JPS61232503A - Sealing material for electric insulation - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrically insulating encapsulating material used for insulating coil portions of small power transformers, motors, ballasts for fluorescent lamps, and the like.

Background technology Conventionally, coil insulation for small power transformers, motors, fluorescent lamp ballasts, etc. has been achieved by compression molding, transfer molding, injection molding using powdered or granular molding materials, or by casting using liquid materials. The former method has excellent productivity, but coil breakage occurs frequently due to high-pressure molding, while the latter method reduces productivity even though there is no need to worry about coil wire breakage due to liquid pressureless molding. There were drawbacks.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide an electrically insulating encapsulating material that is free from coil disconnection and has high productivity.

[Inventor's teachings]

The present invention is an encapsulating material made of an unsaturated polyester resin, a low shrinkage material, a catalyst, an inorganic filler, and if necessary a diluent, a coloring agent, etc., using Merck as part of the inorganic filler. Shoes index is 2 or more and viscosity at 25℃ is 10
This is an electrically insulating encapsulating material that is characterized by less than 0.000 voices, so the encapsulating material can be directly encapsulated into a coil with a case at a low pressure of 5oKq/d 8 degrees, resulting in high productivity and eliminating the worry of coil breakage. With what could be done.

The present invention will now be described in detail.

The unsaturated polyester resin used in the present invention is an ethylenically unsaturated monomer that can be copolymerized into an unsaturated polyester obtained by combining a saturated dicarboxylic acid or its anhydride, or an unsaturated dicarboxylic acid or its anhydride with a dihydric alcohol. It contains a phosphorus compound. Examples of the saturated dicarboxylic acid or anhydride thereof include phthalic anhydride, phthalic acid, isophthalic acid, tetrahydrophthalic acid, tetrahydrophthalic anhydride, entomomethylene detrahydrophthalic anhydride,
Adipic acid, etc., and unsaturated dicarboxylic acids or their anhydrides include maleic anhydride, maleic acid, fumaric acid,
Itaconic acid, citraconic acid, etc., and dihydric alcohols include ethylene glycol, phlopylene gellicol,
Diethylene glycol, neopentyl glycol, 1.
Examples include 3-butylene gellicol, which can also be used in combination with a small amount of polyhydric alcohol such as glycerol trimethylolpropane. Further, as copolymerizable ethylenically unsaturated monomer compounds, styrene, methylstyrene, dimylstyrene, vinyltoluene, divinylbenzene, dichlorostyrene, methyl acrylate, methyl methacrylate, etc. are used. Inorganic fillers include calcium carbonate, silica, alumina, clay, glass powder,
Magnesium carbonate, calcium silicate, antimony trioxide, barium sulfate, etc. can be used, but it is necessary to use Merck in combination. The amount of Merck is preferably 2 to 100 parts by weight per 100 parts by weight of the resin (hereinafter referred to as Oboroni parts) from the viewpoint of viscosity and Chikutsu index. Here, the thixotropic index refers to the ratio of the viscosity at one rotation to the viscosity at zero rotation using a rotational viscometer, and the larger the ratio, the greater the thixotropy. It shows. As the low shrinkage material, polystyrene, polyethylene, polypropylene, saturated polyester, etc. can be used. However, it is necessary for the electrically insulating encapsulating material of the present invention to have a viscosity of 10,000 poise or less at 25°C. That is, if the toooo voice is exceeded, the sealing pressure becomes large, causing the coil to break. Further, it is necessary that the encapsulation material has a dexterity index of 2 or more. That is, if the thixotropic index is less than 2, when the coil is directly encapsulated into a rattan coil with a case, material leakage from the case gap, a so-called sagging phenomenon, becomes large, causing material loss and difficulty in finishing. The present invention will be specifically described below based on examples.

Examples 1 and 2 and Conventional Examples 1 and 2 After compounding and mixing the materials according to the recipe table in Table 1, degassing was performed to obtain the materials, and for example 11C, the material was sealed into a coil with a case using a sealing machine at a pressure of 20 K9/ In Example 2, the coils were sealed with a sealing pressure of 45 Kq/d using a sealing machine, and in Conventional Example 1 and b, the materials were cast and then heated and hardened to obtain coil-filled products. Regarding conventional example 2, polyester resin molding material CE 3010 manufactured by Matsushita Electric Works Co., Ltd.
A coil-filled product was obtained by injection molding.

Fa1 Table Section [Effects of the Invention] As is clear from Table 2, the performance of the coil encapsulated products of Examples 1 and 2 and Conventional Examples 1 and 2 is as follows. It was confirmed that the present invention is superior.

Claims (2)

[Claims] (1) In an encapsulating material made of unsaturated polyester resin, a low shrinkage material, a catalyst, an inorganic filler, and if necessary a diluent, a coloring agent, etc., talc is used as part of the inorganic filler, and thixotropic Index is 2 or more and viscosity at 25°C is 100
1. An electrically insulating encapsulating material characterized by having a poise of 00 poise or less. (2) The amount of talc is 2 to 100 parts by weight per 100 parts by weight of resin.
The electrically insulating encapsulating material according to claim 1, characterized in that it is parts by weight.