JPS612288B2 - - Google Patents
Info
- Publication number
- JPS612288B2 JPS612288B2 JP13964779A JP13964779A JPS612288B2 JP S612288 B2 JPS612288 B2 JP S612288B2 JP 13964779 A JP13964779 A JP 13964779A JP 13964779 A JP13964779 A JP 13964779A JP S612288 B2 JPS612288 B2 JP S612288B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13964779A JPS5664446A (en) | 1979-10-29 | 1979-10-29 | Method of molding synthetic resin insert for metal terminal, metal terminal and mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13964779A JPS5664446A (en) | 1979-10-29 | 1979-10-29 | Method of molding synthetic resin insert for metal terminal, metal terminal and mold |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5664446A JPS5664446A (en) | 1981-06-01 |
JPS612288B2 true JPS612288B2 (US20030199744A1-20031023-C00003.png) | 1986-01-23 |
Family
ID=15250137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13964779A Granted JPS5664446A (en) | 1979-10-29 | 1979-10-29 | Method of molding synthetic resin insert for metal terminal, metal terminal and mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5664446A (US20030199744A1-20031023-C00003.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0530456Y2 (US20030199744A1-20031023-C00003.png) * | 1987-02-04 | 1993-08-04 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59204245A (ja) * | 1983-05-06 | 1984-11-19 | Mitsubishi Electric Corp | 半導体装置の樹脂封止方法 |
JPH0638435B2 (ja) * | 1984-09-07 | 1994-05-18 | 株式会社東芝 | 半導体モ−ルド方法 |
JPS60220922A (ja) * | 1985-04-01 | 1985-11-05 | 日立エーアイシー株式会社 | チツプ型コンデンサ |
-
1979
- 1979-10-29 JP JP13964779A patent/JPS5664446A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0530456Y2 (US20030199744A1-20031023-C00003.png) * | 1987-02-04 | 1993-08-04 |
Also Published As
Publication number | Publication date |
---|---|
JPS5664446A (en) | 1981-06-01 |