JPS61207039U - - Google Patents
Info
- Publication number
- JPS61207039U JPS61207039U JP9174685U JP9174685U JPS61207039U JP S61207039 U JPS61207039 U JP S61207039U JP 9174685 U JP9174685 U JP 9174685U JP 9174685 U JP9174685 U JP 9174685U JP S61207039 U JPS61207039 U JP S61207039U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling fan
- box
- frame
- ventilation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 7
Landscapes
- Stand-By Power Supply Arrangements (AREA)
Description
第１図は本考案の実施例の半導体装置の通風冷
却装置の部分断面とした正面図、第２図は第１図
の―矢視側面断面図、第３図は第１図の平面
図、第４図は無停電電源装置の背面正面図、第５
図は第４図の側面板を開いた側面図、第６図は第
５図の―矢視平面図、第７図は従来の半導体
装置の通風冷却装置の部分断面とした正面図、第
８図は第７図の―矢視側面断面図、第９図は
従来の他の通風冷却装置の部分断面とした正面図
である。
１：箱体、２：半導体装置、７：通風口、９：
冷却フアン、１０：風胴、１１：ボルト、１２：
共締めボルト、２１：半導体素子、２２：共通冷
却体、２５：カバー、１０１：ガイド突起。
FIG. 1 is a partially sectional front view of a ventilation cooling device for a semiconductor device according to an embodiment of the present invention, FIG. 2 is a side sectional view taken in the direction of the - arrow in FIG. 1, and FIG. Figure 4 is a rear front view of the uninterruptible power supply;
The figure is a side view with the side plate of FIG. 4 opened, FIG. 6 is a plan view taken in the direction of the - arrow of FIG. 5, FIG. The figure is a side sectional view taken in the direction of the - arrow in FIG. 7, and FIG. 9 is a partially sectional front view of another conventional ventilation cooling device. 1: Box body, 2: Semiconductor device, 7: Ventilation opening, 9:
Cooling fan, 10: Wind barrel, 11: Bolt, 12:
Co-tightening bolt, 21: semiconductor element, 22: common cooling body, 25: cover, 101: guide protrusion.
Claims (1)
導体素子の共通冷却体のフイン部をカバーで覆つ
て風道を形成し、該冷却体の一方端を風胴と冷却
フアンとを介して箱体の通風口にのぞませるよう
にした箱体収納の半導体装置において、前記冷却
フアンを前記箱体の通風口にのぞませてこの冷却
フアンの枠体に設けた一部の取付穴を用いて直接
この箱体に固定するとともに、前記風胴を前記冷
却フアンの枠体を介して、残りの取付穴によつて
前記箱体に前記冷却フアンの枠体と共締めにして
取付けてなることを特徴とする半導体装置の通風
冷却装置。 (2) 実用新案登録請求の範囲第１項記載のもの
において、風胴が冷却フアンの枠体に係合する位
置決めガイド突起を備えたものである半導体装置
の通風冷却装置。[Scope of Claim for Utility Model Registration] (1) The fins of a common cooling body for semiconductor devices provided with fins that guide cooling air horizontally are covered with a cover to form an air passage, and one end of the cooling body is In a semiconductor device housed in a box that looks into the ventilation hole of the box body through the body and the cooling fan, the cooling fan is made to look into the ventilation hole of the box body and is connected to the frame of the cooling fan. The air cylinder is directly fixed to the box using some of the provided mounting holes, and the wind cylinder is attached to the cooling fan frame through the remaining mounting holes. A ventilation cooling device for a semiconductor device, characterized in that the device is mounted by being fastened together with the device. (2) A ventilation cooling device for a semiconductor device according to claim 1 of the utility model registration claim, wherein the wind cylinder is provided with a positioning guide protrusion that engages with the frame of a cooling fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9174685U JPH0322922Y2 (en) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9174685U JPH0322922Y2 (en) | 1985-06-18 | 1985-06-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61207039U true JPS61207039U (en) | 1986-12-27 |
| JPH0322922Y2 JPH0322922Y2 (en) | 1991-05-20 |
Family
ID=30647907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9174685U Expired JPH0322922Y2 (en) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322922Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182411A (en) * | 2011-02-28 | 2012-09-20 | Nakamura Mfg Co Ltd | Heat generating body cooling device and heat generating body cooling method |
| WO2013054687A1 (en) * | 2011-10-13 | 2013-04-18 | 三洋電機株式会社 | Indoor power storage device, and display system |
-
1985
- 1985-06-18 JP JP9174685U patent/JPH0322922Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182411A (en) * | 2011-02-28 | 2012-09-20 | Nakamura Mfg Co Ltd | Heat generating body cooling device and heat generating body cooling method |
| WO2013054687A1 (en) * | 2011-10-13 | 2013-04-18 | 三洋電機株式会社 | Indoor power storage device, and display system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0322922Y2 (en) | 1991-05-20 |
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