JPS61207077U - - Google Patents

Info

Publication number

JPS61207077U

JPS61207077U JP9167285U JP9167285U JPS61207077U JP S61207077 U JPS61207077 U JP S61207077U JP 9167285 U JP9167285 U JP 9167285U JP 9167285 U JP9167285 U JP 9167285U JP S61207077 U JPS61207077 U JP S61207077U

Authority

JP

Japan

Prior art keywords

insertion hole

component insertion

copper foil

solder resist

insulating substrate

Prior art date

1985-06-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 230000037431 insertion Effects 0.000 claims description 5
• 238000003780 insertion Methods 0.000 claims description 5
• 239000011889 copper foil Substances 0.000 claims description 4
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims 2
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1

Cited By (1)