JPS61207068U - - Google Patents
Info
- Publication number
- JPS61207068U JPS61207068U JP9055985U JP9055985U JPS61207068U JP S61207068 U JPS61207068 U JP S61207068U JP 9055985 U JP9055985 U JP 9055985U JP 9055985 U JP9055985 U JP 9055985U JP S61207068 U JPS61207068 U JP S61207068U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- hybrid
- conductive adhesive
- bonded
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000000605 extraction Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9055985U JPS61207068U (zh) | 1985-06-14 | 1985-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9055985U JPS61207068U (zh) | 1985-06-14 | 1985-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61207068U true JPS61207068U (zh) | 1986-12-27 |
Family
ID=30645661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9055985U Pending JPS61207068U (zh) | 1985-06-14 | 1985-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61207068U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577967U (ja) * | 1992-03-25 | 1993-10-22 | ティーディーケイ株式会社 | 配線基板 |
-
1985
- 1985-06-14 JP JP9055985U patent/JPS61207068U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0577967U (ja) * | 1992-03-25 | 1993-10-22 | ティーディーケイ株式会社 | 配線基板 |