JPS6121169Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to an automatic soldering device that allows a carrier on which a printed circuit board is mounted to not only be raised and lowered, but also tilted forward and backward, and in which the distance for raising and lowering is as short as possible. be.

When performing soldering while transporting a carrier with a printed circuit board on it using a transport chain, the carrier is lowered diagonally, then moved horizontally to perform flux application, soldering, cleaning, etc., and then raised diagonally. Efforts are being made to restore it to its original level. In this case, conventional methods have been to form an inclined part in the transport rail, to cut out the transport rail at the solder bath, and to provide a movable rail that descends and rises in this notched part, or to use an auxiliary rail. There is.

In addition, some automatic soldering devices of the arm rotation type have an arm provided radially from the center that can be moved up and down, and a carrier is integrally attached to the tip of this arm. In this type of soldering device, the arm is rotated, the carrier is independently stopped at a position corresponding to the required device, and the carrier attached to the arm and the movable rail that guides the carrier are simultaneously moved up and down. was being carried out.

However, such conventional automatic soldering equipment using a conveyor chain is large and has a complicated mechanism, and automatic soldering equipment with rotating arms does not have the same amount of time required for each process. If the process ends early, there will be a waiting time due to the stoppage, making continuous operation impossible, and if the process passes through a preheating treatment device, the heating time due to the stoppage will be too long, which may adversely affect the printed circuit board. There were flaws.

This invention was made to eliminate the above-mentioned drawbacks. This idea will be explained below.

Figures 1 to 6 show an embodiment of this invention. Figure 1 is a plan view, Figure 2 is a schematic side view taken in the direction of arrow A in Figure 1, and Figure 3 is the same view as in Figure 1. Details of the carrier are shown in FIGS. 4 to 6, which are side views showing enlarged main parts.

In FIGS. 1 to 3, reference numeral 1 indicates a rotation shaft, and reference numeral 2 indicates arms attached radially from the periphery of the rotation shaft 1. As an example, eight arms are attached. 3
is attached to the tip of the carrier arm 2 for automatic soldering, and allows the carrier body 4 not only to move up and down, but also to swing back and forth. 5,
Reference numeral 6 denotes a front wheel and a rear wheel mounted on the upper surface of the carrier body 4 facing upward, and are provided at positions where the wheels run on the same circumference. Reference numeral 7 denotes a holder for mounting the printed circuit board 8 on the carrier 3. 9 is a flux coating device, 10 is a heat radiation type preheating device incorporating a sheathed heater, etc., 11 is a soldering device, 12
1 is the flux application device 9, 13 is a base provided in the soldering device 11 so as to cover the upper part of the carrier body 4 through which the front wheels 5 and rear wheels 6 pass, and 14 and 15 are the bases. 12, 16 and 17 are air cylinders provided on the upper surface of each of the bases 13, each having rods 18 to 21 that move up and down, and whose lower ends protrude below the bases 12 and 13 to form a guide plate 22. ~25 are fixed. Note that 14a to 17a push down the rods 18 to 21, so 14b to 17a push down the rods 18 to 21.
Reference numeral 17b denotes an air inlet for introducing pressurized air into the air cylinders 14-17 in order to pull the rods 18-21 upward. 26 is the foamed flux layer of the flux coating device 9, and 27 is the solder melt of the soldering device 11.

Fig. 4 is a plan view showing the configuration of the carrier, Fig. 5 is a sectional view taken along line B-B in Fig. 4, and Fig. 6 is a plan view showing the configuration of the carrier.
It is a sectional view taken along line CC in the figure. In these figures, the same reference numerals as in FIGS. 1 to 3 indicate the same parts, 31 is the base plate of the carrier 3, and the arm 2
installed on. 32 is a guide shaft, and the board 3
1 and is fixed to bearings 33 and 34 that are integrally attached to the same. 35 is a movable body that moves up and down guided by the guide shaft 32; 36 is a mounting plate formed integrally with the movable body 35; 37 is a bolt;
Further, thrust bearings 38 and 39 for smooth rotation of the carrier body 4 are sandwiched between the outside and inside of the carrier body 4, and after being inserted together with the carrier body 4, the entire body is tightened with a nut 40. 41 is located on the upper left and right sides of the bearing 33;
are locking pieces provided on the lower left and right sides of the movable body 35,
A tension spring 43 is stretched between the corresponding two members so as to pull the movable body 35 upward. 44 is a strip integrated with the mounting plate 36; 45 and 46 are end portions 44a of the strip 44;
A locking piece is provided on the upper surface of the carrier body 4 at a position corresponding to 44b, and is stretched between end portions 44a and 44b by return springs 47 and 48, respectively.

