
より、メタライズ特性を劣化させないで、焼結密度の向
」−が可能であり、従って実施例の如く、セラミックス
原料粉末が微細な場合にも、其の効果は顕著に発揮され
る。
As shown in Table 1, by using the firing method of the present invention, it is possible to increase the sintered density without deteriorating the metallization properties. However, its effect is clearly demonstrated.

Claims (4)

【特許請求の範囲】[Claims] (1)Al_2O_3を主成分とし、焼結助剤としてS
iO_2、MgO、CaOのうち1種または2種以上を
含み、また必要に応じ呈色剤として金属酸化物または水
酸化物を含むセラミックスグリーンシートに高融点金属
粉末ペーストで配線を施し、仮焼成として、セラミック
ス中の上記焼結助剤の溶融温度以下の温度域でH_2/
H_2O分圧比を0.5〜4.0とした弱還元性雰囲気
中で焼成し、次いで本焼成として、前記焼結助剤の溶融
温度以下の温度域からH_2/H_2O分圧比を5以上
とした強還元性雰囲気中で焼成することを特徴とする同
時焼成セラミックス配線基板の焼成方法。
(1) The main component is Al_2O_3, and S as a sintering aid.
A ceramic green sheet containing one or more of iO_2, MgO, and CaO and, if necessary, a metal oxide or hydroxide as a coloring agent, is wired with a high melting point metal powder paste and pre-fired. , H_2/ in the temperature range below the melting temperature of the above sintering aid in ceramics.
Calcination was performed in a weakly reducing atmosphere with a H_2O partial pressure ratio of 0.5 to 4.0, and then as main firing, the H_2/H_2O partial pressure ratio was set to 5 or more from a temperature range below the melting temperature of the sintering aid. A method for firing a co-fired ceramic wiring board, characterized by firing in a strongly reducing atmosphere.
(2)Al_2O_3を主成分とし、焼結助剤としてS
iO_2、MgO、CaOのうち1種または2種以上を
含み、また必要に応じ呈色剤として金属酸化物または水
酸化物を含むセラミックスグリーンシートに高融点金属
粉末ペーストで配線を施し、前焼成として150〜35
0℃で酸化焼成を行い、次いで仮焼成として、セラミッ
クス中の上記焼結助剤の溶融温度以下の温度域でH_2
/H_2O分圧比を0.5〜4.0とした弱酸化性雰囲
気中で焼成し、さらに本焼成として、前記焼結助剤の溶
融温度以下の温度域からH_2/H_2O分圧比を5以
上とした強還元性雰囲気中で焼成することを特徴とする
同時焼成セラミックス配線基板の焼成方法。
(2) Main component is Al_2O_3 and S as a sintering aid.
A ceramic green sheet containing one or more of iO_2, MgO, and CaO and, if necessary, a metal oxide or hydroxide as a coloring agent, is wired with a high melting point metal powder paste and pre-fired. 150-35
Oxidation firing is performed at 0°C, followed by pre-calcination at H_2 in a temperature range below the melting temperature of the above-mentioned sintering aid in the ceramics.
/H_2O partial pressure ratio is 0.5 to 4.0 in a weakly oxidizing atmosphere, and as main firing, the H_2/H_2O partial pressure ratio is set to 5 or more from a temperature range below the melting temperature of the sintering aid. A method for firing a co-fired ceramic wiring board, characterized by firing in a strongly reducing atmosphere.
(3)Al_2O_3を主成分とし、焼結助剤としてS
iO_2、MgO、CaOのうち1種または2種以上を
含み、また必要に応じ呈色剤として金属酸化物または水
酸化物を含むセラミックスグリーンシートに高融点金属
粉末ペーストで配線を施し、前焼成として300〜70
0℃で水蒸気酸化焼成を行い、次いで仮焼成として、セ
ラミックス中の上記焼結助剤の溶融温度以下の温度域で
H_2/H_2O分圧比を0.5〜4.0とした弱酸化
性雰囲気中で焼成し、さらに本焼成として、前記焼結助
剤の溶融温度以下の温度域からH_2/H_2O分圧比
を5以上とした強還元性雰囲気中で焼成することを特徴
とする同時焼成セラミックス配線基板の焼成方法。
(3) The main component is Al_2O_3, and S as a sintering aid.
A ceramic green sheet containing one or more of iO_2, MgO, and CaO and, if necessary, a metal oxide or hydroxide as a coloring agent, is wired with a high melting point metal powder paste and pre-fired. 300-70
Steam oxidation firing was performed at 0°C, followed by pre-firing in a weakly oxidizing atmosphere with a H_2/H_2O partial pressure ratio of 0.5 to 4.0 in a temperature range below the melting temperature of the above-mentioned sintering aid in the ceramics. A co-fired ceramic wiring board characterized in that the main firing is performed in a strong reducing atmosphere with a H_2/H_2O partial pressure ratio of 5 or more from a temperature range below the melting temperature of the sintering aid. firing method.
(4)Al_2O_3を主成分とし、焼結助剤としてS
iO_2、MgO、CaOのうち1種または2種以上を
含み、また必要に応じ呈色剤として金属酸化物または水
酸化物を含むセラミックスクリーンシートに高融点金属
粉末ペーストで配線を施し、前焼成として、150〜3
50℃で酸化焼成を、続いて300〜700℃で水蒸気
酸化焼成を行い、次いで仮焼成として、セラミックス中
の上記焼結助剤の溶融温度以下の温度域でH_2/H_
2O分圧比を0.5〜4.0とした弱還元性雰囲気中で
焼成し、さらに本焼成として、前記焼結助剤の溶融温度
以下の温度域からH_2/H_2O分圧比を5以上とし
た強還元性雰囲気中で焼成することを特徴とする同時焼
成セラミックス配線基板の焼成方法。
(4) Main component is Al_2O_3 and S as a sintering aid.
A ceramic screen sheet containing one or more of iO_2, MgO, and CaO and, if necessary, a metal oxide or hydroxide as a coloring agent, is wired with a high melting point metal powder paste and pre-fired. , 150-3
Oxidation firing was performed at 50°C, followed by steam oxidation firing at 300 to 700°C, and then temporary firing was performed at H_2/H_ in a temperature range below the melting temperature of the above-mentioned sintering aid in the ceramics.
Firing was performed in a weakly reducing atmosphere with a 2O partial pressure ratio of 0.5 to 4.0, and as main firing, the H_2/H_2O partial pressure ratio was set to 5 or more from a temperature range below the melting temperature of the sintering aid. A method for firing a co-fired ceramic wiring board, characterized by firing in a strongly reducing atmosphere.
JP60086943A 1985-04-23 1985-04-23 Method of burning ceramic wire distribution substrate Pending JPS61247658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60086943A JPS61247658A (en) 1985-04-23 1985-04-23 Method of burning ceramic wire distribution substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60086943A JPS61247658A (en) 1985-04-23 1985-04-23 Method of burning ceramic wire distribution substrate

Publications (1)

Publication Number Publication Date
JPS61247658A true JPS61247658A (en) 1986-11-04

Family

ID=13900951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60086943A Pending JPS61247658A (en) 1985-04-23 1985-04-23 Method of burning ceramic wire distribution substrate

Country Status (1)

Country Link
JP (1) JPS61247658A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100199A (en) * 2011-11-09 2013-05-23 Ngk Insulators Ltd Translucent wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100199A (en) * 2011-11-09 2013-05-23 Ngk Insulators Ltd Translucent wiring board

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