JPS61201824U - - Google Patents
Info
- Publication number
- JPS61201824U JPS61201824U JP8532185U JP8532185U JPS61201824U JP S61201824 U JPS61201824 U JP S61201824U JP 8532185 U JP8532185 U JP 8532185U JP 8532185 U JP8532185 U JP 8532185U JP S61201824 U JPS61201824 U JP S61201824U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molded
- warm stamping
- molding device
- stamping molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は本考案の第１の実施例の要部断面図、
第２図はその温間スタンピング成形時における要
部断面図、第３図は被成形材の部分縦断面図、第
４図は第１の実施例を用いて製造したルーフヘツ
トライニングの平面図、第５図は第４図に示す線
Ｖ―Ｖに沿う断面図、第６図は本考案の第２の実
施例の要部縦断面図、第７図は第２の実施例の下
型の平面図である。
２，３２……上型、４，３４……下型、６，３
６，３７……保温材、１０……被成形材、１２…
…基材、１４……表皮材。
FIG. 1 is a sectional view of the main parts of the first embodiment of the present invention,
FIG. 2 is a sectional view of the main part during warm stamping molding, FIG. 3 is a partial longitudinal sectional view of the material to be formed, and FIG. 4 is a plan view of the roof head lining manufactured using the first embodiment. 5 is a sectional view taken along the line V-V shown in FIG. 4, FIG. 6 is a vertical sectional view of main parts of the second embodiment of the present invention, and FIG. 7 is a sectional view of the lower mold of the second embodiment. FIG. 2, 32... Upper mold, 4, 34... Lower mold, 6, 3
6, 37... heat insulating material, 10... material to be formed, 12...
...Base material, 14...Skin material.
Claims (1)
タンピング成形する温間スタンピング成形装置に
おいて、成形用型の温間スタンピング面に被成形
材と成形用型間の熱伝導を阻止するための保温材
を取り付けたことを特徴とする温間スタンピング
成形装置。 In a warm stamping molding device that warmly stamps a low heat capacity material as a material to be molded using a mold, a mold is installed on the warm stamping surface of the mold to prevent heat conduction between the material to be molded and the mold. A warm stamping molding device characterized by being equipped with a heat insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8532185U JPS61201824U (en) | 1985-06-06 | 1985-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8532185U JPS61201824U (en) | 1985-06-06 | 1985-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61201824U true JPS61201824U (en) | 1986-12-18 |
Family
ID=30635610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8532185U Pending JPS61201824U (en) | 1985-06-06 | 1985-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61201824U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152110A (en) * | 1990-10-16 | 1992-05-26 | Taiho Kogyo Kk | Cavity for molding synthetic resin and its manufacture |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533761B2 (en) * | 1976-04-06 | 1980-09-02 |
-
1985
- 1985-06-06 JP JP8532185U patent/JPS61201824U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533761B2 (en) * | 1976-04-06 | 1980-09-02 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04152110A (en) * | 1990-10-16 | 1992-05-26 | Taiho Kogyo Kk | Cavity for molding synthetic resin and its manufacture |