JPS61207038U - - Google Patents
Info
- Publication number
- JPS61207038U JPS61207038U JP1985090600U JP9060085U JPS61207038U JP S61207038 U JPS61207038 U JP S61207038U JP 1985090600 U JP1985090600 U JP 1985090600U JP 9060085 U JP9060085 U JP 9060085U JP S61207038 U JPS61207038 U JP S61207038U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting structure
- soldered
- metal plate
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/30—
-
- H10W72/381—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090600U JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985090600U JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61207038U true JPS61207038U (cg-RX-API-DMAC10.html) | 1986-12-27 |
| JPH0739233Y2 JPH0739233Y2 (ja) | 1995-09-06 |
Family
ID=30645738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985090600U Expired - Lifetime JPH0739233Y2 (ja) | 1985-06-14 | 1985-06-14 | 半導体装置の取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739233Y2 (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328087A (ja) * | 1999-03-24 | 2005-11-24 | Mitsubishi Materials Corp | パワーモジュール用基板 |
| JP2008277654A (ja) * | 2007-05-02 | 2008-11-13 | Mitsubishi Materials Corp | ヒートシンク付パワーモジュール用基板及びパワーモジュール |
| JP2023065628A (ja) * | 2019-03-08 | 2023-05-12 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168135U (ja) * | 1982-05-06 | 1983-11-09 | 富士電機株式会社 | 半導体装置 |
| JPS59175131A (ja) * | 1983-03-24 | 1984-10-03 | Fuji Electric Co Ltd | 混成集積回路 |
-
1985
- 1985-06-14 JP JP1985090600U patent/JPH0739233Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58168135U (ja) * | 1982-05-06 | 1983-11-09 | 富士電機株式会社 | 半導体装置 |
| JPS59175131A (ja) * | 1983-03-24 | 1984-10-03 | Fuji Electric Co Ltd | 混成集積回路 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005328087A (ja) * | 1999-03-24 | 2005-11-24 | Mitsubishi Materials Corp | パワーモジュール用基板 |
| JP2008277654A (ja) * | 2007-05-02 | 2008-11-13 | Mitsubishi Materials Corp | ヒートシンク付パワーモジュール用基板及びパワーモジュール |
| JP2023065628A (ja) * | 2019-03-08 | 2023-05-12 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板及びパワーモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739233Y2 (ja) | 1995-09-06 |