With the above configuration, the carrier 3 is always pulled upward by the tension spring 43, but if a downward force is applied to the carrier 3, the tension spring 43 is expanded and the carrier 3 becomes movable downward. Also, bolt 37
Although it is rotatably supported around the center, it is normally kept horizontal by return springs 47 and 48.

Next, the operation will be explained. By driving the rotating shaft 1 and rotating the arm 2 in a counterclockwise direction, the carrier 3 is made to run, and the printed circuit board 8 is attached to the carrier 3 by its holder 7. When the carrier main body 4 enters the lower part of the guide plate 22 while running, and the front wheels 5 and rear wheels 6 run on the lower surface of the guide plates 22 and 23, the rods 18 and 19 are moved by the pressurized air introduced from the air inlets 14a and 15a. Since they are pressed down at the same time, they descend horizontally, and the printed circuit board 8 is coated with flux by the foamed flux layer 26 of the flux coating device 9. After applying the flux, the front wheels 5 and rear wheels 9 rise horizontally as the rods 18 and 19 are pulled up by the pressurized air introduced from the air inlets 14b and 15b, and then proceed to the preheating device 10. The preheating device 10 heats and dries the material, and the soldering device 11 performs soldering.

Next, the operations of the carrier 3 and carrier body 4 when this flux application is performed are shown in FIGS. 7 to 9.
This will be explained with a diagram.

FIG. 7 is an explanatory diagram of the operation of the carrier main body 4 when soldering is performed, and FIGS. 8 and 9 are explanatory diagrams of the operation of the carrier when the operation of FIG. 7 is performed.

In FIG. 7a, the front wheel 5 travels on the lower surface of the guide plate 22 and then reaches the rear end 23a of the guide plate 23 located at the position indicated by the two-dot chain line.
4 reaches the rear wheel 24a. Next, air inlet 16
Pressurized air is introduced into the air cylinder 16 from the air cylinder 16 and the rod 20 is pushed down, so that the guide plate 24 is lowered as shown in FIG. At this time, the carrier body 4 is tilted around the bolt 37 to the position shown by the solid line in FIG. 9, and the movable body 35 is also guided by the guide shaft 32 and lowered. In this way, the printed circuit board 8 descends obliquely and begins to be immersed in the solder melt 27.

Next, as shown in FIG. 7b, the air inlet 17a
Pressurized air is introduced into the air cylinder 17 from
Since the rod 21 is pushed down, the guide plate 25 is lowered and the printed circuit board 8 is also lowered.

Next, as shown in FIG. 7c, the guide plates 24, 2
5 is lowered to the lower end, the carrier body 4 is in a horizontal state, and the movable body 35 is in the lowered position as shown by the two-dot chain line in FIG. At this time, the printed circuit board 8 is immersed in the solder melt 27 and soldered.

Next, as shown in FIG. 7d, when the front wheel 5 reaches the front part 24b of the guide plate 24, the air inlet 16b
Since the rod 20 is pulled up by the pressurized air introduced from the guide plate 24, the guide plate 24 rises. and,
As the movable body 35 rises due to the restoring force of the tension spring 43, the carrier body 4 rises while tilting. Thereafter, when the rear wheel 6 reaches the front portion 25b of the guide plate 25, the rod 21 is pulled up by pressurized air introduced from the air inlet 17b, and the guide plate 25 rises. At this time, the printed circuit board 8 is pulled up from the solder melt 27.

