JPS61195863U - - Google Patents
Info
- Publication number
- JPS61195863U JPS61195863U JP8015685U JP8015685U JPS61195863U JP S61195863 U JPS61195863 U JP S61195863U JP 8015685 U JP8015685 U JP 8015685U JP 8015685 U JP8015685 U JP 8015685U JP S61195863 U JPS61195863 U JP S61195863U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- section
- cooling
- warp
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015685U JPS61195863U (enExample) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015685U JPS61195863U (enExample) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195863U true JPS61195863U (enExample) | 1986-12-06 |
Family
ID=30625740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015685U Pending JPS61195863U (enExample) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195863U (enExample) |
-
1985
- 1985-05-30 JP JP8015685U patent/JPS61195863U/ja active Pending