JPS61197701U - - Google Patents
Info
- Publication number
- JPS61197701U JPS61197701U JP8008985U JP8008985U JPS61197701U JP S61197701 U JPS61197701 U JP S61197701U JP 8008985 U JP8008985 U JP 8008985U JP 8008985 U JP8008985 U JP 8008985U JP S61197701 U JPS61197701 U JP S61197701U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- microstrip line
- dielectric substrate
- microwave component
- connection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8008985U JPS61197701U (da) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8008985U JPS61197701U (da) | 1985-05-30 | 1985-05-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61197701U true JPS61197701U (da) | 1986-12-10 |
Family
ID=30625611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8008985U Pending JPS61197701U (da) | 1985-05-30 | 1985-05-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61197701U (da) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089935A (ja) * | 2010-10-15 | 2012-05-10 | Nec Engineering Ltd | 高周波モジュール接続構造 |
JP2015176980A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 高周波パッケージ、高周波ユニット及び高周波ユニットの製造方法 |
WO2023243157A1 (ja) * | 2022-06-16 | 2023-12-21 | 日本メクトロン株式会社 | 接合プリント配線板および接合プリント配線板の製造方法 |
-
1985
- 1985-05-30 JP JP8008985U patent/JPS61197701U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012089935A (ja) * | 2010-10-15 | 2012-05-10 | Nec Engineering Ltd | 高周波モジュール接続構造 |
JP2015176980A (ja) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | 高周波パッケージ、高周波ユニット及び高周波ユニットの製造方法 |
WO2023243157A1 (ja) * | 2022-06-16 | 2023-12-21 | 日本メクトロン株式会社 | 接合プリント配線板および接合プリント配線板の製造方法 |