Next, as shown in FIG. 7e, the front wheel 5, the rear wheel 6
Since the carrier body 4 also travels on the horizontal guide plates 24 and 25, the carrier body 4 becomes horizontal as shown in FIG. 5, and the movable body 35 also returns to its initial position. Here, worker M is soldering the printed circuit board 8.
The process of removing the printed circuit board 8 and immediately mounting the untreated printed circuit board 8 is repeated in sequence.

As explained in detail above, this invention allows the carriers, each of which has a printed circuit board attached to the end of a radially mounted arm that rotates continuously, to be movable up and down, suspended by a tension spring, and tiltable. It is installed so that it can be returned horizontally using a return spring, and on the other hand, among the flux application equipment, preheating equipment, and soldering equipment arranged along the rotation path where the carrier goes around, the flux application equipment and the soldering equipment are placed in front of the carrier. A means for pushing down the carrier is provided separately on the side and rear sides, and a guide plate for pushing down the carrier while rotating the carrier is attached to each rod of the cylinder, so the carrier can be lowered horizontally or Since the carrier can be lowered while tilting, then moved horizontally, and then raised at an inclination opposite to the above-mentioned inclination, the carrier can perform flux application, preheating, and soldering automatically while making continuous orbits. Since it can be performed continuously, productivity can be significantly increased. Further, the preheating is not performed for an unnecessarily long time, and the printed circuit board is not damaged by heat. Furthermore, in the past, it was necessary to use an immersion type soldering bath for the primary soldering and a jet type soldering bath for the secondary soldering after cutting the lead wires, but with this invention, an immersion type soldering bath was required for the secondary soldering after cutting the lead wires. Since primary and secondary soldering can be performed, it can be formed into an extremely small size.
It also has the advantage of being economical.

[Brief explanation of the drawing]

Figures 1 to 6 show an embodiment of this invention. Figure 1 is a plan view of a rotating arm type automatic soldering device, and Figure 2 is a schematic side view taken in the direction of arrow A in Figure 1. 3 is an enlarged side view of the main part of FIG. 1, and FIG. 4 is a plan view showing the configuration of the carrier.
5 is a sectional view taken along the line B-B in FIG. 4, FIG. 6 is a sectional view taken along the line C-C in FIG. 4, and FIG. 7 is an explanatory diagram of the operation of the carrier body during flux application.
FIGS. 8 and 9 are explanatory diagrams of the operation of the carrier when the operation of FIG. 7 is performed. In the figure, 1 is the rotation axis, 2 is the arm, 3 is the carrier, 4 is the carrier body, 5 is the front wheel, 6 is the rear wheel, 7
8 is a holder, 8 is a printed circuit board, 9 is a flux coating device, 10 is a preheating device, 11 is a soldering device, 12 and 13 are bases, 14 to 17 are air cylinders, 14a to 17a, 14b to 17b are air Inlet port, 18 to 21 are rods, 22 to 25 are guide plates, 26 is a foamed flux tank, 27 is solder melt, 31 is a board, 32 is a guide shaft, 33 and 34 are bearings, 35 is a movable body, and 36 is a A mounting plate, 37 is a bolt, 38, 39 are thrust bearings, 40 is a nut, 41, 42, 45, 46 are locking pieces, 43 is a tension spring, 44 is a strip, and 47, 48 are return springs.

Claims (1)

[Scope of utility model registration request] Install multiple arms that rotate radially,
The carrier, on which the printed circuit board to be soldered is attached to the tip of each of these arms, is suspended by tension springs at multiple locations inside the carrier, and the intermediate portion thereof is pivotably supported by a shaft perpendicular to the direction of travel of the carrier. , a pair of return springs are installed to return the carrier horizontally, a front wheel and a rear wheel are provided inside the upper surface of the carrier, and a flux coating device, a preheating device, and a soldering device are installed along the rotational stroke of the carrier. Further, the flux application device and the soldering device are each provided with push-down means for pushing down the front wheel of the carrier from above to below, and push-down means for pushing down the rear wheel from above from above. Automatic soldering equipment.