JPS61200518U - - Google Patents

Info

Publication number
JPS61200518U
JPS61200518U JP8538785U JP8538785U JPS61200518U JP S61200518 U JPS61200518 U JP S61200518U JP 8538785 U JP8538785 U JP 8538785U JP 8538785 U JP8538785 U JP 8538785U JP S61200518 U JPS61200518 U JP S61200518U
Authority
JP
Japan
Prior art keywords
control panel
metal frame
copper pipes
panel
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8538785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8538785U priority Critical patent/JPS61200518U/ja
Publication of JPS61200518U publication Critical patent/JPS61200518U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Floor Finish (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は平面図、第２図、第３図は要部拡大斜
視図、第４図は取付け状態を示す斜視図、第５図
はＡ―Ａ線断面図、第６図はシステム図、第７図
、第８図、第９図は銅パイプの斜視図、第１０図
はラバーチツプの斜視図、第１１図、第１２図は
床暖房用パネルの平面図、第１３図、第１４図は
パネルの配列例を示す平面図、第１５図は温度分
布を説明する平面図である。 １……床暖房用パネル、２……コンパネ、３…
…銅パイプ、６……ラバーチツプ層。 Figure 1 is a plan view, Figures 2 and 3 are enlarged perspective views of main parts, Figure 4 is a perspective view showing the installed state, Figure 5 is a sectional view taken along line A-A, Figure 6 is a system diagram, Figures 7, 8 and 9 are perspective views of copper pipes, Figure 10 is a perspective view of rubber chips, Figures 11 and 12 are plan views of underfloor heating panels, Figures 13 and 14. 15 is a plan view showing an example of panel arrangement, and FIG. 15 is a plan view illustrating temperature distribution. 1... Floor heating panel, 2... Control panel, 3...
...Copper pipe, 6...Rubber chip layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] コンパネあるいは金属製枠体の上面に銅パイプ
を蛇行状に敷設すると共に、当該コンパネあるい
は金属製枠体の上面に上記銅パイプを埋め込んだ
状態でラバーチツプ層を形成したことを特徴とす
る床暖房用パネル。 For floor heating, characterized in that copper pipes are laid in a meandering manner on the upper surface of a control panel or metal frame, and a rubber chip layer is formed with the copper pipes embedded in the upper surface of the control panel or metal frame. panel.
JP8538785U 1985-06-05 1985-06-05 Pending JPS61200518U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8538785U JPS61200518U (en) 1985-06-05 1985-06-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8538785U JPS61200518U (en) 1985-06-05 1985-06-05

Publications (1)

Publication Number Publication Date
JPS61200518U true JPS61200518U (en) 1986-12-16

Family

ID=30635736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8538785U Pending JPS61200518U (en) 1985-06-05 1985-06-05

Country Status (1)

Country Link
JP (1) JPS61200518U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100695474B1 (en) 2005-05-21 2007-03-15 현대건설주식회사 Double floor structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057135A (en) * 1983-09-06 1985-04-02 Ichiro Tagashira Manufacturing process of heating panel

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057135A (en) * 1983-09-06 1985-04-02 Ichiro Tagashira Manufacturing process of heating panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100695474B1 (en) 2005-05-21 2007-03-15 현대건설주식회사 Double floor structure

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